公开(公告)号：US20130020627A1

公开(公告)日：2013-01-24

申请号：US13409652

申请日：2012-03-01

申请人： Yoshiaki FUKUZUMI ,  Masaru KITO ,  Tomoko FUJIWARA ,  Kaori KAWASAKI ,  Hideaki AOCHI

发明人： Yoshiaki FUKUZUMI ,  Masaru KITO ,  Tomoko FUJIWARA ,  Kaori KAWASAKI ,  Hideaki AOCHI

IPC分类号： H01L29/788 ,  H01L21/28

CPC分类号： H01L21/84 ,  G11C19/00 ,  H01L27/10 ,  H01L27/11517 ,  H01L27/1203

摘要： In one embodiment, a shift register memory includes first and second control electrodes extending in a first direction parallel to a surface of a substrate, and facing each other in a second direction perpendicular to the first direction. The memory further includes a plurality of first floating electrodes provided in a line on a first control electrode side between the first and second control electrodes. The memory further includes a plurality of second floating electrodes provided in a line on a second control electrode side between the first and second control electrodes. Each of the first and second floating electrodes has a planar shape which is mirror-asymmetric with respect to a plane perpendicular to the first direction.

摘要翻译： 在一个实施例中，移位寄存器存储器包括在平行于衬底表面的第一方向上延伸的第一和第二控制电极，并且在垂直于第一方向的第二方向上彼此面对。 存储器还包括设置在第一和第二控制电极之间的第一控制电极侧的一行中的多个第一浮置电极。 存储器还包括设置在第一和第二控制电极之间的第二控制电极侧的一行中的多个第二浮置电极。 第一和第二浮动电极中的每一个具有相对于垂直于第一方向的平面镜像不对称的平面形状。

公开(公告)号：US20100224928A1

公开(公告)日：2010-09-09

申请号：US12714905

申请日：2010-03-01

申请人： Yoshiaki FUKUZUMI ,  Ryota Katsumata ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Megumi Ishiduki ,  Junya Matsunami ,  Tomoko Fujiwara ,  Hideaki Aochi ,  Ryouhei Kirisawa

发明人： Yoshiaki FUKUZUMI ,  Ryota Katsumata ,  Masaru Kito ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yosuke Komori ,  Megumi Ishiduki ,  Junya Matsunami ,  Tomoko Fujiwara ,  Hideaki Aochi ,  Ryouhei Kirisawa

IPC分类号： H01L29/792 ,  H01L21/8239

CPC分类号： H01L27/11578 ,  H01L21/28282 ,  H01L27/11582

摘要： A method for manufacturing a nonvolatile semiconductor memory device, the device including a stacked structural unit including a plurality of insulating films alternately stacked with a plurality of electrode films in a first direction and a semiconductor pillar piercing the stacked structural unit in the first direction, the method includes: forming a stacked unit including a core material film alternately stacked with a sacrificial film on a major surface of a substrate perpendicular to the first direction; making a trench in the stacked unit, the trench extending in the first direction and a second direction in a plane perpendicular to the first direction; filling a filling material into the trench; removing the sacrificial film to form a hollow structural unit, the hollow structural unit including a post unit supporting the core material film on the substrate, the post unit being made of the filling material; and forming the stacked structural unit by stacking one of the insulating films and one of the electrode films on a surface of the core material film exposed by removing the sacrificial film.

摘要翻译： 一种用于制造非易失性半导体存储器件的方法，该器件包括层叠结构单元，该堆叠结构单元包括在第一方向上交替堆叠多个电极膜的多个绝缘膜，以及沿第一方向穿透层叠结构单元的半导体柱， 方法包括：在垂直于第一方向的基板的主表面上形成包括交替堆叠有牺牲膜的芯材膜的堆叠单元; 在所述堆叠单元中形成沟槽，所述沟槽在垂直于所述第一方向的平面中沿所述第一方向延伸并且沿第二方向延伸; 将填充材料填充到沟槽中; 去除所述牺牲膜以形成中空结构单元，所述中空结构单元包括支撑所述芯材膜的柱单元，所述柱单元由所述填充材料制成; 以及通过将绝缘膜和其中一个电极膜层叠在通过去除牺牲膜而暴露的芯材膜的表面上来形成层叠结构单元。

公开(公告)号：US20100207194A1

公开(公告)日：2010-08-19

申请号：US12706127

申请日：2010-02-16

申请人： Hiroyasu TANAKA ,  Hideaki AOCHI ,  Ryota KATSUMATA ,  Masaru KIDOH ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Junya MATSUNAMI ,  Ryouhei KIRISAWA

