Memory cell configuration and method for its production
    3.
    发明授权
    Memory cell configuration and method for its production 失效
    存储单元配置及其生产方法

    公开(公告)号:US06300652B1

    公开(公告)日:2001-10-09

    申请号:US08755456

    申请日:1996-11-22

    IPC分类号: H01L27108

    摘要: A memory cell configuration and a method for its production include stacked capacitors and use a vertical storage capacitor having a ferroelectric or paraelectric storage dielectric. In order to produce the storage capacitor, a dielectric layer for the storage dielectric is produced over the whole area. The dielectric layer is subsequently structured and first electrodes and second electrodes for the storage capacitors are formed. The invention is suitable for Gbit DRAMs and for nonvolatile memories.

    摘要翻译: 存储单元配置及其制造方法包括堆叠电容器,并且使用具有铁电或顺电存储电介质的垂直存储电容器。 为了制造存储电容器,在整个区域上产生用于存储电介质的电介质层。 随后构造电介质层,形成用于存储电容器的第一电极和第二电极。 本发明适用于Gbit DRAM和非易失性存储器。

    Pyrodetector element having a pyroelectric layer produced by oriented
growth, and method for the fabrication of the element
    4.
    发明授权
    Pyrodetector element having a pyroelectric layer produced by oriented growth, and method for the fabrication of the element 失效
    具有通过定向生长产生的热电层的热电检测元件,以及该元件的制造方法

    公开(公告)号:US5684302A

    公开(公告)日:1997-11-04

    申请号:US581590

    申请日:1996-01-17

    IPC分类号: G01J1/02 G01J5/34 H01L37/02

    CPC分类号: H01L37/02 G01J5/34

    摘要: A novel pyrodetector element is produced by oriented growth, with the aid of buffer layers, above a monocrystalline silicon substrate and thus enables the fabrication of an array of pyrodetectors having read-out and amplifier circuitry integrated on the common substrate. Proposed as the buffer layers are yttrium-stabilized zirconium oxide YSZ or magnesium oxide above an interlayer made of spinel.

    摘要翻译: PCT No.PCT / DE94 / 00785 Sec。 371日期1996年1月16日 102(e)日期1996年1月16日PCT提交1994年7月8日PCT公布。 公开号WO95 / 02904 日期1995年1月26日通过定向生长,借助于缓冲层,在单晶硅衬底之上产生新的热解测试元件,因此能够制造具有集成在公共衬底上的读出和放大器电路的热解探测器阵列。 提出缓冲层是由尖晶石制成的中间层上的钇稳定的氧化锆YSZ或氧化镁。

    Semiconductor detector for infrared radiation and method for
manufacturing same
    5.
    发明授权
    Semiconductor detector for infrared radiation and method for manufacturing same 失效
    用于红外辐射的半导体探测器及其制造方法

    公开(公告)号:US5939722A

    公开(公告)日:1999-08-17

    申请号:US958582

    申请日:1997-10-28

    IPC分类号: G01J5/20 H01L37/02

    摘要: A semiconductor detector for infrared radiation is manufactured by the steps of depositing an auxiliary layer on a main surface of a carrier, depositing a membrane layer provided with at least one opening onto the auxiliary layer, selectively etching the auxiliary layer through the at least one opening of the membrane layer, so that a hollow space arises in the auxiliary layer, sealing the hollow space by depositing a covering on th membrane layer, and fashioning a detector element on the covering by depositing a material sensitive to infrared radiation within a region of the covering that is bounded by the hollow space therebelow.

    摘要翻译: 通过以下步骤制造用于红外辐射的半导体检测器:在辅助层的主表面上沉积辅助层,在辅助层上沉积设置有至少一个开口的膜层,通过至少一个开口选择性地蚀刻辅助层 使得在辅助层中产生中空空间,通过在膜层上沉积覆盖物来密封中空空间,并且通过在红外辐射的区域内沉积对红外辐射敏感的材料来将检测器元件形成在覆盖物上 覆盖由下面的中空空间限定。

    Process for producing high-epsilon dielectric layer or ferroelectric layer
    7.
    发明授权
    Process for producing high-epsilon dielectric layer or ferroelectric layer 有权
    用于生产高ε电介质层或铁电层的方法

    公开(公告)号:US06346424B1

    公开(公告)日:2002-02-12

    申请号:US09282094

    申请日:1999-03-30

    IPC分类号: H01L2100

    摘要: The process provides a multistage procedure, in which, in the first step the layer is sputtered at low temperature, in the second step an RTP process is carried out in an inert atmosphere at medium or high temperature, and in the third step the layer is heat treated in an atmosphere containing oxygen at low or medium temperature. The levels of heating are considerably reduced compared with conventional processes, so that when the process is being employed for producing an integrated memory cell it is possible to prevent oxidation of an underlying barrier layer.

