Abstract:
A semiconductor memory device includes a semiconductor circuit substrate having a chip pad forming region. A pair of data lines are formed on the semiconductor circuit substrate at one side of the chip pad region. The pair of data lines extend along a direction that the chip pad region of the semiconductor circuit substrate extends. The pair of data lines are arranged to be adjacent to each other and receive a pair of differential data signals. A power supply line is formed on the semiconductor circuit substrate at the other side of the chip pad region. The power supply line extends along the direction that the chip pad region of the semiconductor circuit substrate extends, and the power supply line receives power.
Abstract:
A reset signal generation apparatus includes a reset signal generation unit and a reset signal expansion unit. The reset signal generation unit enables a reset signal and an enable signal in response to a reset input signal, and disables the reset signal in response to a pulse width extension signal. The reset signal expansion unit generates the pulse width extension signal that is enabled for a predetermined time, in response to the enable signal.
Abstract:
A processing-in-memory device includes a memory cell array including a plurality of memory cells coupled to a plurality of word lines and a plurality of bit lines, a sense amplifier circuit coupled to the plurality of bit lines, and a control circuit configured to perform a row data copy operation that copies data of a first word line to a second word line, among the plurality of word lines. The control circuit is configured to sequentially perform operations according to an active control signal, a row close control signal, and a row open control signal to perform the row data copy operation.
Abstract:
An integrated circuit may be provided. The integrated circuit may include a transmitter and a receiver. The transmitter outputs first transmission data to a first channel and outputs second transmission data to a second channel. The phase of the first transmission data transmitted through the first channel is different from a phase of the second transmission data transmitted through the second channel.
Abstract:
A semiconductor memory device includes a semiconductor circuit substrate having a chip pad forming region. A pair of data lines are formed on the semiconductor circuit substrate at one side of the chip pad region. The pair of data lines extend along a direction that the chip pad region of the semiconductor circuit substrate extends. The pair of data lines are arranged to be adjacent to each other and receive a pair of differential data signals. A power supply line is formed on the semiconductor circuit substrate at the other side of the chip pad region. The power supply line extends along the direction that the chip pad region of the semiconductor circuit substrate extends, and the power supply line receives power.
Abstract:
A memory device includes a plurality of memory circuits, and a filtering circuit. The filtering circuit is configured to perform a filtering operation on data and to transmit filtered data to the plurality of memory circuits or to outside of the memory device.
Abstract:
A clock generation circuit includes a delay line, a delay modeling block, a phase detection block, a multi-update signal generation block, and a delay line. The delay line delays an input clock and generates a delayed clock. The delay modeling block delays the delayed clock by a modeled delay value and generates a feedback clock. The phase detection block compares phases of the input clock and the feedback clock and generates phase information, and quantizes a phase difference between the input clock and the feedback clock and generates phase codes. The multi-update signal generation block generates a multi-update signal in response to the phase codes. The delay line control block changes a delay amount of the delay line in response to the multi-update signal and the phase information.
Abstract:
Semiconductor devices are provided. The semiconductor device may include a current generation circuit and an internal circuit. The current generation circuit may include a first drive element and a second drive element which are connected in series. The current generation circuit may generate a reference voltage signal whose voltage level is set by a reference current which is identical or substantially identical to a current flowing through the first and second drive elements. The internal circuit may utilize an output current controlled according to the reference current as an operation current thereof.
Abstract:
A semiconductor memory device includes a semiconductor circuit substrate having a chip pad forming region. A pair of data lines are formed on the semiconductor circuit substrate at one side of the chip pad region. The pair of data lines extend along a direction that the chip pad region of the semiconductor circuit substrate extends. The pair of data lines are arranged to be adjacent to each other and receive a pair of differential data signals. A power supply line is formed on the semiconductor circuit substrate at the other side of the chip pad region. The power supply line extends along the direction that the chip pad region of the semiconductor circuit substrate extends, and the power supply line receives power.
Abstract:
A delay circuit includes a clock delay line, a command delay line, a delay line control block, and a shared shift register block. The clock delay line delays an input clock and generates a delayed clock. The command delay line delays a command signal and generates a delayed command signal. The delay line control block generates a control signal according to a result of comparing phases of a feedback clock which is generated as the delayed clock is delayed by a modeled delay value and the input clock. The shared shift register block sets delay amounts of the clock delay line and the command delay line to be substantially the same with each other, in response to the control signal.