发明人： Hiroyasu TANAKA ,  Hideaki AOCHI ,  Ryota KATSUMATA ,  Masaru KIDOH ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Junya MATSUNAMI ,  Ryouhei KIRISAWA

IPC分类号： H01L27/115 ,  H01L21/8246

CPC分类号： H01L29/792 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/66833

摘要： A nonvolatile semiconductor memory device includes: a semiconductor substrate; a stacked body provided on the semiconductor substrate, the stacked body having electrode films and insulating films being alternately stacked; a first and second semiconductor pillars; and a first and second charge storage layers. The first and second semiconductor pillars are provided inside a through hole penetrating through the stacked body in a stacking direction of the stacked body. The through hole has a cross section of an oblate circle, when cutting in a direction perpendicular to the stacking direction. The first and second semiconductor pillars face each other in a major axis direction of the first oblate circle. The first and second semiconductor pillars extend in the stacking direction. The first and second charge storage layers are provided between the electrode film and the first and second semiconductor pillars, respectively.

摘要翻译： 非易失性半导体存储器件包括：半导体衬底; 设置在所述半导体基板上的层叠体，具有交替堆叠的电极膜和绝缘膜的层叠体， 第一和第二半导体柱; 以及第一和第二电荷存储层。 第一半导体柱和第二半导体柱设置在层叠体的层叠方向上贯穿层叠体的贯通孔内。 当沿垂直于堆叠方向的方向切割时，通孔具有扁圆形的横截面。 第一和第二半导体柱在第一扁圆的长轴方向上彼此面对。 第一和第二半导体柱沿层叠方向延伸。 第一和第二电荷存储层分别设置在电极膜和第一和第二半导体柱之间。

公开(公告)号：US20100320526A1

公开(公告)日：2010-12-23

申请号：US12727730

申请日：2010-03-19

申请人： Masaru KIDOH ,  Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Yoshimasa MIKAJIRI ,  Shigeto OOTA ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI

发明人： Masaru KIDOH ,  Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Tomoko FUJIWARA ,  Yoshimasa MIKAJIRI ,  Shigeto OOTA ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI

IPC分类号： H01L29/792 ,  H01L21/336

CPC分类号： H01L27/11578 ,  H01L23/522 ,  H01L23/53257 ,  H01L23/53271 ,  H01L27/11582 ,  H01L2924/0002 ,  H01L2924/00

摘要： A nonvolatile semiconductor memory device includes: a semiconductor substrate; a memory unit; and a circuit unit provided between the semiconductor substrate and the memory unit. The memory unit includes: a stacked structural unit having electrode films alternately stacked with inter-electrode-film insulating films; a semiconductor pillar piercing the stacked structural unit; and a storage unit provided corresponding to an intersection between the electrode films and the semiconductor pillar. The circuit unit includes first and second transistors having different conductivity type, a first interconnect, and first and second contact plugs. The first interconnect includes silicide provided on a side of the first and second transistors opposite to the semiconductor substrate. The first contact plug made of polysilicon of the first conductivity type connects the first interconnect to the first transistor. The second contact plug made of polysilicon of the second conductivity type connects the first interconnect to the second transistor.

摘要翻译： 非易失性半导体存储器件包括：半导体衬底; 记忆单元 以及设置在半导体衬底和存储器单元之间的电路单元。 存储单元包括：层叠结构单元，其具有交替层叠有电极间绝缘膜的电极膜; 穿过堆叠结构单元的半导体柱; 以及与电极膜和半导体柱之间的交点对应地设置的存储单元。 电路单元包括具有不同导电类型的第一和第二晶体管，第一互连以及第一和第二接触插塞。 第一互连包括设置在与半导体衬底相对的第一和第二晶体管一侧的硅化物。 由第一导电类型的多晶硅制成的第一接触插头将第一互连件连接到第一晶体管。 由第二导电类型的多晶硅制成的第二接触插头将第一互连件连接到第二晶体管。

公开(公告)号：US20130234233A1

公开(公告)日：2013-09-12

申请号：US13603797

申请日：2012-09-05

申请人： Tomoko FUJIWARA ,  Yoshiaki FUKUZUMI ,  Hideaki AOCHI

发明人： Tomoko FUJIWARA ,  Yoshiaki FUKUZUMI ,  Hideaki AOCHI

IPC分类号： H01L29/792

CPC分类号： H01L29/792 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11582

摘要： According to one embodiment, a semiconductor memory device comprises a first layer, a first conductive layer, a insulating layer, and a second conductive layer stacked on a substrate, a block insulating layer on inner surfaces of a pair of through-holes formed in the first conductive layer, the insulating layer, and the second conductive layer, and on an inner surface of a connecting hole connecting lower ends of the pair of through-holes, a charge storage layer on the block insulating layer, a second layer on the charge storage layer, and a semiconductor layer on the second layer. The second layer includes an air gap layer on the charge storage layer in the pair of through-holes, and a third conductive layer on the charge storage layer in the connecting hole.

