摘要:
A process for forming a silicon carbonitride barrier dielectric film between a dielectric film and a metal interconnect of an integrated circuit substrate, comprising the steps of; providing the integrated circuit substrate having a dielectric film; contacting the substrate with a barrier dielectric film precursor comprising: RxR′y(NR″R′″)zSi wherein R, R′, R″ and R′″ are each individually selected from hydrogen, linear or branched saturated or unsaturated alkyl, or aromatic; wherein x÷y+z=4; z=1-3; but R, R′ cannot both be hydrogen; forming the silicon carbonitride barrier dielectric film with C/Si ratio >0.8 and a N/Si ratio >0.2 on the integrated circuit substrate.
摘要翻译:一种在电介质膜和集成电路基板的金属互连之间形成碳氮化硅阻挡电介质膜的方法,包括以下步骤: 提供具有电介质膜的集成电路基板; 将衬底与阻挡电介质膜前体接触,包括:RxR'y(NR“R”“)zSi其中R,R',R”和R“”各自独立地选自氢,直链或支链饱和或不饱和的烷基,或 芳香; 其中x÷y + z = 4; z = 1-3; 但R,R'不能都是氢; 在集成电路基板上形成C / Si比> 0.8且N / Si比> 0.2的碳氮化硅势垒电介质膜。
摘要:
A method of forming a feature in a substrate comprising the steps of: forming a dielectric layer on a substrate; forming an antireflective coating over the dielectric layer; forming a photoresist pattern over the antireflective coating; etching the dielectric layer through the patterned photoresist; and removing the antireflective coating and the photoresist, wherein the antireflective coating is a film represented by the formula SivOwCxNuHyFz, wherein v+w+x+u+y+z=100%, v is from 1 to 35 atomic %, w is from 1 to 40 atomic %, x is from 5 to 80 atomic %, u is from 0 to 50 atomic %, y is from 10 to 50 atomic % and z is from 0 to 15 atomic %, wherein the antireflective coating is formed by the chemical vapor deposition of a composition comprising (1) at least one precursor selected from the group consisting of an organosilane, an organosiloxane, and an aminosilane; and (2) a hydrocarbon, and wherein the hydrocarbon is substantially not removed from the antireflective coating.
摘要翻译:一种在衬底中形成特征的方法,包括以下步骤:在衬底上形成电介质层; 在电介质层上形成抗反射涂层; 在抗反射涂层上形成光致抗蚀剂图案; 通过图案化的光致抗蚀剂蚀刻介电层; 并且去除抗反射涂层和光致抗蚀剂,其中抗反射涂层是由式SivOwCxNuHyFz表示的膜,其中v + w + x + u + y + z = 100%,v为1至35原子%,w为 1至40原子%,x为5至80原子%,u为0至50原子%,y为10至50原子%,z为0至15原子%,其中抗反射涂层由 组合物的化学气相沉积,其包含(1)至少一种选自有机硅烷,有机硅氧烷和氨基硅烷的前体; 和(2)烃,其中烃基本上不从抗反射涂层中除去。
摘要:
A process for forming a silicon carbonitride barrier dielectric film between a dielectric film and a metal interconnect of an integrated circuit substrate, comprising the steps of; providing the integrated circuit substrate having a dielectric film; contacting the substrate with a barrier dielectric film precursor comprising: RxR′y(NR″R′″)zSi wherein R, R′, R″ and R′″ are each individually selected from hydrogen, linear or branched saturated or unsaturated alkyl, or aromatic; wherein x÷y+z=4; z=1-3; but R, R′ cannot both be hydrogen; forming the silicon carbonitride barrier dielectric film with C/Si ratio>0.8 and a N/Si ratio>0.2 on the integrated circuit substrate.
