摘要:
A single crystal heat treatment method having a step of heating a single crystal of a specific cerium-doped silicate compound in an oxygen-poor atmosphere at a temperature T1 (units: ° C.) that satisfies the conditions represented by formula (3) below 800≦T1
摘要:
An all welded square bottomed stainless steel cylinder and dip tube device for transferring by vapor deposition very reactive electronic grade organometallic liquid to a deposition system includes a top fill opening and inlet and outlet diaphragm valves, and is coated on the interior with PVF Teflon to several thousandths of an inch thickness. Contamination of the liquid is eliminated or at least substantially minimized since the device is stable in an upright position, the diaphragm valves each have a very small and inert area exposed to the liquid, and the coating serves as a barrier to contamination of the liquid by the metal of which the cylinder and dip tube are made.
摘要:
A PROCESS FOR MASKED PLANAR DIFFUSION OF GALLIUM INTO THE UNMASKED PORTION OF A BULK SEMICONDUCTOR IS DESCRIBED IN WHICH THE DIFFUSION OCCURS IN A COMPLETELY WATER-FREE INERT AMBIENT SUCH AS NITROGEN GAS. A QUARTZ BOX DIFFUSION CAPSULE IS USED WITH A CONVENTIONAL DIFFUSION FURNACE IN WHICH THE NITROGEN CIRCULATES THROUGHOUT THE PROCESS.
摘要:
909,869. Semi-conductor devices. WESTERN ELECTRIC CO. Inc. June 3, 1959 [June 9, 1958], No. 18920/59. Class 37. A silicon body into which an impurity is to be introduced is subjected to an atmosphere including the impurity in the vapour form for such a time and at such a temperature that a layer of glass is produced on the surface of the body with an impurity diffused layer beneath the glass; the glass is then removed by etching and the body heated so as to cause the impurity to diffuse further into the body. The Specification states that the concentration of the impurity measured after removal of the glass is found to be a constant substantially independent of both vapour pressure and temperature of the silicon. In the arrangement shown in Fig. 1, the silicon body is mounted on a base 12 with a closely fitting lid and made of fused alumina or platinum and is placed in a silicon furnace tube 11 through which flows an atmosphere which is interchanged with that in the box. Where boron is the impurity the body is first etched and plated or may have an oxidized layer produced on its surface as described in Specification 809,644. Boron trioxide is plated in the bottom of the box and the silicon body 13 placed on a platform 15. The box restricts the volume in which the source material vaporizes so as to provide an excess of impurity in contact with the silicon. The diffusion step may be conducted at a temperature in the range 700‹ to 1300‹ C. At temperature below 1150‹ C. the atmosphere may be an inert gas, e.g. nitrogen argon or helium; at temperatures above 1150‹ C. oxygen must be introduced to prevent the silicon from pitting. A dark deposit which sometimes occurs may be avoided by using a mixture of boron trioxide and silicon dioxide. The resultant body has a layer in which the impurity predominates and a layer of glass. The glass is removed by means of an etchant which does not attack the silicon, e.g. hydrofluoric acid and is then placed on a platform in a furnace of the type described above, and heated for a time and temperature determined by the degree of diffusion required in an atmosphere of pure oxygen or of oxygen and an inert gas. A temperature of from 700‹ to 1350‹ C. is suggested but 1100‹ to 1300‹ C. is preferred. In an arrangement for depositing phosphorous (Fig. 2) from phosphorous pentoxide in a container 29 kept by a heating coil at 275‹ to 230‹ C. a gas containing the phosphorous vapour flows over the silicon 22 which is maintained at from 700‹ to 1300‹ C. The Specification indicates the possibility of using antimony. Whatever the impurity it must be capable of forming a glass with silicon. If the impurity source is not an oxide either pre-oxidized silicon or an oxygen atmosphere must be used. Specification 816,799 also is referred to.
摘要:
The present invention is a method for manufacturing a substrate for a solar cell composed of a single crystal silicon, including the steps of: producing a silicon single crystal ingot; slicing a silicon substrate from the silicon single crystal ingot; and subjecting the silicon substrate to low temperature thermal treatment at a temperature of 800° C. or more and less than 1200° C., wherein the silicon single crystal ingot or the silicon substrate is subjected to high temperature thermal treatment at a temperature of 1200° C. or more for 30 seconds or more before the low temperature thermal treatment. As a result, it is possible to provide a method for manufacturing a substrate for a solar cell that can prevent decrease in the minority carrier lifetime of the substrate even when the substrate has higher oxygen concentration.
