公开(公告)号：US20230245828A1

公开(公告)日：2023-08-03

申请号：US17940268

申请日：2022-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： SOOJAE PARK

IPC: H01G4/232 ,  H01G4/12 ,  H01G4/30 ,  H01G2/06 ,  H01G4/224 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01G4/2325 ,  H01G4/12 ,  H01G4/30 ,  H01G2/065 ,  H01G4/224 ,  H01L24/48 ,  H01L24/73 ,  H01L24/32 ,  H01L25/16 ,  H01L24/16 ,  H01L2924/19041 ,  H01L2224/32195 ,  H01L2224/48195 ,  H01L2224/73253 ,  H01L2224/16195

Abstract: A capacitor wire includes a core electrode line provided in the form of a wire, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line. The outer electrode line comprises material having a melting point lower than material of the core electrode line.

公开(公告)号：US20240006122A1

公开(公告)日：2024-01-04

申请号：US18111617

申请日：2023-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： SOOJAE PARK

IPC: H01G2/06 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01G2/065 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/32 ,  H01L24/16 ,  H01L28/60 ,  H01L2924/19041 ,  H01L2224/48249 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/16225

Abstract: Disclosed are capacitor wires and electronic devices including the same. The capacitor wire comprises a core electrode line having a wire shape extending in a length direction, an outer electrode line that covers at least a portion of the core electrode line and extends in the length direction of the core electrode line, and a dielectric line between the core electrode line and the outer electrode line and extending in the length direction of the core electrode line. The dielectric line has a porous structure including a plurality of holes.

公开(公告)号：US20150115468A1

公开(公告)日：2015-04-30

申请号：US14457493

申请日：2014-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsuk CHUN ,  SOOJAE PARK ,  SEUNGBAE LEE ,  SANGSU HA

IPC: H05K1/18 ,  H01L23/522 ,  H05K1/11 ,  H01L25/065

CPC classification number: H05K1/18 ,  H01L23/5226 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/13014 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81121 ,  H01L2224/81141 ,  H01L2224/81815 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/11 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a semiconductor package including a wiring substrate having top and bottom surfaces facing each other. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.

Abstract translation: 提供一种半导体封装，其包括具有彼此面对的顶表面和底表面的布线基板。 第一半导体芯片以倒装芯片的方式设置在布线基板上。 第一半导体芯片具有面对布线基板的上表面的第一表面和与第一表面相对的第二表面。 第一连接构件设置在布线基板和第一半导体芯片之间。 第一连接构件包括每个包括一个或多个磁性材料的第一和第二接触构件。 第一接触构件包括设置在第二接触构件中的部分。 第一接触构件的一个或多个磁性材料具有与第二接触构件相反的极性取向。

公开(公告)号：US20240021663A1

公开(公告)日：2024-01-18

申请号：US18213473

申请日：2023-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： SOOJAE PARK ,  NAMHOON KIM ,  JONGHYUN LEE ,  CHUL-HYUNG CHO

IPC: H01L21/02 ,  H01G4/06 ,  H01G4/012

CPC classification number: H01L28/60 ,  H01G4/06 ,  H01G4/012

Abstract: A wire capacitor includes a wire structure extending in a longitudinal direction and a conductive layer covering an outer surface of the wire structure. The wire structure includes a core electrode line having a wire shape and extending in the longitudinal direction and a dielectric line surrounding an outer surface of the core electrode line and extending in the longitudinal direction. The wire structure has a first end and a second end which are opposite to each other in the longitudinal direction, and the conductive layer exposes an outer circumference of the first end and the second end of the wire structure.

公开(公告)号：US20230319998A1

公开(公告)日：2023-10-05

申请号：US17981847

申请日：2022-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： SOOJAE PARK

IPC: H01L23/00 ,  H01G4/28 ,  H01G4/012 ,  H05K1/11 ,  H01L25/16 ,  H01G4/01 ,  H05K1/18 ,  H01G4/38

CPC classification number: H05K1/186 ,  H01G4/01 ,  H01G4/012 ,  H01G4/28 ,  H01G4/38 ,  H01L24/16 ,  H01L25/16 ,  H05K1/119 ,  H05K1/181 ,  H05K1/183 ,  H01L23/3128 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10583

Abstract: A wiring board includes an insulating layer having a first surface and a second surface, which are opposite to each other, upper wiring patterns on the first surface of the insulating layer, lower wiring patterns on the second surface of the insulating layer, intermediate wiring patterns, which are disposed in the insulating layer and are electrically connected to the upper wiring patterns and the lower wiring patterns, and a capacitor wire connected to corresponding wiring patterns of the upper wiring patterns, the lower wiring patterns, and the intermediate wiring patterns. The capacitor wire includes a core electrode line having a wire shape, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line.

公开(公告)号：US20230307180A1

公开(公告)日：2023-09-28

申请号：US17990120

申请日：2022-11-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： SOOJAE PARK

IPC: H01G4/005 ,  H01G4/224

CPC classification number: H01G4/005 ,  H01G4/224

Abstract: A chip capacitor includes a substrate, a plurality of capacitor wires on the substrate, and a mold layer disposed on the substrate to cover the capacitor wires. Each of the capacitor wires includes a core electrode line having a wire shape, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line.

公开(公告)号：US20190252306A1

公开(公告)日：2019-08-15

申请号：US16126221

申请日：2018-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SOOJAE PARK

IPC: H01L23/498 ,  H01L23/14 ,  H01L23/31 ,  H01L21/48

Abstract: A printed circuit board comprises an epoxy-containing member, a first copper pattern disposed adjacent to the epoxy-containing member, and a first adhesion promoter layer interposed between the epoxy-containing member and the first copper pattern.