公开(公告)号：US08779576B2

公开(公告)日：2014-07-15

申请号：US13037159

申请日：2011-02-28

申请人： Sang-wook Park ,  Nam-seog Kim ,  Seung-duk Baek

发明人： Sang-wook Park ,  Nam-seog Kim ,  Seung-duk Baek

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/02 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05548 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern.

摘要翻译： 在一个实施例中，晶片级封装包括形成在半导体衬底上的重新布线图案和覆盖重新布线图案的第一封装图案。 第一密封剂图案具有通孔以暴露重新布置图案的一部分。 该封装还包括形成在重新布线图案的暴露部分上的外部连接端子。 侧壁的上部和外部连接端子的侧壁可以间隔距离。 间隙距离可以朝向密封剂图案的上表面增加。

公开(公告)号：US20110272819A1

公开(公告)日：2011-11-10

申请号：US13037159

申请日：2011-02-28

申请人： Sang-wook Park ,  Nam-seog Kim ,  Seung-duk Baek

发明人： Sang-wook Park ,  Nam-seog Kim ,  Seung-duk Baek

IPC分类号： H01L23/48

CPC分类号： H01L24/02 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/05548 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern.

摘要翻译： 在一个实施例中，晶片级封装包括形成在半导体衬底上的重新布线图案和覆盖重新布线图案的第一封装图案。 第一密封剂图案具有通孔以暴露重新布线图案的一部分。 该封装还包括形成在重新布线图案的暴露部分上的外部连接端子。 侧壁的上部和外部连接端子的侧壁可以间隔距离。 间隙距离可以朝向密封剂图案的上表面增加。

公开(公告)号：US08664762B2

公开(公告)日：2014-03-04

申请号：US13594841

申请日：2012-08-26

申请人： Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

发明人： Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

IPC分类号： H01L23/48

CPC分类号： H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/12105 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.

摘要翻译： 在一个实施例中，半导体封装可以包括：半导体芯片，其具有形成在其第一表面上的芯片焊盘，用于密封半导体芯片并暴露半导体芯片的第一表面的密封构件，覆盖第一 并且直接接触密封部件的上表面的一部分。 导电布线还接触垫。 半导体封装还可以包括覆盖导电布线并具有露出导电布线部分的开口的密封剂。

公开(公告)号：US20130087917A1

公开(公告)日：2013-04-11

申请号：US13550949

申请日：2012-07-17

申请人： Young-kun Jee ,  Sun-kyoung Seo ,  Sang-wook Park ,  Ji-hwan Hwang

发明人： Young-kun Jee ,  Sun-kyoung Seo ,  Sang-wook Park ,  Ji-hwan Hwang

IPC分类号： H01L23/498 ,  H01L23/48

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/02175 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05007 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05547 ,  H01L2224/05557 ,  H01L2224/05562 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05686 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/10145 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16237 ,  H01L2224/16503 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/05042 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad.

摘要翻译： 半导体封装包括第一半导体芯片，设置在第一半导体芯片上的第二半导体芯片和用于电连接第一半导体芯片和第二半导体芯片的连接构件。 连接构件可以包括设置在第一半导体芯片上的连接焊盘，设置在第二半导体芯片上的连接柱和用于连接连接焊盘和连接柱的接合构件。 可以在连接焊盘的至少一个表面上形成抗接触层。

公开(公告)号：US20100110229A1

公开(公告)日：2010-05-06

申请号：US12654794

申请日：2010-01-04

申请人： Stanley Chung ,  Jung-hyun Shim ,  Sang-wook Park ,  Chang-su Kim

发明人： Stanley Chung ,  Jung-hyun Shim ,  Sang-wook Park ,  Chang-su Kim

IPC分类号： H04N5/76 ,  H04N5/222

CPC分类号： H04N5/232 ,  H04N1/00411 ,  H04N5/23216 ,  H04N5/23293 ,  H04N5/2356 ,  H04N2201/0084

摘要： Provided are a terminal having a photographing function and a displaying method for the terminal. The displaying method includes generating a plurality of process images by processing an original image, which is an image shown through a lens of the terminal, several times using different setup information each time, and displaying the generated plurality of process images on a plurality of buttons. Accordingly, even when a user is not proficient with how to obtain a high quality photograph by setting setup information, such as a focus, exposure, etc. and with operating the buttons, the user can select a process image, which seems to be the most preferable to the user, from among the process images, and thus the user can easily find the optimum setup information with a simple button operation.