摘要:
The present invention provides a method for producing a template for epitaxial growth, the method including: a surface treatment step of dispersing Ga atoms on a surface of a sapphire substrate; and an AlN growth step of epitaxially growing an AlN layer on the sapphire substrate, wherein in a Ga concentration distribution in a depth direction perpendicular to the surface of the sapphire substrate in an internal region of the AlN layer excluding a near-surface region up to a depth of 100 nm from the surface of the AlN layer, which is obtained by secondary ion mass spectrometry, a position in the depth direction where the Ga concentration takes the maximum value is present in a near-interface region located between the interface of the sapphire substrate and a position at 400 nm spaced apart from the interface to the AlN layer side, and the maximum value of the Ga concentration is 3×1017 atoms/cm3 or more and 2×1020 atoms/cm3 or less.
摘要翻译:本发明提供一种外延生长用模板的制造方法,其特征在于,包括:在蓝宝石基板的表面分散Ga原子的表面处理工序; 以及在蓝宝石衬底上外延生长AlN层的AlN生长步骤,其中在AlN层的内部区域中垂直于蓝宝石衬底的表面的深度方向的Ga浓度分布,除了近表面区域 通过二次离子质谱法获得的AlN层的表面的深度为100nm,Ga浓度达到最大值的深度方向的位置存在于位于 蓝宝石衬底和与AlN层侧的界面间隔开的400nm的位置,Ga浓度的最大值为3×10 17原子/ cm 3以上且2×10 20原子/ cm 3以下。
摘要:
A laser medium comprises a solid-state host material and dopant species provided within the solid-state host material. A first portion of the dopant species has a first valence state, and a second portion of the dopant species has a second valence state. In an embodiment, a concentration of the first portion of the dopant species decreases radially with increasing distance from a center of the medium, and a concentration of the second portion of the dopant species increases radially with increasing distance from the center of the medium. The laser medium further comprises impurities within the solid-state host material, the impurities converting the first portion of the dopant species having the first valence state into the second portion of dopant species having the second valence state.
摘要:
DOPING OF THE SURFACE OF A METAL-OXYGEN COMPOUND BY EXPOSURE TO AND CHEMISORPTION OF A REACTIVE GAS COMPRISING AN OXYGEN-REPLACING ELEMENT IS EFFECTED AT SUCH A LOW TEMPERATURE THAT THE ADSORBED GAS IS NOT DECOMPOSED. A CORRECT QUANTITY OF REACTIVE GAS BEING ADSORBED THEN LEADS TO DISCRETE ADSORPTION DENSITIES OF LESS THAN 1. USED FOR SHIFTING THE PHOTOSENSITIVITY OF A LEAD MONOXIDE TARGET PLATE FOR A CAMERA TUBE OF THE VIDICON TYPE TO LONGER WAVELENGTHS.
摘要:
The present invention provides a method for producing a template for epitaxial growth, the method including: a surface treatment step of dispersing Ga atoms on a surface of a sapphire substrate; and an AlN growth step of epitaxially growing an AlN layer on the sapphire substrate, wherein in a Ga concentration distribution in a depth direction perpendicular to the surface of the sapphire substrate in an internal region of the AlN layer excluding a near-surface region up to a depth of 100 nm from the surface of the AlN layer, which is obtained by secondary ion mass spectrometry, a position in the depth direction where the Ga concentration takes the maximum value is present in a near-interface region located between the interface of the sapphire substrate and a position at 400 nm spaced apart from the interface to the AlN layer side, and the maximum value of the Ga concentration is 3×1017 atoms/cm3 or more and 2×1020 atoms/cm3 or less.
摘要翻译:本发明提供一种外延生长用模板的制造方法,其特征在于,包括:在蓝宝石基板的表面分散Ga原子的表面处理工序; 以及在蓝宝石衬底上外延生长AlN层的AlN生长步骤,其中在AlN层的内部区域中垂直于蓝宝石衬底的表面的深度方向的Ga浓度分布,除了近表面区域 通过二次离子质谱法获得的AlN层的表面的深度为100nm,Ga浓度达到最大值的深度方向的位置存在于位于 蓝宝石衬底和与AlN层侧的界面间隔开的400nm的位置,Ga浓度的最大值为3×10 17原子/ cm 3以上且2×10 20原子/ cm 3以下。
摘要:
The invention relates to a method of selective doping of a material by a) radiating a predetermined pre-treated pattern/region into the material, b) treating the material for producing reactive groups in the pre-treated pattern/region, and c) doping the material by the atomic layer deposition method for producing a pattern/region doped with a dopant in the material. The invention further relates to a selectively doped material, a system for preparing a selectively doped material, and use of said method.