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公开(公告)号：US09472722B1
公开(公告)日：2016-10-18
申请号：US14720199
申请日：2015-05-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang Hyun Lee , Seong Deok Hwang
CPC classification number: H01L33/22 , H01L33/007 , H01L33/0079 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/44 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.
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公开(公告)号：US09577147B2
公开(公告)日：2017-02-21
申请号：US15170115
申请日：2016-06-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang Hyun Lee , Seong Deok Hwang
IPC: H01L33/00 , H01L33/22 , H01L33/48 , H01L33/50 , H01L33/62 , H01L33/06 , H01L33/32 , H01L33/56 , H01L33/58
CPC classification number: H01L33/22 , H01L33/007 , H01L33/0079 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/44 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.
Abstract translation: 提供一种发光器件（LED）封装及其制造方法。 LED封装包括LED，其包括设置在其一个表面上的第一电极焊盘和第二电极焊盘; 接合绝缘图案层，被配置为暴露所述第一电极焊盘和所述第二电极焊盘; 包括从第一表面到第二表面钻孔的通孔的基板和形成在通孔的内表面上以延伸到第二表面的一部分的布线金属层; 以及接合金属图案层，其结合到在基板的第一表面处通过通孔暴露的布线金属层，并且还结合到第一电极焊盘和第二电极焊盘。
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Patent Agency Ranking
公开(公告)号：US20150102373A1
公开(公告)日：2015-04-16
申请号：US14314650
申请日：2014-06-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang Hyun Lee , Dong Hyuck Kam , Yong Tae Kim , Gam Han Yong , Seung Jae Lee , Seong Deok Hwang
CPC classification number: H01L33/50 , H01L33/005 , H01L33/0095 , H01L33/505 , H01L33/54 , H01L33/58 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2924/00
Abstract: There is provided a light emitting diode (LED) package. The LED package includes a package body. The LED package also includes an LED chip mounted on the package body. The LED package further includes a side inclined portion disposed to enclose side surfaces of the LED chip, including a light transmission material and having an upwardly inclined surface. The LED package also includes a wavelength conversion layer disposed on a top surface of the LED chip and the inclined surface of the side inclined portion.
Abstract translation: 提供了一种发光二极管（LED）封装。 LED封装包括封装体。 LED封装还包括安装在封装体上的LED芯片。 LED封装还包括设置为包围LED芯片的侧表面的侧倾部，包括透光材料并具有向上倾斜的表面。 LED封装还包括设置在LED芯片的顶表面上的波长转换层和侧倾斜部分的倾斜表面。
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公开(公告)号：US08896078B2
公开(公告)日：2014-11-25
申请号：US13785152
申请日：2013-03-05
Inventor： Dong Hyuck Kam , Seong Deok Hwang , Jae Pil Kim , Sang Bin Song , Wan Ho Kim , Sie Wook Jeon
CPC classification number: H01L33/58 , H01L33/486 , H01L2224/48091 , H01L2924/00014
Abstract: There is provided a light emitting apparatus including: at least one pair of lead frames; a light emitting device electrically connected to the lead frames to emit ultraviolet rays; a body including a side wall surrounding the light emitting device, and a groove portion formed in an upper surface of the side wall to receive an adhesive; and a lens part disposed above the light emitting device and fixed to the upper surface of the side wall of the body by the adhesive.
Abstract translation: 提供一种发光装置，包括：至少一对引线框; 电连接到引线框架以发射紫外线的发光器件; 包括围绕所述发光装置的侧壁的主体和形成在所述侧壁的上表面中以容纳粘合剂的槽部; 以及设置在发光器件上方并通过粘合剂固定到本体侧壁的上表面的透镜部分。
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5.发明申请METHOD OF GRINDING SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME 有权研磨基板的方法和使用其制造半导体发光装置的方法公开(公告)号：US20140235000A1
公开(公告)日：2014-08-21
申请号：US14098105
申请日：2013-12-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae Yoon KIM , Seung Jae Lee , Ha Yeong Son , Jin Gi Hong , Seong Deok Hwang
IPC: H01L33/58 , H01L21/683
CPC classification number: H01L21/6836 , H01L33/0095 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2933/0041
Abstract: A method of grinding a substrate is provided. A substrate including a first main surface having a semiconductor layer formed thereon and a second main surface opposed to the first main surface is prepared. A support film is attached to the first main surface using a glue. The second main surface of the substrate is ground so as to reduce a thickness of the substrate. The support film is removed from the first main surface by applying force to the support film in a non-traverse direction.
Abstract translation: 提供了研磨基板的方法。 制备包括其上形成有半导体层的第一主表面和与第一主表面相对的第二主表面的衬底。 使用胶水将支撑膜附接到第一主表面。 研磨衬底的第二主表面以减小衬底的厚度。 通过在非横向方向上对支撑膜施加力而将支撑膜从第一主表面移除。
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公开(公告)号：US08722435B2
公开(公告)日：2014-05-13
申请号：US14058152
申请日：2013-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
IPC: H01L21/00
CPC classification number: H01L33/60 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。
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7.发明授权Method of grinding substrate and method of manufacturing semiconductor light emitting device using the same 有权研磨基板的方法及使用其制造半导体发光器件的方法公开(公告)号：US09165817B2
公开(公告)日：2015-10-20
申请号：US14098105
申请日：2013-12-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae Yoon Kim , Seung Jae Lee , Ha Yeong Son , Jin Gi Hong , Seong Deok Hwang
IPC: H01L21/00 , H01L21/683 , H01L33/00
CPC classification number: H01L21/6836 , H01L33/0095 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2933/0041
Abstract: A method of grinding a substrate is provided. A substrate including a first main surface having a semiconductor layer formed thereon and a second main surface opposed to the first main surface is prepared. A support film is attached to the first main surface using a glue. The second main surface of the substrate is ground so as to reduce a thickness of the substrate. The support film is removed from the first main surface by applying force to the support film in a non-traverse direction.
Abstract translation: 提供了研磨基板的方法。 制备包括其上形成有半导体层的第一主表面和与第一主表面相对的第二主表面的衬底。 使用胶水将支撑膜附接到第一主表面。 研磨衬底的第二主表面以减小衬底的厚度。 通过在非横向方向上对支撑膜施加力而将支撑膜从第一主表面移除。
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