Nitride semiconductor ultraviolet light-emitting element

    公开(公告)号:US10297715B2

    公开(公告)日:2019-05-21

    申请号:US15573824

    申请日:2015-07-21

    摘要: A nitride semiconductor ultraviolet light-emitting element comprises an underlying portion that includes a substrate that is composed of sapphire and has a surface inclined to a (0001) surface so as to form a multi-step terrace, and an AlN layer formed on a surface of the substrate, and a light-emitting portion that is formed on a surface of the underlying portion and includes an active layer having an AlGaN based semiconductor layer. At least the AlN layer of the underlying portion, the active layer of the light-emitting portion, and each layer between the AlN layer and the active layer are formed by step flow growth in which a side surface of a multi-step terrace grows so as to achieve two-dimensional growth. The active layer has a quantum well structure including at least a well layer composed of AlGaN. The average roughness of a 25 μm by 25 μm region on a surface of the active layer is a thickness of the well layer or more and 10 nm or less.

    Nitride semiconductor ultraviolet light-emitting element
    3.
    发明授权
    Nitride semiconductor ultraviolet light-emitting element 有权
    氮化物半导体紫外线发光元件

    公开(公告)号:US09502606B2

    公开(公告)日:2016-11-22

    申请号:US15140300

    申请日:2016-04-27

    摘要: A nitride semiconductor ultraviolet light-emitting element is provided with: an underlying structure portion including a sapphire (0001) substrate and an AlN layer formed on the substrate; and a light-emitting element structure portion including an n-type cladding layer of an n-type AlGaN based semiconductor layer, an active layer having an AlGaN based semiconductor layer, and a p-type cladding layer of a p-type AlGaN based semiconductor layer, formed on the underlying structure portion. The (0001) surface of the substrate is inclined at an off angle which is equal to or greater than 0.6° and is equal to or smaller than 3.0°, and an AlN molar fraction of the n-type cladding layer is equal to or higher than 50%.

    摘要翻译: 氮化物半导体紫外线发光元件设置有:底层结构部分,包括蓝宝石(0001)基板和形成在基板上的AlN层; 以及包括n型AlGaN基半导体层的n型包覆层,具有AlGaN基半导体层的有源层和p型AlGaN系半导体的p型包层的发光元件结构部分 层,形成在下面的结构部分上。 衬底的(0001)表面以等于或大于0.6°并且等于或小于3.0°的偏角倾斜,并且n型包覆层的AlN摩尔分数等于或等于 超过50%。

    Nitride Semiconductor Light Emitting Element
    4.
    发明申请
    Nitride Semiconductor Light Emitting Element 审中-公开
    氮化物半导体发光元件

    公开(公告)号:US20170077351A1

    公开(公告)日:2017-03-16

    申请号:US15113014

    申请日:2014-01-21

    摘要: A nitride semiconductor light emitting element comprises a sapphire substrate, and a light emitting element structure portion that has a plurality of nitride semiconductor layers formed on the sapphire substrate. The nitride semiconductor light emitting element is a back-surface-emitting type nitride semiconductor light emitting element that outputs light from the light emitting element structure portion to an outside of the element through the sapphire substrate. The nitride semiconductor light emitting element is divided into a chip whose planarly-viewed shape is a square or a rectangle. A thickness of the sapphire substrate is 0.45 to 1 times an average length of sides of the planarly-viewed shape of the chip.

    摘要翻译: 氮化物半导体发光元件包括蓝宝石衬底和在蓝宝石衬底上形成有多个氮化物半导体层的发光元件结构部分。 氮化物半导体发光元件是通过蓝宝石衬底将来自发光元件结构部分的光输出到元件的外部的背面发射型氮化物半导体发光元件。 氮化物半导体发光元件被分割为平面观看形状为矩形或矩形的芯片。 蓝宝石衬底的厚度是芯片的平面观看形状的平均长度的0.45至1倍。

    Nitride semiconductor light emitting element

    公开(公告)号:US10396244B2

    公开(公告)日:2019-08-27

    申请号:US15113014

    申请日:2014-01-21

    摘要: A nitride semiconductor light emitting element comprises a sapphire substrate, and a light emitting element structure portion that has a plurality of nitride semiconductor layers formed on the sapphire substrate. The nitride semiconductor light emitting element is a back-surface-emitting type nitride semiconductor light emitting element that outputs light from the light emitting element structure portion to an outside of the element through the sapphire substrate. The nitride semiconductor light emitting element is divided into a chip whose planarly-viewed shape is a square or a rectangle. A thickness of the sapphire substrate is 0.45 to 1 times an average length of sides of the planarly-viewed shape of the chip.