公开(公告)号：US20170062021A1

公开(公告)日：2017-03-02

申请号：US15351600

申请日：2016-11-15

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/04

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Abstract translation: 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US20150171066A1

公开(公告)日：2015-06-18

申请号：US14574662

申请日：2014-12-18

Applicant: Renesas Electronics Corporation

Inventor： Shintaro YAMAMICHI ,  Atsushi NAKAMURA ,  Masayuki ITO ,  Naoto TAOKA ,  Kentaro MORI

IPC: H01L25/18 ,  H01L27/02 ,  H01L23/31 ,  H01L23/34 ,  H01L29/49 ,  H01L29/51

CPC classification number: H01L25/18 ,  H01L23/145 ,  H01L23/147 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/5226 ,  H01L23/5283 ,  H01L24/97 ,  H01L27/0207 ,  H01L29/4916 ,  H01L29/517 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2924/00011

Abstract: This invention is to improve performance of a semiconductor integrated circuit device. A semiconductor device has a peripheral circuit chip and a logic chip mounted over a wiring substrate. The wiring substrate and the peripheral circuit chip are electrically connected, and the peripheral circuit chip and the logic chip are electrically connected. The peripheral circuit chip includes a first peripheral circuit, a power supply controller, a temperature sensor and a first RAM. The logic chip includes a CPU, a second peripheral circuit and a second RAM. The first peripheral circuit and the first RAM are manufactured based on a first process rule. The CPU, the second peripheral circuit and the second RAM are manufactured based on a second process rule finer than the first process rule.

Abstract translation: 本发明是为了提高半导体集成电路器件的性能。 半导体器件具有安装在布线基板上的外围电路芯片和逻辑芯片。 布线基板和外围电路芯片电连接，并且外围电路芯片和逻辑芯片电连接。 外围电路芯片包括第一外围电路，电源控制器，温度传感器和第一RAM。 逻辑芯片包括CPU，第二外围电路和第二RAM。 第一外围电路和第一RAM基于第一处理规则制造。 基于比第一处理规则更精细的第二处理规则来制造CPU，第二外围电路和第二RAM。

公开(公告)号：US20150036406A1

公开(公告)日：2015-02-05

申请号：US14519967

申请日：2014-10-21

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/02

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Abstract translation: 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US20140160826A1

公开(公告)日：2014-06-12

申请号：US14182821

申请日：2014-02-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/02

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Abstract translation: 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US20180301172A1

公开(公告)日：2018-10-18

申请号：US16010770

申请日：2018-06-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/04 ,  G11C5/02

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

公开(公告)号：US20170062020A1

公开(公告)日：2017-03-02

申请号：US15351580

申请日：2016-11-15

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC: G11C5/04 ,  G11C5/06 ,  H01L25/18 ,  H01L23/00 ,  H05K1/18 ,  H01L23/498

CPC classification number: G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.