公开(公告)号：US20110018050A1

公开(公告)日：2011-01-27

申请号：US12727830

申请日：2010-03-19

申请人： Tomoko FUJIWARA ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Megumi Ishiduki ,  Junya Matsunami ,  Hideaki Aochi ,  Ryouhei Kirisawa ,  Yoshimasa Mikajiri ,  Shigeto Oota

发明人： Tomoko FUJIWARA ,  Ryota Katsumata ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Megumi Ishiduki ,  Junya Matsunami ,  Hideaki Aochi ,  Ryouhei Kirisawa ,  Yoshimasa Mikajiri ,  Shigeto Oota

IPC分类号： H01L29/51 ,  H01L21/4763

CPC分类号： H01L27/11551 ,  H01L27/11524 ,  H01L27/11526 ,  H01L27/11529 ,  H01L27/11556

摘要： A nonvolatile semiconductor memory device, includes: a stacked structural unit including electrode films alternately stacked with inter-electrode insulating films; first and second semiconductor pillars piercing the stacked structural unit; a connection portion semiconductor layer electrically connect the first and second semiconductor pillars; a connection portion conductive layer provided to oppose the connection portion semiconductor layer; a memory layer and an inner insulating film provided between the first and semiconductor pillars and each of the electrode films, and between the connection portion conductive layer and the connection portion semiconductor layer; an outer insulating film provided between the memory layer and each of the electrode films; and a connection portion outer insulating film provided between the memory layer and the connection portion conductive layer. The connection portion outer insulating film has a film thickness thicker than a film thickness of the outer insulating film.

摘要翻译： 一种非易失性半导体存储器件，包括：堆叠结构单元，其包括交替层叠有电极间绝缘膜的电极膜; 第一和第二半导体柱刺穿堆叠结构单元; 连接部分半导体层电连接第一和第二半导体柱; 连接部分导电层，设置成与连接部分半导体层相对; 设置在所述第一半导体柱和所述半导体柱之间以及所述电极膜之间并且位于所述连接部分导电层和所述连接部半导体层之间的存储层和内部绝缘膜; 设置在所述存储层和每个所述电极膜之间的外部绝缘膜; 以及设置在存储层和连接部分导电层之间的连接部分外绝缘膜。 连接部外绝缘膜的膜厚比外绝缘膜的膜厚厚。

公开(公告)号：US20100320526A1

公开(公告)日：2010-12-23

申请号：US12727730

申请日：2010-03-19

申请人： Masaru KIDOH ,  Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Yoshimasa MIKAJIRI ,  Shigeto OOTA ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI

发明人： Masaru KIDOH ,  Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Yoshimasa MIKAJIRI ,  Shigeto OOTA ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI

IPC分类号： H01L29/792 ,  H01L21/336

CPC分类号： H01L27/11578 ,  H01L23/522 ,  H01L23/53257 ,  H01L23/53271 ,  H01L27/11582 ,  H01L2924/0002 ,  H01L2924/00

摘要： A nonvolatile semiconductor memory device includes: a semiconductor substrate; a memory unit; and a circuit unit provided between the semiconductor substrate and the memory unit. The memory unit includes: a stacked structural unit having electrode films alternately stacked with inter-electrode-film insulating films; a semiconductor pillar piercing the stacked structural unit; and a storage unit provided corresponding to an intersection between the electrode films and the semiconductor pillar. The circuit unit includes first and second transistors having different conductivity type, a first interconnect, and first and second contact plugs. The first interconnect includes silicide provided on a side of the first and second transistors opposite to the semiconductor substrate. The first contact plug made of polysilicon of the first conductivity type connects the first interconnect to the first transistor. The second contact plug made of polysilicon of the second conductivity type connects the first interconnect to the second transistor.