    摘要翻译: 该方法提供了多级方法,其中在第一步骤中该层在低温下溅射,在第二步中,RTP过程在中等或高温的惰性气氛中进行,在第三步中,该层是 在低温或中等温度的含氧气氛中进行热处理。 与常规方法相比,加热水平显着降低,使得当该方法用于制造集成记忆单元时,可以防止下面的阻挡层的氧化。

    Capacitor electrodes arrangement with oxygen iridium between silicon and oxygen barrier layer
    8.
    发明授权
    Capacitor electrodes arrangement with oxygen iridium between silicon and oxygen barrier layer 有权
    硅和氧阻隔层之间的电容器电极与氧铱排列

    公开(公告)号:US06573542B2

    公开(公告)日:2003-06-03

    申请号:US09891114

    申请日:2001-06-25

    IPC分类号: H01L2976

    摘要: The invention relates to a microelectronic structure. In the structure, an oxygen-containing iridium layer is embedded between a silicon-containing layer and an oxygen barrier layer. The iridium layer is especially produced by a sputter process in an oxygen atmosphere with a low oxygen content. The oxygen-containing iridium layer is stale at temperatures up to 800° C. and withstands the formation of iridium silicide upon contact with the silicon-containing layer. Such micro-electronic structures are preferably used in semiconductor memories.

    摘要翻译: 本发明涉及一种微电子结构。 在该结构中,含氧铱层嵌入含硅层和氧阻隔层之间。 铱层特别是通过在低氧含量的氧气氛中的溅射工艺产生。 含氧铱层在高达800℃的温度下陈化,并在与含硅层接触时经受铱硅化物的形成。 这种微电子结构优选用于半导体存储器。

    RESISTIVE MEMORY AND METHODS FOR FORMING SAME
    9.
    发明申请
    RESISTIVE MEMORY AND METHODS FOR FORMING SAME 审中-公开
    电阻记忆及其形成方法

    公开(公告)号:US20090190388A1

    公开(公告)日:2009-07-30

    申请号:US12019364

    申请日:2008-01-24

    IPC分类号: G11C11/00 H01L21/20

    摘要: A method of fabricating a resistive storage device is provided. The method generally comprises providing an electrode structure stack comprising a first electrode and an electrode structure mask arranged at the first electrode, forming a support structure at least partly at the electrode structure mask, removing the electrode structure mask to leave a storage region window in the support structure, and forming a resistive storage region in the storage region window at the first electrode.

    摘要翻译: 提供一种制造电阻存​​储装置的方法。 该方法通常包括提供包括布置在第一电极处的第一电极和电极结构掩模的电极结构堆叠,至少部分地形成在电极结构掩模处的支撑结构,去除电极结构掩模以将存储区窗口留在 并且在第一电极的存储区窗口中形成电阻存储区。

    Process for fabrication of a ferroelectric capacitor
    10.
    发明授权
    Process for fabrication of a ferroelectric capacitor 失效
    铁电电容器制造工艺

    公开(公告)号:US07199002B2

    公开(公告)日:2007-04-03

    申请号:US10651614

    申请日:2003-08-29

    IPC分类号: H01L27/108

    摘要: A process for the fabrication of a ferroelectric capacitor comprising depositing a layer of Ti 5 over an insulating layer 3 of Al2O3, and oxidising the Ti layer to form a TiO2 layer 7. Subsequently, a layer of PZT 9 is formed over the TiO2 layer 7. The PZT layer 9 is subjected to an annealing step in which, due to the presence of the TiO2 layer 7 it crystallises to form a layer 11 with a high degree of (111)-texture.

    摘要翻译: 一种用于制造铁电电容器的方法,包括在Al 2 O 3 3的绝缘层3上沉积Ti 5层,并氧化Ti层以形成TiO 然后,在TiO 2层7上形成PZT 9层.PZT层9经历退火步骤,其中由于 TiO 2层7的存在使其结晶形成具有高度(111) - 纹理的层11。