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公开(公告)号：US20130153271A1
公开(公告)日：2013-06-20
申请号：US13764931
申请日：2013-02-12
CPC分类号： H05K3/188 , H01L21/563 , H01L21/568 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/12042 , H01L2924/15311 , H05K1/0313 , H05K1/09 , H05K1/113 , H05K3/205 , H05K3/244 , H05K3/282 , H05K3/383 , H05K3/4682 , H05K2201/09472 , H05K2201/09563 , H05K2203/0361 , Y10T29/4916 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.
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公开(公告)号：US20190246502A1
公开(公告)日：2019-08-08
申请号：US16263196
申请日：2019-01-31
发明人： Michiro Ogawa
摘要： An electronic component-embedded substrate includes a first insulation layer having a quadrangular cavity formed therein, and an electronic component arranged in the cavity. The cavity has two adjacent first inner wall surfaces, protrusions protruding inward from the two first inner wall surfaces, respectively, and two adjacent inclined second inner wall surfaces arranged at opposite sides to the two first inner wall surfaces and inclined downward from an outer side toward an inner side. The electronic component is in contact with the protrusions of the cavity.
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公开(公告)号：US09257373B2
公开(公告)日：2016-02-09
申请号：US14170900
申请日：2014-02-03
发明人： Junichi Nakamura , Kotaro Kodani , Michiro Ogawa
IPC分类号： H05K1/00 , H05K1/02 , H05K3/46 , H01L23/495 , H01L23/498 , H01L23/00 , H05K3/00 , H05K3/28
CPC分类号： H01L23/49544 , H01L23/49822 , H01L24/97 , H01L2224/16 , H01L2224/16235 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H05K1/0271 , H05K3/0052 , H05K3/284 , H05K3/4682 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/2009 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.
摘要翻译： 布线基板包括布线形成区域，其中堆叠多个布线层，同时夹着绝缘层;外周区域布置在布线形成区域周围，并且其中加强图案形成在与每个布线形成区域相同的层中 接线层。 增强图案与外周区域的面积比和布线层与布线形成区域的面积比在各层中基本相同，并且当外围区域中没有间隙时，增强图案在外周区域中不存在间隙 接线板以平面视角观看。
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公开(公告)号：US10524361B2
公开(公告)日：2019-12-31
申请号：US16263196
申请日：2019-01-31
发明人： Michiro Ogawa
摘要： An electronic component-embedded substrate includes a first insulation layer having a quadrangular cavity formed therein, and an electronic component arranged in the cavity. The cavity has two adjacent first inner wall surfaces, protrusions protruding inward from the two first inner wall surfaces, respectively, and two adjacent inclined second inner wall surfaces arranged at opposite sides to the two first inner wall surfaces and inclined downward from an outer side toward an inner side. The electronic component is in contact with the protrusions of the cavity.
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5.发明授权Method of manufacturing a wiring board having pads highly resistant to peeling 有权制造具有耐剥离性的焊盘的布线板的制造方法公开(公告)号：US09024207B2
公开(公告)日：2015-05-05
申请号：US13764938
申请日：2013-02-12
IPC分类号： H05K1/11 , H05K3/18 , H01L21/56 , H01L23/498 , H01L23/00 , H05K3/46 , H05K1/03 , H05K1/09 , H05K3/20 , H05K3/24 , H05K3/28 , H05K3/38
CPC分类号： H05K3/188 , H01L21/563 , H01L21/568 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/12042 , H01L2924/15311 , H05K1/0313 , H05K1/09 , H05K1/113 , H05K3/205 , H05K3/244 , H05K3/282 , H05K3/383 , H05K3/4682 , H05K2201/09472 , H05K2201/09563 , H05K2203/0361 , Y10T29/4916 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer, a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.