摘要翻译： 根据一个实施例，半导体存储器件包括第一层，第一导电层，绝缘层和堆叠在衬底上的第二导电层，在形成在衬底中的一对通孔的内表面上的块绝缘层 第一导电层，绝缘层和第二导电层，以及连接在一对通孔的下端的连接孔的内表面上，在块绝缘层上的电荷存储层，电荷上的第二层 存储层和第二层上的半导体层。 第二层包括一对通孔中的电荷存储层上的气隙层和连接孔中的电荷存储层上的第三导电层。

公开(公告)号：US20130075918A1

公开(公告)日：2013-03-28

申请号：US13405692

申请日：2012-02-27

申请人： Yoshiaki FUKUZUMI ,  Hideaki AOCHI ,  Tomoko FUJIWARA

发明人： Yoshiaki FUKUZUMI ,  Hideaki AOCHI ,  Tomoko FUJIWARA

IPC分类号： H01L23/48

CPC分类号： B82Y10/00 ,  G11C19/00 ,  G11C19/282 ,  G11C19/38 ,  H01L27/1052 ,  H01L27/1057 ,  H01L27/115 ,  H01L27/11517 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/788

摘要： In one embodiment, a shift register memory includes a substrate, and a channel layer provided on the substrate, and having a helical shape rotating around an axis which is perpendicular to a surface of the substrate. The memory further includes at least three control electrodes provided on the substrate, extending in a direction parallel to the axis, and to be used to transfer charges in the channel layer.

摘要翻译： 在一个实施例中，移位寄存器存储器包括衬底和设置在衬底上的沟道层，并且具有围绕垂直于衬底表面的轴线旋转的螺旋形状。 存储器还包括设置在基板上的至少三个控制电极，其在平行于该轴线的方向上延伸，并用于在沟道层中传送电荷。

公开(公告)号：US20100244186A1

公开(公告)日：2010-09-30

申请号：US12722920

申请日：2010-03-12

申请人： Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Masaru KIDOH ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI ,  Tomoko FUJIWARA

发明人： Ryota KATSUMATA ,  Masaru KITO ,  Yoshiaki FUKUZUMI ,  Masaru KIDOH ,  Hiroyasu TANAKA ,  Yosuke KOMORI ,  Megumi ISHIDUKI ,  Hideaki AOCHI ,  Ryouhei KIRISAWA ,  Junya MATSUNAMI ,  Tomoko FUJIWARA

IPC分类号： H01L27/10 ,  H01L21/822 ,  G11C17/16

CPC分类号： H01L27/1021 ,  H01L23/5252 ,  H01L27/0207 ,  H01L27/101 ,  H01L27/112 ,  H01L27/11206 ,  H01L2924/0002 ,  H01L2924/00

摘要： A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of stacked component units stacked in a first direction, each of the stacked component units including a first conducting film made of a semiconductor of a first conductivity type provided perpendicular to the first direction and a first insulating film stacked in the first direction with the first conducting film; a semiconductor pillar piercing the stacked structural unit in the first direction and including a conducting region of a second conductivity type, the semiconductor pillar including a first region opposing each of the first conducting films, and a second region provided between the first regions with respect to the first direction, the second region having a resistance different from a resistance of the first region; and a second insulating film provided between the semiconductor pillar and the first conducting film.

摘要翻译： 一种非易失性半导体存储器件，包括：堆叠结构单元，包括沿第一方向堆叠的多个堆叠的元件单元，每个堆叠元件单元包括由垂直于第一元件垂直设置的第一导电类型的半导体制成的第一导电膜 方向和与第一导电膜在第一方向上堆叠的第一绝缘膜; 所述半导体柱在所述第一方向上穿透所述层叠结构单元，并且包括第二导电类型的导电区域，所述半导体柱包括与所述第一导电膜相对的第一区域，以及设置在所述第一区域之间的第二区域， 所述第一方向，所述第二区域具有与所述第一区域的电阻不同的电阻; 以及设置在所述半导体柱和所述第一导电膜之间的第二绝缘膜。

公开(公告)号：US20130242634A1

公开(公告)日：2013-09-19

申请号：US13599228

申请日：2012-08-30

申请人： Yoshiaki FUKUZUMI ,  Hideaki Aochi

发明人： Yoshiaki FUKUZUMI ,  Hideaki Aochi

IPC分类号： G11C19/02

CPC分类号： H01L27/228 ,  G11C11/14 ,  G11C11/15 ,  G11C11/155 ,  G11C11/16 ,  G11C11/161 ,  G11C11/1675 ,  G11C19/02 ,  G11C19/0808 ,  G11C19/0833 ,  H01L27/22 ,  H01L43/02

摘要： A shift register memory according to the present embodiment includes a magnetic pillar including a plurality of magnetic layers and a plurality of nonmagnetic layers provided between the magnetic layers adjacent to each other. A stress application part applies a stress to the magnetic pillar. A magnetic-field application part applies a static magnetic field to the magnetic pillar. The stress application part applies the stress to the magnetic pillar in order to transfer magnetization states of the magnetic layers in a stacking direction of the magnetic layers.