摘要翻译:一种在电介质膜和集成电路基板的金属互连之间形成碳氮化硅阻挡电介质膜的方法,包括以下步骤: 提供具有电介质膜的集成电路基板; 将衬底与阻挡电介质膜前体接触,包括:RxR'y(NR“R”“)zSi其中R,R',R”和R“”各自独立地选自氢,直链或支链饱和或不饱和的烷基,或 芳香; 其中x÷y + z = 4; z = 1-3; 但R,R'不能都是氢; 在集成电路基板上形成C / Si比> 0.8且N / Si比> 0.2的碳氮化硅势垒电介质膜。
摘要:
A process is provided for making a photovoltaic device comprising a silicon substrate comprising a p-n junction, the process comprising the steps of: forming an amorphous silicon carbide antireflective coating over at least one surface of the silicon substrate by chemical vapor deposition of a composition comprising a precursor selected from the group consisting of an organosilane, an aminosilane, and mixtures thereof, wherein the amorphous silicon carbide antireflective coating is a film represented by the formula SivCxNuHyFz, wherein v+x+u+y+z=100%, v is from 1 to 35 atomic %, x is from 5 to 80 atomic %, u is from 0 to 50 atomic %, y is from 10 to 50 atomic % and z is from 0 to 15 atomic %.
摘要翻译:提供了一种用于制造包括包括pn结的硅衬底的光伏器件的方法,该方法包括以下步骤:通过化学气相沉积在含硅化合物的组合物的化学气相沉积中在硅衬底的至少一个表面上形成非晶碳化硅抗反射涂层 选自有机硅烷,氨基硅烷及其混合物的前体,其中非晶碳化硅抗反射涂层是由式SivCxNuHyFz表示的膜,其中v + x + u + y + z = 100%,v来自 1〜35原子%,x为5〜80原子%,u为0〜50原子%,y为10〜50原子%,z为0〜15原子%。
摘要:
A process for removing carbon-containing residues from a substrate is described herein. In one aspect, there is provided a process for removing carbon-containing residue from at least a portion of a surface of a substrate comprising: providing a process gas comprising an oxygen source, a fluorine source, an and optionally additive gas wherein the molar ratio of oxygen to fluorine contained within the process gas ranges from about 1 to about 10; activating the process gas using at least one energy source to provide reactive species; and contacting the surface of the substrate with the reactive species to volatilize and remove the carbon-containing residue from the surface.
摘要:
A process is provided for making a photovoltaic device comprising a silicon substrate comprising a p-n junction, the process comprising the steps of: forming an amorphous silicon carbide antireflective coating over at least one surface of the silicon substrate by chemical vapor deposition of a composition comprising a precursor selected from the group consisting of an organosilane, an aminosilane, and mixtures thereof, wherein the amorphous silicon carbide antireflective coating is a film represented by the formula SivCxNuHyFz, wherein v+x+u+y+z=100%, v is from 1 to 35 atomic %, x is from 5 to 80 atomic %, u is from 0 to 50 atomic %, y is from 10 to 50 atomic % and z is from 0 to 15 atomic %.
摘要翻译:提供了一种用于制造包括包括pn结的硅衬底的光伏器件的方法,该方法包括以下步骤:通过化学气相沉积在含硅化合物的组合物的化学气相沉积中在硅衬底的至少一个表面上形成非晶碳化硅抗反射涂层 选自有机硅烷,氨基硅烷及其混合物的前体,其中非晶碳化硅抗反射涂层是由式SivCxNuHyFz表示的膜,其中v + x + u + y + z = 100%,v来自 1〜35原子%,x为5〜80原子%,u为0〜50原子%,y为10〜50原子%,z为0〜15原子%。
摘要:
A porous organosilica glass (OSG) film consists of a single phase of a material represented by the formula SivOwCxHyFz, where v+w+x+y+z=100%, v is from 10 to 35 atomic %, w is from 10 to 65 atomic %, x is from 5 to 30 atomic %, y is from 10 to 50 atomic % and z is from 0 to 15 atomic %, wherein the film has pores and a dielectric constant less than 2.6. The film is provided by a chemical vapor deposition method in which a preliminary film is deposited from organosilane and/or organosiloxane precursors and pore-forming agents (porogens) wherein the precursor is a compound of the formula R1n(OR2)p(O(O)CR4)3−n−pSi—R7—SiR3m(O(O)CR5)q(OR6)3−m−q where R1 and R3 are independently H or C1 to C4 linear or branched, saturated, singly or multiply unsaturated, cyclic, partially or fully fluorinated hydrocarbon; R2, R8 and R7 are independently C1 to C6 linear or branched, saturated, singly or multiply unsaturated, cyclic, aromatic, partially or fully fluorinated hydrocarbon, R4 and Rs are independently H, C1 to C6 linear or branched, saturated, singly or multiply unsaturated, cyclic, aromatic, partially or fully fluorinated hydrocarbon, n is 0 to 3, m is 0 to 3, q is 0 to 3 and p is 0 to 3, provided that n+m>1, n+p 3, and m+q 3, wherein the porogen is selected from the group consisting of norbornadiene, alpha-terpinene, limonene, cyclooctane, and cymene. The porogens are subsequently removed to provide the porous film.