摘要翻译： 布线板包括从最外绝缘层的开口部分露出的焊盘。 焊盘包括：第一金属层，其表面从布线板露出; 第二金属层，设置在第一金属层上，由有效防止基板内的通孔内的金属扩散入第一金属层的材料形成; 以及设置在第二金属层和通孔之间的第三金属层，并且由比第二金属层更难被氧化的材料形成。 第三金属层的厚度相对较厚，优选选择为第二金属层的厚度的三倍以上。 第三金属层的侧表面和要连接通孔的第三金属层的表面被粗糙化。
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6.发明授权Wiring substrate, method for manufacturing the wiring substrate, and semiconductor package 有权布线基板，布线基板的制造方法以及半导体封装公开(公告)号：US09232642B2
公开(公告)日：2016-01-05
申请号：US13936443
申请日：2013-07-08
IPC分类号： H01L23/373 , H05K1/02 , H01L23/48 , H01L25/10 , H05K3/46 , H01L23/14 , H01L23/498 , H01L23/485
CPC分类号： H05K1/0298 , H01L23/145 , H01L23/373 , H01L23/3731 , H01L23/3733 , H01L23/3735 , H01L23/48 , H01L23/485 , H01L23/49822 , H01L25/105 , H01L2224/13111 , H01L2224/16238 , H01L2224/32225 , H01L2224/48091 , H01L2224/48229 , H01L2224/73204 , H01L2225/1023 , H01L2225/1058 , H05K3/4682 , H05K2201/068 , H05K2201/096 , H01L2924/00014 , H01L2224/16225 , H01L2924/00 , H01L2924/01047 , H01L2924/01029
摘要： A wiring substrate includes an insulating layer including a reinforcement member and having a first surface and a second surface positioned on an opposite side of the first surface, an electrode pad exposed from the first surface, a layered body including first insulating layers and being formed on the second surface, the first insulating layers having a first insulating material as a main component, another layered body including second insulating layers and being formed on the layered body, the second insulating layers having a second insulating material as a main component, and another electrode pad exposed from a surface of the another layered body that is opposite to the layered body. The number of the first insulating layers is equal to that of the second insulating layers. The first insulating layers have a thermal expansion coefficient that is greater than that of the second insulating layers.
摘要翻译： 布线基板包括绝缘层，该绝缘层包括加强构件，并且具有位于第一表面的相反侧的第一表面和第二表面，从第一表面暴露的电极焊盘，包括第一绝缘层并且形成在 所述第二表面，所述第一绝缘层具有第一绝缘材料作为主要成分，所述第二绝缘层包括第二绝缘层，并且形成在所述层叠体上，所述第二绝缘层具有第二绝缘材料作为主要成分， 衬垫从与层状体相对的另一分层体的表面露出。 第一绝缘层的数量等于第二绝缘层的数量。 第一绝缘层的热膨胀系数大于第二绝缘层的热膨胀系数。
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公开(公告)号：US20130185936A1
公开(公告)日：2013-07-25
申请号：US13764938
申请日：2013-02-12
IPC分类号： H05K3/18
CPC分类号： H05K3/188 , H01L21/563 , H01L21/568 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/12042 , H01L2924/15311 , H05K1/0313 , H05K1/09 , H05K1/113 , H05K3/205 , H05K3/244 , H05K3/282 , H05K3/383 , H05K3/4682 , H05K2201/09472 , H05K2201/09563 , H05K2203/0361 , Y10T29/4916 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.
摘要翻译： 布线板包括从最外绝缘层的开口部分露出的焊盘。 焊盘包括：第一金属层，其表面从布线板露出; 第二金属层，设置在第一金属层上，由有效防止基板内的通孔内的金属扩散入第一金属层的材料形成; 以及设置在第二金属层和通孔之间的第三金属层，并且由比第二金属层更难被氧化的材料形成。 第三金属层的厚度相对较厚，优选选择为第二金属层的厚度的三倍以上。 第三金属层的侧表面和要连接通孔的第三金属层的表面被粗糙化。
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