公开(公告)号：US09153476B2

公开(公告)日：2015-10-06

申请号：US13691464

申请日：2012-11-30

Applicant: STATS ChipPAC, Ltd.

Inventor： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

IPC: H01L21/44 ,  H01L21/768 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L21/76802 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49517 ,  H01L23/49527 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16245 ,  H01L2224/21 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/185 ,  H05K3/4682 ,  H01L2224/82 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81805 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias.

Abstract translation: 具有多个接触垫的预制多芯片引线框安装在临时载体上。 第一半导体管芯安装在引线框架的接触焊盘之间的载体上。 第二半导体管芯安装在引线框架的接触焊盘上并且在第一管芯上方。 密封剂沉积在引线框架和第一和第二裸片上。 载体被移除。 第一互连结构形成在引线框架和第一管芯以及密封剂的第一表面上。 通过密封剂和引线框架切割通道以分离接触垫。 可以通过密封剂形成多个导电通孔。 第二互连结构形成在密封剂的与密封剂的第一表面相对的第二表面上。 第二互连结构电连接到导电通孔。

公开(公告)号：US20130087898A1

公开(公告)日：2013-04-11

申请号：US13691464

申请日：2012-11-30

Applicant: STATS ChipPAC, Ltd.

Inventor： HeeJo Chi ,  YeongIm Park ,  HyungMin Lee

IPC: H01L21/768 ,  H01L23/495

CPC classification number: H01L21/76802 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49517 ,  H01L23/49527 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16245 ,  H01L2224/21 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2224/22 ,  H01L2224/221 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/185 ,  H05K3/4682 ,  H01L2224/82 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81805 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias.

Abstract translation: 具有多个接触垫的预制多芯片引线框安装在临时载体上。 第一半导体管芯安装在引线框的接触焊盘之间的载体上。 第二半导体管芯安装在引线框架的接触焊盘上并且在第一管芯上方。 密封剂沉积在引线框架和第一和第二裸片上。 载体被移除。 第一互连结构形成在引线框架和第一管芯以及密封剂的第一表面上。 通过密封剂和引线框架切割通道以分离接触垫。 可以通过密封剂形成多个导电通孔。 第二互连结构形成在密封剂的与密封剂的第一表面相对的第二表面上。 第二互连结构电连接到导电通孔。