公开(公告)号：US06385384B1

公开(公告)日：2002-05-07

申请号：US09268768

申请日：1999-03-15

申请人： Huailiang Wei

发明人： Huailiang Wei

IPC分类号： G02B600

CPC分类号： C03C3/06 ,  C03B37/01433 ,  C03B2201/10 ,  C03B2201/12 ,  C03B2201/28 ,  C03B2201/30 ,  C03B2201/31 ,  C03B2201/34 ,  C03B2201/36 ,  C03B2201/50 ,  C03B2201/54 ,  C03C23/0095 ,  C03C2201/12 ,  C03C2201/31 ,  C03C2201/34 ,  C03C2203/50

摘要： A non-porous, transparent glass-ceramic body that is consolidated from a predominately silica-based preform (SiO2+GeO2 85-99.0 wt. %) containing rare earth fluoride crystals embedded within by solution chemistry. The glass ceramic body is suited for making fibers for optical amplifiers.

摘要翻译： 一种无孔，透明的玻璃陶瓷体，其主要由含有稀土氟化物晶体的硅基预制体（SiO 2 + GeO 2 85-99.0重量％）固结，其中通过溶液化学方式嵌入。 玻璃陶瓷体适用于制造光放大器的光纤。

公开(公告)号：US06363746B1

公开(公告)日：2002-04-02

申请号：US09525409

申请日：2000-03-15

申请人： Huailiang Wei ,  Lisa A. Moore ,  Jeffery L. Blackwell ,  Daniel W. Hawtof

发明人： Huailiang Wei ,  Lisa A. Moore ,  Jeffery L. Blackwell ,  Daniel W. Hawtof

IPC分类号： C03B1906

CPC分类号： C03B37/0142 ,  C03B2201/32 ,  C03B2201/36 ,  C03B2201/50 ,  C03B2201/54 ,  C03B2207/06 ,  C03B2207/12 ,  C03B2207/14 ,  C03B2207/20 ,  C03B2207/34 ,  C03B2207/46

摘要： An apparatus for producing the glass soot used in the formation of optical fiber includes a burner with an internal atomizer. The atomizer includes an outer tube having a nozzle at an end thereof, and an inner tube located within the outer tube and having a closed end restricting fluid flow therethrough and defining a cylindrical sidewall having radially extending apertures spaced there along. The outer tube receives the glass-forming mixture in liquid form and the inner tube receives an atomizing gas which flows through the apertures in the sidewall of the inner tube and atomizes the glass-forming mixture as the glass-forming mixture travels through the outer tube.

摘要翻译： 用于生产用于形成光纤的玻璃烟灰的设备包括具有内部雾化器的燃烧器。 雾化器包括在其一端具有喷嘴的外管和位于外管内的内管，并且具有限制流过其中的流体流动的封闭端，并限定具有沿其间隔开的径向延伸的孔的圆柱形侧壁。 外管容纳液体形式的玻璃形成混合物，并且内管接收流过内管侧壁中的孔的雾化气体，并且当玻璃形成混合物通过外管时雾化玻璃形成混合物 。

公开(公告)号：US08963310B2

公开(公告)日：2015-02-24

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

摘要翻译： 微电子组件包括衬底，第一和第二微电子元件，引线指，在第二微电子元件的触点和引线指之间延伸的电连接，以及覆盖第一和第二微电子元件的至少一部分的引线指 和电气连接。 基板在第一表面具有接触，在相对的第二表面具有与基板触点电连接的端子。 第一微电子元件在其前面具有暴露的触点。 第一微电子元件的正面连接到基板触点。 第二微电子元件覆盖第一微电子元件并且在面向背离衬底的前面具有接触。 引线框架具有引线指，其中基板的第二表面和引线指限定用于与微电子组件外部的部件的电互连的公共接口。

公开(公告)号：US08772946B2

公开(公告)日：2014-07-08

申请号：US13492064

申请日：2012-06-08

申请人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

发明人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.

摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。

公开(公告)号：US20130328186A1

公开(公告)日：2013-12-12

申请号：US13492064

申请日：2012-06-08

申请人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

发明人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L23/48 ,  H01L21/28 ,  H01L23/498

CPC分类号： H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.

摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。

公开(公告)号：US20130049179A1

公开(公告)日：2013-02-28

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

公开(公告)号：US06724964B2

公开(公告)日：2004-04-20

申请号：US10058023

申请日：2002-01-29

申请人： Michael Lysiansky ,  Michael Rosenblit ,  Huailiang Wei

发明人： Michael Lysiansky ,  Michael Rosenblit ,  Huailiang Wei

IPC分类号： G02B602

CPC分类号： G02B6/03666 ,  G02B6/02266 ,  G02B6/0228 ,  G02B6/03611 ,  G02B6/03644 ,  G02B6/14 ,  G02B6/29377

摘要： An optical waveguide designed to generate positive dispersion when operated in a high order mode. The optical waveguide in one embodiment is designed to generate positive dispersion slope, in another embodiment to generate negative dispersion slope and in yet another embodiment nominally zero dispersion slope. In one embodiment the high order mode is the LP02 mode and in another embodiment the high order mode is the LP03 mode. In another embodiment the optical waveguide is a few mode fiber. In an exemplary embodiment the optical waveguide is used in combination with a mode transformer, such as a transverse mode transformer to achieve the desired high order mode.

摘要翻译： 设计为在高阶模式下操作时产生正色散的光波导。 一个实施例中的光波导被设计成在另一个实施例中产生正的色散斜率，以产生负色散斜率，而在又一实施例中，标称为零色散斜率。 在一个实施例中，高阶模式是LP02模式，在另一实施例中，高阶模式是LP03模式。 在另一个实施例中，光波导是几种模式光纤。 在示例性实施例中，光波导与诸如横向模式变压器的模式变压器组合使用以实现期望的高阶模式。

公开(公告)号：US08525312B2

公开(公告)日：2013-09-03

申请号：US13208822

申请日：2011-08-12

申请人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

发明人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83

摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.

摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。

公开(公告)号：US20130037925A1

公开(公告)日：2013-02-14

申请号：US13208822

申请日：2011-08-12

申请人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

发明人： Qwai H. Low ,  Chok J. Chia ,  Kishor Desai ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83

摘要： A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.

摘要翻译： 微电子组件可以包括微电子元件和引线框架，引线框架具有覆盖第一单元并与其组装的第一单元和第二单元。 第一单元可以具有包括引线框架的厚度的一部分的第一金属层，并且包括端子和从其延伸的第一导电元件。 第二单元可以具有包括引线框架的厚度的一部分的第二金属层，并且包括接合焊盘和从其延伸的第二导电元件。 第一和第二单元各自可以具有支撑相应的第一和第二导电元件的至少一部分的封装。 至少一些第二导电元件可以覆盖相应的第一导电元件的部分并且可以与其连接。 微电子元件可以具有与引线框架的接合焊盘电连接的触点。

公开(公告)号：US06401494B2

公开(公告)日：2002-06-11

申请号：US09915781

申请日：2001-07-26

申请人： Huailiang Wei

发明人： Huailiang Wei

IPC分类号： C03C1702

CPC分类号： C03C3/06 ,  C03B37/01433 ,  C03B2201/10 ,  C03B2201/12 ,  C03B2201/28 ,  C03B2201/30 ,  C03B2201/31 ,  C03B2201/34 ,  C03B2201/36 ,  C03B2201/50 ,  C03B2201/54 ,  C03C23/0095 ,  C03C2201/12 ,  C03C2201/31 ,  C03C2201/34 ,  C03C2203/50

摘要： A method that provides a new way to embed rare earth fluorides into silicate (or germania-doped silica) glasses by means of solution chemistry. Embedding rare earth fluorides into a silicate (or germania-doped silica) glass comprises the following steps. First, form a porous silicate core preform. Second, submerge the preform into an aqueous solution of rare earth ions. Third, remove the preform from the solution and wash the outside surfaces of the preform. Fourth, submerge the preform into an aqueous solution of a fluorinating agent to precipitate rare earth trifluorides from the solution and deposit in the pores or on the wall of the preform. This is followed by drying.

摘要翻译： 一种通过溶液化学提供将稀土氟化物嵌入硅酸盐（或氧化锗掺杂二氧化硅）玻璃的新方法的方法。 将稀土氟化物嵌入硅酸盐（或掺锗二氧化硅）玻璃中包括以下步骤。 首先，形成多孔硅酸盐芯预制件。 第二，将预成型件浸入稀土离子的水溶液中。 第三，从溶液中取出预型件并洗涤预成型件的外表面。 第四，将预制件浸入氟化剂的水溶液中以从溶液中沉淀出稀土三氟化物，并沉积在预制件的孔或壁上。 然后干燥。