摘要翻译:多孔有机硅玻璃(OSG)膜由式SivOwCxHyFz表示的材料的单相组成,其中v + w + x + y + z = 100%,v为10〜35原子%,w为10〜 65原子%,x为5〜30原子%,y为10〜50原子%,z为0〜15原子%,其中,膜的孔隙和介电常数小于2.6。 该薄膜由化学气相沉积方法提供,其中预备薄膜由有机硅烷和/或有机硅氧烷前体和成孔剂(致孔剂)沉积,其中前体是式R1n(OR2)p(O(O) )CR 4)3-n-pSi-R 7 -SiR 3 m(O(O)CR 5)q(OR 6)3-m-q其中R 1和R 3独立地为H或C 1至C 4直链或支链,饱和,单或多不饱和, 环状,部分或完全氟化的烃; R2,R8和R7独立为C1至C6直链或支链,饱和,单或多不饱和,环状,芳族,部分或全部是氟化的烃,R4和R5独立地为H,C1至C6直链或支链,饱和,单或多 不饱和的,环状的,芳族的,部分或完全氟化的烃,n为0至3,m为0至3,q为0至3,p为0至3,条件是n + m> 1,n + p 3和 m + q 3,其中致孔剂选自降冰片二烯,α-萜品烯,柠檬烯,环辛烷和伞花烃。 随后除去致孔剂以提供多孔膜。
摘要:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i.e., material hardness and elastic modulus) compared to the as-deposited film.
摘要:
Organofluorosilicate glass films contain both organic species and inorganic fluorines, exclusive of significant amounts of fluorocarbon species. Preferred films are represented by the formula SivOwCxHyFz, where v+w+x+y+z=100%, v is from 10 to 35 atomic %, w is from 10 to 65 atomic % y is from 10 to 50 atomic %, x is from 1 to 30 atomic %, z is from 0.1 to 15 atomic %, and x/z is optionally greater than 0.25, wherein substantially none of the fluorine is bonded to the carbon. A CVD method includes: (a) providing a substrate within a vacuum chamber; (b) introducing into the vacuum chamber gaseous reagents including a fluorine-providing gas, an oxygen-providing gas and at least one precursor gas selected from an organosilane and an organosiloxane; and (c) applying energy to the gaseous reagents in the chamber to induce reaction of the gaseous reagents and to form the film on the substrate.
摘要翻译:有机氟硅酸盐玻璃膜含有有机物质和无机氟,不含大量的碳氟化合物。 优选的膜由式SivOwCxHyFz表示,其中v + w + x + y + z = 100%,v为10至35原子%,w为10至65原子%,y为10至50原子%,x 为1〜30原子%,z为0.1〜15原子%,x / z任选大于0.25,基本上没有氟与碳键合。 CVD方法包括:(a)在真空室内提供衬底; (b)在真空室中引入气体试剂,其中包括提供供气的气体,供氧气体和至少一种选自有机硅烷和有机硅氧烷的前体气体; 和(c)向室中的气态试剂施加能量以诱导气态试剂的反应并在基底上形成膜。
摘要:
A method of forming a low dielectric constant interlayer dielectric film on a substrate by reacting, under chemical vapor deposition conditions sufficient to deposit the film on the substrate, an organosilicon precursor comprising a silyl ether, a silyl ether oligomer, or an organosilicon compound containing one or more reactive groups, to form an interlayer dielectric film having a dielectric constant of 3.5 or less. The films formed by the above method.