公开(公告)号：US20130334675A1

公开(公告)日：2013-12-19

申请号：US13919536

申请日：2013-06-17

Applicant: STMicroelectronics S.r.I.

Inventor： Federico Giovanni ZIGLIOLI ,  Alberto PAGANI

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L23/642 ,  H01L21/441 ,  H01L21/50 ,  H01L21/561 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L28/40 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/07802 ,  H01L2924/00

Abstract: An embodiment of a packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor. Thus, well-established techniques for incorporating a lead frame or any other conductive system in a package may be applied in order to impart wireless lateral connectivity to packaged semiconductor devices in an electronic system.

Abstract translation: 封装半导体器件的实施例包括形成在侧表面中的通信焊盘，其可操作地耦合到通信电路，以便能够建立到相邻定位的封装半导体器件的无线通信信道。 可以在切割包括封装的半导体器件的块和适当定位和尺寸的导体时形成通信焊盘。 因此，可以应用用于将引线框架或任何其它导电系统并入封装中的完善的技术，以便赋予电子系统中的封装半导体器件无线横向连接性。

公开(公告)号：US20130285056A1

公开(公告)日：2013-10-31

申请号：US13869124

申请日：2013-04-24

Applicant: STMICROELECTRONICS S.R.I.

Inventor： Alberto PAGANI ,  Federico Giovanni ZIGLIOLI

IPC: H01L21/02 ,  H01L23/544

CPC classification number: H01L21/02 ,  H01L22/14 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/94 ,  H01L24/98 ,  H01L25/0657 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/02185 ,  H01L2224/022 ,  H01L2224/02215 ,  H01L2224/037 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05006 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/05601 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05644 ,  H01L2224/05681 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16147 ,  H01L2224/45099 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81375 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/85375 ,  H01L2224/85805 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/1461 ,  H01L2924/351 ,  H01L2924/01079 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/05442 ,  H01L2224/81 ,  H01L2924/01073 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A semiconductor structure includes at least a semiconductor body, a delimiting structure delimiting a cup-shaped recess in the body and a conductive region in the recess. The conductive region is made of a low-melting-temperature material, having a melting temperature lower than that of the materials forming the delimiting structure.

Abstract translation: 半导体结构至少包括半导体本体，限定本体中的杯形凹部的限定结构和凹部中的导电区域。 导电区域由低熔点材料制成，其熔点低于形成限定结构的材料的熔融温度。

公开(公告)号：US20140291850A1

公开(公告)日：2014-10-02

申请号：US14228370

申请日：2014-03-28

Applicant: STMicroelectronics S.r.I.

Inventor： Federico Giovanni ZIGLIOLI

IPC: H01L23/00

CPC classification number: H01L24/45 ,  B81C1/0023 ,  G01L9/0044 ,  G01L19/0076 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/16145 ,  H01L2224/2405 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48611 ,  H01L2224/48711 ,  H01L2224/48811 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/8293 ,  H01L2224/85205 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01029

Abstract: An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

Abstract translation: 提出了制造电子装置的实施例。 该实施例包括以下阶段：a）在包括主表面的半导体材料晶片中形成多个芯片; 每个芯片包括面向主表面的相应的集成电子部件和相应的接触垫片; 所述接触垫电耦合到集成电子部件; b）将至少一个导电带附接到每个芯片的至少一个接触垫; c）用一层塑料材料覆盖半导体材料晶片的主表面和至少一个导电带; d）研磨塑料材料层的暴露表面以去除塑料材料层的一部分，以至少露出至少一个导电带的部分，以及e）切割半导体材料晶片以分离芯片。