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Patent Agency Ranking
公开(公告)号：US20020009597A1
公开(公告)日：2002-01-24
申请号：US09863288
申请日：2001-05-24
Applicant: SONY CHEMICALS CORP.
Inventor： Junji Shinozaki , Motohide Takeichi
IPC: B32B027/38 , C08F008/00
CPC classification number: C08G59/5073 , C08L2666/16 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29355 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01045 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , Y10T428/12569 , Y10T428/31511 , H01L2924/066 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.
Abstract translation: 可用于将半导体器件安装在半导体器件的电路基板上的连接材料包含以下组分A至C：（A）环氧树脂; （B）具有两个或多个酚羟基的酚化合物; 和（C）潜在性固化剂，优选如果组分B的酚化合物的酚羟基当量数与连接材料中环氧树脂的环氧当量数的比例为0.2〜1.0 。
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公开(公告)号：US20020098319A1
公开(公告)日：2002-07-25
申请号：US09987396
申请日：2001-11-14
Applicant: SONY CHEMICALS CORP.
Inventor： Motohide Takeichi , Junji Shinozaki
IPC: H05K007/00 , H05K005/00 , G06F001/16 , B32B003/06 , H01R013/64 , H01R024/00
CPC classification number: H05K3/323 , H01L21/563 , H01L23/295 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/3511 , H05K1/189 , H05K2201/0209 , H05K2201/0245 , H05K2201/0248 , H05K2201/0251 , H05K2201/10674 , Y10T428/24008 , H01L2924/00 , H01L2224/0401
Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.
Abstract translation: 本发明是一种连接材料，其能够使柔性电路板连接到裸IC芯片而不产生肩部接触效果。 连接材料包含绝缘粘合剂，其中分散在其中的片状或纤维绝缘填料用于连接薄膜状柔性电路板和裸IC芯片。 片状或纤维状绝缘填料的纵横比不小于20。
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公开(公告)号：US20040029992A1
公开(公告)日：2004-02-12
申请号：US10633614
申请日：2003-08-05
Applicant: SONY CHEMICALS CORP.
Inventor： Motohide Takeichi , Junji Shinozaki
IPC: C08L015/00 , B32B007/12 , B32B015/04
CPC classification number: H01L24/83 , C09J11/04 , H01L24/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29355 , H01L2224/29386 , H01L2224/32225 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , Y10T428/2852 , H01L2924/00 , H01L2924/3512 , H01L2924/05432 , H01L2924/00014 , H01L2924/05442 , H01L2924/05032 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
Abstract: An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m2/g) satisfies Equation (1) below, their mean particle size D1 (nullm) and maximum particle size D2 (nullm) respectively satisfy Equations (2) and (3) below, 3
Abstract translation: 粘合材料用于将电子部件的突出电极连接到电路板的端子电极，用于通过包含至少一种可固化树脂和无机颗粒的粘合剂材料承载所述电子部件。 粘合剂材料的特征在于，对于无机颗粒，其比表面积S（m 2 / g）分别满足下面的等式（1），其平均粒度D1（母体）和最大粒径D2（母体）分别 满足下面的等式（2）和（3），3
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公开(公告)号：US20020062918A1
公开(公告)日：2002-05-30
申请号：US09971040
申请日：2001-10-05
Applicant: SONY CHEMICALS CORP.
Inventor： Motohide Takeichi , Misao Konishi , Junji Shinozaki , Yasushi Akutsu
IPC: B32B031/00 , C09J005/00
CPC classification number: C08G59/18 , C09J163/00 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83101 , H01L2224/83192 , H01L2224/83856 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01082 , H01L2924/04953 , H01L2924/10253 , Y10T428/12528 , Y10T428/12569 , H01L2924/00 , H01L2224/0401
Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.
Abstract translation: 用于半导体芯片的粘合剂包含可聚合的第一树脂组分，用于引发第一树脂组分的自聚合反应的第一固化剂和与第一树脂组分加成聚合的第二固化剂。 当将粘合剂施加到布线板上并在其上施加半导体芯片并施加热量时，将第二固化剂与由第一树脂组分的自聚合反应形成的三维网络的主链进行加成聚合。 加成聚合区成为橡胶结构的第一温度低于主链变成橡胶结构的第二温度，使得弹性模量损耗在第一温度急剧增加，以减小半导体芯片和 接线板
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公开(公告)号：US20010026866A1
公开(公告)日：2001-10-04
申请号：US09809279
申请日：2001-03-16
Applicant: SONY CHEMICALS CORP
Inventor： Yasuhiro Suga , Motohide Takeichi
IPC: B32B003/00 , C09J001/00
CPC classification number: H01L24/28 , C08L2666/54 , C09J5/06 , C09J9/02 , C09J163/00 , H01B1/22 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H05K2201/0314 , H05K2201/0367 , H05K2201/10674 , Y10T428/24917 , Y10T428/25 , H01L2924/00 , H01L2924/3512
Abstract: An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (Enull) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1). 0.02nullE/Enullnull0.5nullnull(1)
Abstract translation: 各向异性导电粘合剂材料由热固性树脂和分散在热固性树脂中的导电颗粒构成，其中导电颗粒中10％的压缩弹性模量（E）和突出电极的纵向弹性模量（E'） 通过各向异性导电粘合剂材料连接的电子元件满足下述关系式（1）。 <段落lvl =“0”>
0.02 <= E / E'<= 0.5（1）
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