摘要翻译： 非易失性半导体存储器件包括：半导体衬底; 记忆单元 以及设置在半导体衬底和存储器单元之间的电路单元。 存储单元包括：层叠结构单元，其具有交替层叠有电极间绝缘膜的电极膜; 穿过堆叠结构单元的半导体柱; 以及与电极膜和半导体柱之间的交点对应地设置的存储单元。 电路单元包括具有不同导电类型的第一和第二晶体管，第一互连以及第一和第二接触插塞。 第一互连包括设置在与半导体衬底相对的第一和第二晶体管一侧的硅化物。 由第一导电类型的多晶硅制成的第一接触插头将第一互连件连接到第一晶体管。 由第二导电类型的多晶硅制成的第二接触插头将第一互连件连接到第二晶体管。

公开(公告)号：US20100244186A1

公开(公告)日：2010-09-30

申请号：US12722920

申请日：2010-03-12

申请人： Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Masaru KIDOH ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI ,  Tomoko FUJIWARA

发明人： Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Masaru KIDOH ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI ,  Tomoko FUJIWARA

IPC分类号： H01L27/10 ,  H01L21/822 ,  G11C17/16

CPC分类号： H01L27/1021 ,  H01L23/5252 ,  H01L27/0207 ,  H01L27/101 ,  H01L27/112 ,  H01L27/11206 ,  H01L2924/0002 ,  H01L2924/00

摘要： A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of stacked component units stacked in a first direction, each of the stacked component units including a first conducting film made of a semiconductor of a first conductivity type provided perpendicular to the first direction and a first insulating film stacked in the first direction with the first conducting film; a semiconductor pillar piercing the stacked structural unit in the first direction and including a conducting region of a second conductivity type, the semiconductor pillar including a first region opposing each of the first conducting films, and a second region provided between the first regions with respect to the first direction, the second region having a resistance different from a resistance of the first region; and a second insulating film provided between the semiconductor pillar and the first conducting film.

摘要翻译： 一种非易失性半导体存储器件，包括：堆叠结构单元，包括沿第一方向堆叠的多个堆叠的元件单元，每个堆叠元件单元包括由垂直于第一元件垂直设置的第一导电类型的半导体制成的第一导电膜 方向和与第一导电膜在第一方向上堆叠的第一绝缘膜; 所述半导体柱在所述第一方向上穿透所述层叠结构单元，并且包括第二导电类型的导电区域，所述半导体柱包括与所述第一导电膜相对的第一区域，以及设置在所述第一区域之间的第二区域， 所述第一方向，所述第二区域具有与所述第一区域的电阻不同的电阻; 以及设置在所述半导体柱和所述第一导电膜之间的第二绝缘膜。

公开(公告)号：US20100207194A1

公开(公告)日：2010-08-19

申请号：US12706127

申请日：2010-02-16

申请人： Hiroyasu TANAKA ,  Hideaki AOCHI ,  Ryota KATSUMATA ,  Masaru KIDOH ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Junya MATSUNAMI ,  Ryouhei KIRISAWA

发明人： Hiroyasu TANAKA ,  Hideaki AOCHI ,  Ryota KATSUMATA ,  Masaru KIDOH ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Junya MATSUNAMI ,  Ryouhei KIRISAWA

IPC分类号： H01L27/115 ,  H01L21/8246

CPC分类号： H01L29/792 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/66833

摘要： A nonvolatile semiconductor memory device includes: a semiconductor substrate; a stacked body provided on the semiconductor substrate, the stacked body having electrode films and insulating films being alternately stacked; a first and second semiconductor pillars; and a first and second charge storage layers. The first and second semiconductor pillars are provided inside a through hole penetrating through the stacked body in a stacking direction of the stacked body. The through hole has a cross section of an oblate circle, when cutting in a direction perpendicular to the stacking direction. The first and second semiconductor pillars face each other in a major axis direction of the first oblate circle. The first and second semiconductor pillars extend in the stacking direction. The first and second charge storage layers are provided between the electrode film and the first and second semiconductor pillars, respectively.

