摘要:
Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.
摘要:
A package with multiple chips and a shared redistribution layer is described. In one example, a first and a second die are formed where the first and the second die each have a different height. The dies are placed on a substrate. The first, the second, or both dies are ground so that the first and the second die are about the same height. Layers, such as redistribution layers are formed over both the first and the second die at the same time using a single process, and the first and the second die and the formed layers are packaged.
摘要:
Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
摘要:
Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
摘要:
Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.
摘要:
Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.
摘要:
A circuit configuration generates an even-numbered duty factor with an odd-numbered division n of a symmetrical clock signal. A first device generates a first output signal from the symmetrical clock signal. The first output signal begins upon each n.sup.th edge of one type, of a symmetrical clock signal and remains active for a length of N-1/2 periods of the symmetrical clock signal. A second device generates a second output signal from the symmetrical clock signal. The second output signal begins upon each n.sup.th edge of another type, of the symmetrical clock signal and remains active for the length of N-1/2 periods of the symmetrical clock signal. A logic linkage is connected to the first and second devices for linking the two output signals to form one symmetrical output signal.
摘要:
A method for processing a bit sequence in a digital communication system, includes the steps of (a) storing the bits of said bit sequence at locations of a memory means indicated by a first interleaving scheme, (b) converting output bit positions into input bit positions according to an inverse of a second interleaving scheme, (c) reading out bits stored at locations of said memory means corresponding to said input bit positions, thereby generating an interleaved sequence which is interleaved according to said first and said second interleaving schemes, and (d) processing said interleaved sequence according to further physical processing steps. Alternatively, step (a) may include storing the bits of said input bit sequence in a memory means and step (b) may include converting output bit positions into input bit positions according to the inverse of a sequential application of a first interleaving scheme and a second interleaving scheme.
摘要:
A method for processing a bit sequence in a digital communication system, includes the steps of (a) storing the bits of said bit sequence at locations of a memory means indicated by a first interleaving scheme, (b) converting output bit positions into input bit positions according to an inverse of a second interleaving scheme, (c) reading out bits stored at locations of said memory means corresponding to said input bit positions, thereby generating an interleaved sequence which is interleaved according to said first and said second interleaving schemes, and (d) processing said interleaved sequence according to further physical processing steps. Alternatively, step (a) may include storing the bits of said input bit sequence in a memory means and step (b) may include converting output bit positions into input bit positions according to the inverse of a sequential application of a first interleaving scheme and a second interleaving scheme.
摘要:
A frequency synthesizer for a radio terminal with which a dual-band and/or dual-mode switchover is possible in a simple manner. The frequency synthesizer has a double phase-locked loop with a high-frequency portion and an intermediate-frequency portion, each with one divider and one counter in a feedback branch. There is at least one memory for holding a plurality of divider values for the counter in the intermediate-frequency portion. The counter in the high-frequency portion is coupled to the memory in such a way that when a new divider value is written into the counter of the high-frequency portion, an associated divider value from the memory is written into the counter of the intermediate-frequency portion. In this way, the frequency generated by the intermediate-frequency divider is adapted to the frequency generated in the high-frequency portion in such a way that the requisite operating frequencies of each active mobile radio system are set automatically. In the same way, the dual-mode switchover can be carried out by coupling a further memory with further divider values for the counter of the high-frequency portion.