Method of making a phase change memory cell having a silicide heater in conjunction with a FinFET
    7.
    发明授权
    Method of making a phase change memory cell having a silicide heater in conjunction with a FinFET 有权
    制造具有与FinFET结合的硅化物加热器的相变存储单元的方法

    公开(公告)号:US08563355B2

    公开(公告)日:2013-10-22

    申请号:US12016739

    申请日:2008-01-18

    IPC分类号: H01L21/06

    摘要: A phase change memory (PCM) cell includes a transistor, a PCM structure, and a heater. The transistor has a first current electrode and a second current electrode in a structure, and a channel region having a first portion along a first sidewall of the structure and having a second portion along a second sidewall of the structure. The second sidewall is opposite the first sidewall. The transistor has a control electrode that has a first portion adjacent to the first sidewall and a second portion adjacent to the second sidewall. The PCM structure exhibits first and second resistive values when in first and second phase states, respectively. The heater is on the structure and produces heat when current flows through the heater for changing the phase state of the phase change structure.

    摘要翻译: 相变存储器(PCM)单元包括晶体管,PCM结构和加热器。 晶体管具有结构中的第一电流电极和第二电流电极,以及具有沿着结构的第一侧壁的第一部分并且具有沿着结构的第二侧壁的第二部分的沟道区域。 第二侧壁与第一侧壁相对。 晶体管具有控制电极,该控制电极具有与第一侧壁相邻的第一部分和与第二侧壁相邻的第二部分。 当分别处于第一和第二相位状态时,PCM结构呈现出第一和第二电阻值。 当电流流过加热器以改变相变结构的相位状态时,加热器在结构上并产生热量。

    PHASE CHANGE MEMORY CELL WITH FINFET AND METHOD THEREFOR
    9.
    发明申请
    PHASE CHANGE MEMORY CELL WITH FINFET AND METHOD THEREFOR 有权
    相变存储器单元与FINFET及其方法

    公开(公告)号:US20090184306A1

    公开(公告)日:2009-07-23

    申请号:US12016739

    申请日:2008-01-18

    IPC分类号: H01L45/00

    摘要: A phase change memory (PCM) cell includes a transistor, a PCM structure, and a heater. The transistor has a first current electrode and a second current electrode in a structure, and a channel region having a first portion along a first sidewall of the structure and having a second portion along a second sidewall of the structure. The second sidewall is opposite the first sidewall. The transistor has a control electrode that has a first portion adjacent to the first sidewall and a second portion adjacent to the second sidewall. The PCM structure exhibits first and second resistive values when in first and second phase states, respectively. The heater is on the structure and produces heat when current flows through the heater for changing the phase state of the phase change structure.

    摘要翻译: 相变存储器(PCM)单元包括晶体管,PCM结构和加热器。 晶体管具有结构中的第一电流电极和第二电流电极,以及具有沿着结构的第一侧壁的第一部分并且具有沿着结构的第二侧壁的第二部分的沟道区域。 第二侧壁与第一侧壁相对。 晶体管具有控制电极,该控制电极具有与第一侧壁相邻的第一部分和与第二侧壁相邻的第二部分。 当分别处于第一和第二相状态时,PCM结构呈现出第一和第二电阻值。 当电流流过加热器以改变相变结构的相位状态时,加热器在结构上并产生热量。

    SELF-ALIGNED SPLIT GATE MEMORY CELL AND METHOD OF FORMING
    10.
    发明申请
    SELF-ALIGNED SPLIT GATE MEMORY CELL AND METHOD OF FORMING 有权
    自对准的分离栅格存储单元和形成方法

    公开(公告)号:US20080303094A1

    公开(公告)日:2008-12-11

    申请号:US11759593

    申请日:2007-06-07

    IPC分类号: H01L29/78 H01L21/04 H01L29/68

    摘要: A method of forming a split gate memory device using a semiconductor layer includes patterning an insulating layer to leave a pillar thereof. A gate dielectric is formed over the semiconductor layer. A charge storage layer is formed over the gate dielectric and along first and second sides of the pillar. A gate material layer is formed over the gate dielectric and pillar. An etch is performed to leave a first portion of the gate material laterally adjacent to a first side of the pillar and over a first portion of the charge storage layer that is over the gate dielectric to function as a control gate of the memory device and a second portion of the gate material laterally adjacent to a second side of the pillar and over a second portion of the charge storage layer that is over the gate dielectric to function as a select gate.

    摘要翻译: 使用半导体层形成分离栅极存储器件的方法包括图案化绝缘层以留下其柱。 在半导体层上形成栅极电介质。 电荷存储层形成在栅极电介质上并沿着柱的第一和第二侧。 栅极材料层形成在栅极电介质和支柱上。 执行蚀刻以将栅极材料的第一部分横向邻近柱的第一侧并且位于栅极电介质上方的电荷存储层的第一部分上,以用作存储器件的控制栅极,并且 栅极材料的第二部分横向邻近柱的第二侧,并且位于栅极电介质上方的电荷存储层的第二部分上,用作选择栅极。