摘要翻译： 非易失性半导体存储器件包括：半导体衬底; 设置在所述半导体基板上的层叠体，具有交替堆叠的电极膜和绝缘膜的层叠体， 第一和第二半导体柱; 以及第一和第二电荷存储层。 第一半导体柱和第二半导体柱设置在层叠体的层叠方向上贯穿层叠体的贯通孔内。 当沿垂直于堆叠方向的方向切割时，通孔具有扁圆形的横截面。 第一和第二半导体柱在第一扁圆的长轴方向上彼此面对。 第一和第二半导体柱沿层叠方向延伸。 第一和第二电荷存储层分别设置在电极膜和第一和第二半导体柱之间。

公开(公告)号：US20130020627A1

公开(公告)日：2013-01-24

申请号：US13409652

申请日：2012-03-01

申请人： Yoshiaki FUKUZUMI ,  Masaru KITO ,  Tomoko FUJIWARA ,  Kaori KAWASAKI ,  Hideaki AOCHI

发明人： Yoshiaki FUKUZUMI ,  Masaru KITO ,  Tomoko FUJIWARA ,  Kaori KAWASAKI ,  Hideaki AOCHI

IPC分类号： H01L29/788 ,  H01L21/28

CPC分类号： H01L21/84 ,  G11C19/00 ,  H01L27/10 ,  H01L27/11517 ,  H01L27/1203

摘要： In one embodiment, a shift register memory includes first and second control electrodes extending in a first direction parallel to a surface of a substrate, and facing each other in a second direction perpendicular to the first direction. The memory further includes a plurality of first floating electrodes provided in a line on a first control electrode side between the first and second control electrodes. The memory further includes a plurality of second floating electrodes provided in a line on a second control electrode side between the first and second control electrodes. Each of the first and second floating electrodes has a planar shape which is mirror-asymmetric with respect to a plane perpendicular to the first direction.

摘要翻译： 在一个实施例中，移位寄存器存储器包括在平行于衬底表面的第一方向上延伸的第一和第二控制电极，并且在垂直于第一方向的第二方向上彼此面对。 存储器还包括设置在第一和第二控制电极之间的第一控制电极侧的一行中的多个第一浮置电极。 存储器还包括设置在第一和第二控制电极之间的第二控制电极侧的一行中的多个第二浮置电极。 第一和第二浮动电极中的每一个具有相对于垂直于第一方向的平面镜像不对称的平面形状。

公开(公告)号：US20120195128A1

公开(公告)日：2012-08-02

申请号：US13177719

申请日：2011-07-07

申请人： Tomoko FUJIWARA ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi

发明人： Tomoko FUJIWARA ,  Masaru Kito ,  Yoshiaki Fukuzumi ,  Hideaki Aochi

IPC分类号： G11C16/10

CPC分类号： H01L27/11573 ,  G11C11/5628 ,  G11C16/0483 ,  G11C16/10 ,  H01L27/11582 ,  H01L29/792

摘要： According to one embodiment, a nonvolatile semiconductor memory device includes a memory unit and a control unit. The memory unit includes a multilayer structure, a semiconductor pillar, a storage layer, an inner insulating film, an outer insulating film, a memory cell transistor. The control unit performs control of setting the thresholds of the memory transistor to either positive or negative, and performs control so that, with one of the thresholds most distant from 0 volts being defined as n-th threshold, width of distribution of m-th threshold (m being an integer of 1 or more smaller than n) having a sign being same as the n-th threshold is set narrower than width of distribution of the n-th threshold.

摘要翻译： 根据一个实施例，非易失性半导体存储器件包括存储器单元和控制单元。 存储单元包括多层结构，半导体柱，存储层，内绝缘膜，外绝缘膜，存储单元晶体管。 控制单元执行将存储晶体管的阈值设置为正或负的控制，并进行控制，使得在距离最远的0V的阈值中的一个被定义为第n阈值时，第m行的分布宽度 具有与第n个阈值相同的符号的阈值（m为小于n的1以上的整数）被设定为窄于第n阈值的分布宽度。

公开(公告)号：US20130234233A1

公开(公告)日：2013-09-12

申请号：US13603797

申请日：2012-09-05

申请人： Tomoko FUJIWARA ,  Yoshiaki FUKUZUMI ,  Hideaki AOCHI

发明人： Tomoko FUJIWARA ,  Yoshiaki FUKUZUMI ,  Hideaki AOCHI

IPC分类号： H01L29/792

CPC分类号： H01L29/792 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11582

摘要： According to one embodiment, a semiconductor memory device comprises a first layer, a first conductive layer, a insulating layer, and a second conductive layer stacked on a substrate, a block insulating layer on inner surfaces of a pair of through-holes formed in the first conductive layer, the insulating layer, and the second conductive layer, and on an inner surface of a connecting hole connecting lower ends of the pair of through-holes, a charge storage layer on the block insulating layer, a second layer on the charge storage layer, and a semiconductor layer on the second layer. The second layer includes an air gap layer on the charge storage layer in the pair of through-holes, and a third conductive layer on the charge storage layer in the connecting hole.