摘要翻译： 根据本实施例的移位寄存器存储器包括具有多个磁性层的磁柱和设置在彼此相邻的磁性层之间的多个非磁性层。 应力施加部分对磁柱施加应力。 磁场施加部分将静磁场施加到磁柱。 应力施加部分将应力施加到磁柱，以便在磁性层的堆叠方向上传递磁性层的磁化状态。

公开(公告)号：US20110235436A1

公开(公告)日：2011-09-29

申请号：US13046894

申请日：2011-03-14

申请人： Yoshiaki FUKUZUMI ,  Hideaki Aochi

发明人： Yoshiaki FUKUZUMI ,  Hideaki Aochi

IPC分类号： G11C16/04 ,  H01L23/525

CPC分类号： H01L27/2463 ,  G11C13/0007 ,  G11C16/04 ,  G11C2213/73 ,  H01L23/525 ,  H01L23/528 ,  H01L27/2436 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor memory device according to one embodiment of the present invention includes a dielectric film configured to store information depending on presence or absence of a conductive path therein, and a plurality of electrodes provided to contact a first surface of the dielectric film. The conductive path can be formed between two electrodes arbitrarily selected form the plurality of electrodes. The conductive path has a rectifying property of allowing a current to flow more easily in a first direction connecting arbitrary two electrodes than in a second direction opposite to the first direction. The largest possible number of the conductive paths that may be formed is larger than the number of the plurality of electrodes.

摘要翻译： 根据本发明的一个实施例的半导体存储器件包括：电介质膜，被配置为根据存在或不存在导电路径来存储信息;以及多个电极，设置成与电介质膜的第一表面接触。 导电路径可以形成在从多个电极任意选择的两个电极之间。 导电路径具有使电流在连接任意两个电极的第一方向上比在与第一方向相反的第二方向更容易流动的整流特性。 可能形成的最大可能数量的导电路径大于多个电极的数量。

公开(公告)号：US20130109157A1

公开(公告)日：2013-05-02

申请号：US13723601

申请日：2012-12-21

申请人： Masaru KITO ,  Yoshiaki FUKUZUMI ,  Masaru KIDOH ,  Megumi ISHIDUKI ,  Yosuke KOMORI ,  Hiroyasu TANAKA ,  Ryota KATSUMATA ,  Hideaki AOCHI

发明人： Masaru KITO ,  Yoshiaki FUKUZUMI ,  Masaru KIDOH ,  Megumi ISHIDUKI ,  Yosuke KOMORI ,  Hiroyasu TANAKA ,  Ryota KATSUMATA ,  Hideaki AOCHI

IPC分类号： H01L29/792

CPC分类号： H01L29/7926 ,  H01L27/0688 ,  H01L27/11551 ,  H01L27/11556 ,  H01L29/7881

摘要： A non-volatile semiconductor storage device includes a plurality of memory strings each having a plurality of electrically rewritable memory cells connected in series. Each of the memory strings comprising: a first semiconductor layer including a columnar portion extending in a vertical direction with respect to a substrate; a plurality of first conductive layers formed to surround side surfaces of the columnar portions via insulation layers, and formed at a certain pitch in the vertical direction, the first conductive layers functioning as floating gates of the memory cells; and a plurality of second conductive layers formed to surround the first conductive layers via insulation layers, and functioning as control electrodes of the memory cells. Each of the first conductive layers has a length in the vertical direction that is shorter than a length in the vertical direction of each of the second conductive layers.

摘要翻译： 非挥发性半导体存储装置包括多个存储串，每个存储串具有串联连接的多个电可重写存储单元。 每个存储器串包括：第一半导体层，包括相对于衬底在垂直方向上延伸的柱状部分; 多个第一导电层，经由绝缘层形成为围绕柱状部分的侧表面，并以垂直方向上的一定间距形成，第一导电层用作存储器单元的浮动栅极; 以及形成为经由绝缘层包围第一导电层并且用作存储单元的控制电极的多个第二导电层。 每个第一导电层在垂直方向上具有比每个第二导电层的垂直方向上的长度短的长度。