摘要翻译： 提供一种具有拍摄功能的端子和用于终端的显示方法。 显示方法包括通过每次使用不同的设置信息处理多次通过终端的镜头显示的图像的原始图像来生成多个处理图像，并且将生成的多个处理图像显示在多个按钮上 。 因此，即使当用户通过设置诸如焦点，曝光等设置信息以及通过操作按钮来获得高质量的照片不熟练时，用户可以选择一个过程图像，其似乎是 最优选于用户，从处理图像中，因此用户可以通过简单的按钮操作容易地找到最佳设置信息。

公开(公告)号：US20060098946A1

公开(公告)日：2006-05-11

申请号：US10983586

申请日：2004-11-09

申请人： Sang-wook Park

发明人： Sang-wook Park

IPC分类号： H04N5/781

CPC分类号： H04N9/8042 ,  G11B27/034 ,  G11B27/329 ,  H04N5/765 ,  H04N5/775 ,  H04N5/7755 ,  H04N5/781

摘要： A video and audio recording and/or reproducing apparatus having a lock setting function and a control method thereof. The video and audio recording and/or reproducing apparatus records a video and audio file received from the outside on a storage device, and reproduces and outputs the recorded video and audio file to an external display. The apparatus includes an external input device receiving a function selection signal of the video and audio recording and/or reproducing apparatus, and a main controller displaying a lock setting list screen on the external display upon receiving a signal for setting a lock from the external input device. The main controller sets a lock setting information to prevent an area, on which a video and audio file selected from video and audio files listed on the lock setting list screen is recorded, from being overwritten by a video and audio file to be recorded.

公开(公告)号：US20060039386A1

公开(公告)日：2006-02-23

申请号：US11192134

申请日：2005-07-29

申请人： Sang-wook Park

发明人： Sang-wook Park

IPC分类号： H04L12/66 ,  H04L12/56

CPC分类号： H04L12/2803 ,  H04L12/2807 ,  H04L12/2836 ,  H04L29/12216 ,  H04L41/22 ,  H04L61/2007 ,  H04L2012/285

摘要： Provided is a private Internet Protocol (IP) installer for a home network. The Internet Protocol (IP) installer includes a network interface connected to an IP sharing router, a user interface which receives a user's command, an IP installing unit which assigns private IP addresses to products constituting a home network using an IP sharing router connected to the network interface in response to a user's command input through the user interface, and a display unit which displays a process of assigning the private IP addresses to the products.

摘要翻译： 提供家庭网络的私有互联网协议（IP）安装程序。 互联网协议（IP）安装器包括连接到IP共享路由器的网络接口，接收用户命令的用户界面，IP安装单元，其使用连接到所述IP共享路由器的IP共享路由器向构成家庭网络的产品分配专用IP地址 响应于用户通过用户界面输入的命令的网络接口，以及显示单元，其显示将私有IP地址分配给产品的处理。

公开(公告)号：US20120313244A1

公开(公告)日：2012-12-13

申请号：US13594841

申请日：2012-08-26

申请人： Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

发明人： Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

IPC分类号： H01L23/498

CPC分类号： H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/12105 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.

摘要翻译： 在一个实施例中，半导体封装可以包括：半导体芯片，其具有形成在其第一表面上的芯片焊盘，用于密封半导体芯片并暴露半导体芯片的第一表面的密封构件，覆盖第一 并且直接接触密封部件的上表面的一部分。 导电布线还接触垫。 半导体封装还可以包括覆盖导电布线并具有露出导电布线部分的开口的密封剂。

公开(公告)号：US08288210B2

公开(公告)日：2012-10-16

申请号：US13041422

申请日：2011-03-06

申请人： Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

发明人： Jong-gi Lee ,  Sang-wook Park ,  Ji-seok Hong

IPC分类号： H01L21/00

CPC分类号： H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/12105 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.

摘要翻译： 在一个实施例中，半导体封装可以包括：半导体芯片，其具有形成在其第一表面上的芯片焊盘，用于密封半导体芯片并暴露半导体芯片的第一表面的密封构件，覆盖第一 并且直接接触密封部件的上表面的一部分。 导电布线还接触垫。 半导体封装还可以包括覆盖导电布线并具有露出导电布线部分的开口的密封剂。

公开(公告)号：US20080079811A1

公开(公告)日：2008-04-03

申请号：US11889624

申请日：2007-08-15

申请人： Sang-wook Park ,  Stanley Chung ,  Sang-ryong Kim ,  Chang-su Kim ,  Sun-gi Hong

发明人： Sang-wook Park ,  Stanley Chung ,  Sang-ryong Kim ,  Chang-su Kim ,  Sun-gi Hong

IPC分类号： H04N17/00

CPC分类号： H04N5/23293

摘要： When an error occurring in a terminal (device) is detected, one or more solutions for removing the detected error are displayed to a user, so that the detected error can be easily removed by the user even though the user is not familiar with operations or detailed functions of the camera.

摘要翻译： 当检测到终端（设备）中发生错误时，向用户显示用于去除检测到的错误的一个或多个解决方案，使得即使用户不熟悉操作也可以容易地去除检测到的错误， 相机的详细功能。