摘要翻译： 根据一个实施例，半导体存储器件包括第一层，第一导电层，绝缘层和堆叠在衬底上的第二导电层，在形成在衬底中的一对通孔的内表面上的块绝缘层 第一导电层，绝缘层和第二导电层，以及连接在一对通孔的下端的连接孔的内表面上，在块绝缘层上的电荷存储层，电荷上的第二层 存储层和第二层上的半导体层。 第二层包括一对通孔中的电荷存储层上的气隙层和连接孔中的电荷存储层上的第三导电层。

公开(公告)号：US20130075918A1

公开(公告)日：2013-03-28

申请号：US13405692

申请日：2012-02-27

申请人： Yoshiaki FUKUZUMI ,  Hideaki AOCHI ,  Tomoko FUJIWARA

发明人： Yoshiaki FUKUZUMI ,  Hideaki AOCHI ,  Tomoko FUJIWARA

IPC分类号： H01L23/48

CPC分类号： B82Y10/00 ,  G11C19/00 ,  G11C19/282 ,  G11C19/38 ,  H01L27/1052 ,  H01L27/1057 ,  H01L27/115 ,  H01L27/11517 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/788

摘要： In one embodiment, a shift register memory includes a substrate, and a channel layer provided on the substrate, and having a helical shape rotating around an axis which is perpendicular to a surface of the substrate. The memory further includes at least three control electrodes provided on the substrate, extending in a direction parallel to the axis, and to be used to transfer charges in the channel layer.

摘要翻译： 在一个实施例中，移位寄存器存储器包括衬底和设置在衬底上的沟道层，并且具有围绕垂直于衬底表面的轴线旋转的螺旋形状。 存储器还包括设置在基板上的至少三个控制电极，其在平行于该轴线的方向上延伸，并用于在沟道层中传送电荷。

公开(公告)号：US20130058163A1

公开(公告)日：2013-03-07

申请号：US13418651

申请日：2012-03-13

申请人： Masaru KITO ,  Tomoko FUJIWARA ,  Hideaki AOCHI

发明人： Masaru KITO ,  Tomoko FUJIWARA ,  Hideaki AOCHI

IPC分类号： G11C11/34 ,  H01L29/78

CPC分类号： H01L27/11565 ,  G11C5/025 ,  H01L27/11582 ,  H01L29/7926

摘要： According to one embodiment, a semiconductor memory device includes a stacked body, a semiconductor pillar, a charge storage layer, a tunneling layer, a dividing trench and a first heating unit. The stacked body includes a plurality of first insulating films stacked alternately with a plurality of electrode films. The semiconductor pillar pierces the stacked body. The charge storage layer is provided between the electrode films and the semiconductor pillar. The tunneling layer is provided between the charge storage layer and the semiconductor pillar. The dividing trench is provided between the semiconductor pillars in one direction orthogonal to a stacking direction of the stacked body to divide the electrode films. The first heating unit is provided in an interior of the dividing trench.

摘要翻译： 根据一个实施例，半导体存储器件包括堆叠体，半导体柱，电荷存储层，隧道层，分隔沟槽和第一加热单元。 层叠体包括与多个电极膜交替堆叠的多个第一绝缘膜。 半导体柱穿透层叠体。 电荷存储层设置在电极膜和半导体柱之间。 隧道层设置在电荷存储层和半导体柱之间。 在与层叠体的堆叠方向正交的一个方向上的半导体柱之间设置分割沟槽，以分割电极膜。 第一加热单元设置在分隔沟槽的内部。