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11 条记录 (耗时 0.032 秒)

    End point detection for sputtering and resputtering
    1.
    发明申请
    End point detection for sputtering and resputtering 失效
    溅射和再溅射的终点检测

    公开(公告)号：US20050173239A1

    公开(公告)日：2005-08-11

    申请号：US10659902

    申请日：2003-09-11

    申请人： Sasson Somekh ,  Marc Schweitzer ,  John Forster ,  Zheng Xu ,  Roderick Mosely ,  Barry Chin ,  Howard Grunes

    发明人： Sasson Somekh ,  Marc Schweitzer ,  John Forster ,  Zheng Xu ,  Roderick Mosely ,  Barry Chin ,  Howard Grunes

    IPC分类号： C23C14/04 ,  C23C14/16 ,  C23C14/32 ,  C23C14/54 ,  C23C14/58 ,  G01N21/68 ,  H01J37/32 ,  H01L21/285 ,  H01L21/66 ,  H01L21/768

    CPC分类号： C23C14/544 ,  C23C14/046 ,  C23C14/165 ,  C23C14/5833 ,  C23C14/5873 ,  G01N21/68 ,  H01J37/321 ,  H01J37/32477 ,  H01J37/32935 ,  H01J37/32963 ,  H01J37/3455 ,  H01L21/2855 ,  H01L21/76814 ,  H01L21/76844 ,  H01L21/76846 ,  H01L21/76862 ,  H01L21/76865 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a sputter deposited layer is performed after material has been sputtered deposited and while additional material is being sputter deposited onto a substrate. A path positioned within a chamber of the system directs light or other radiation emitted by the plasma to a chamber window or other optical view-port which is protected by a shield against deposition by the conductor material. In one embodiment, the radiation path is folded to reflect plasma light around the chamber shield and through the window to a detector positioned outside the chamber window. Although deposition material may be deposited onto portions of the folded radiation path, in many applications, the deposition material will be sufficiently reflective to permit the emission spectra to be detected by a spectrometer or other suitable detector without significant signal loss. The etching or resputtering may be terminated when the detector detects that an underlying layer has been reached or when some other suitable process point has been reached.

    摘要翻译： 可以在溅射反应器系统中控制包括不透明金属导体材料的溅射材料层的等离子体蚀刻或再溅射。 在一个实施例中，溅射沉积层的溅射在材料溅射沉积之后进行，并且另外的材料被溅射沉积到衬底上。 位于系统的腔室内的路径将等离子体发射的光或其他辐射引导到腔室窗口或其他光学视图端口，其被屏蔽物保护以防止被导体材料沉积。 在一个实施例中，辐射路径被折叠以将等离子体光围绕室屏蔽件并且通过窗口反射到位于室窗口外部的检测器。 虽然沉积材料可以沉积在折叠辐射路径的部分上，但是在许多应用中，沉积材料将被充分反射，以允许发射光谱由光谱仪或其它合适的检测器检测，而没有显着的信号损失。 当检测器检测到已经到达下层或者当达到某些其它合适的处理点时，蚀刻或再溅射可以被终止。

    Cleaning of chamber components
    5.
    发明申请
    Cleaning of chamber components 有权
    清洁腔室部件

    公开(公告)号：US20050172984A1

    公开(公告)日：2005-08-11

    申请号：US10777866

    申请日：2004-02-11

    申请人： Marc Schweitzer ,  Jennifer Tiller ,  Brian West ,  Karl Brueckner

    发明人： Marc Schweitzer ,  Jennifer Tiller ,  Brian West ,  Karl Brueckner

    IPC分类号： B08B7/00 ,  B08B9/08 ,  C23C16/44

    CPC分类号： B08B7/0092 ,  B08B9/08 ,  C23C16/4407

    摘要： In a method of cleaning a surface of a substrate processing chamber component to remove process deposits, the component surface is cooled to a temperature below about −40° C. to fracture the process deposits on the surface. The surface can be cooled by immersing the surface in a low temperature fluid, such as liquid nitrogen. In another version, the component surface is heated to fracture and delaminate the deposits, and optionally, subsequently rapidly cooled to form more fractures. The component surface cleaning can also be performed by bead blasting followed by a chemical cleaning step.

    摘要翻译： 在清洗基板处理室部件的表面以去除工艺沉积物的方法中，将部件表面冷却至低于约-40℃的温度以破坏表面上的工艺沉积物。 表面可以通过将表面浸入诸如液氮的低温流体中来冷却。 在另一个版本中，组件表面被加热以使沉积物断裂并分层，并且任选地随后快速冷却以形成更多的裂缝。 组件表面清洁也可以通过喷丸处理，然后进行化学清洁步骤。

    Flow-formed chamber component having a textured surface
    6.
    发明申请
    Flow-formed chamber component having a textured surface 有权
    具有纹理表面的流动形成的室部件

    公开(公告)号：US20070059460A1

    公开(公告)日：2007-03-15

    申请号：US11234012

    申请日：2005-09-09

    申请人： Stephen Abney ,  Anthony Vesci ,  Joseph Sommers ,  Marc Schweitzer ,  Scott Dickerson ,  Jennifer Tiller

    发明人： Stephen Abney ,  Anthony Vesci ,  Joseph Sommers ,  Marc Schweitzer ,  Scott Dickerson ,  Jennifer Tiller

    IPC分类号： B31B45/00

    CPC分类号： C23C14/564 ,  B21D22/16 ,  B21J5/12 ,  C23C16/4404 ,  H01J37/32009 ,  Y10T428/13

    摘要： A method of fabricating a component for a substrate processing chamber involves providing a preform having internal and external surfaces, and providing a mandrel having a textured surface with a pattern of textured features comprising protrusions and depressions. The internal surface of the preform component is contacted with the textured surface of mandrel, and a pressure is applied to the external surface of the preform. The pressure is sufficiently high to plastically deform the preform over the textured surface of the mandrel to form a component having a textured internal surface comprising the pattern of textured feature that are shaped and sized to adhere process residues generated in the processing of substrates.

    摘要翻译： 制造用于衬底处理室的部件的方法包括提供具有内部和外部表面的预成型件，并且提供具有纹理表面的心轴，其具有包括凸起和凹陷的纹理特征图案。 预成型件部件的内表面与芯棒的纹理表面接触，并且将压力施加到预成型件的外表面。 压力足够高以使预成型件在心轴的纹理表面上塑性变形，以形成具有纹理化内表面的部件，该内表面包括纹理特征图案，其形状和尺寸适于粘附在基底加工中产生的工艺残留物。

    FABRICATING AND CLEANING CHAMBER COMPONENTS HAVING TEXTURED SURFACES
    7.
    发明申请
    FABRICATING AND CLEANING CHAMBER COMPONENTS HAVING TEXTURED SURFACES 审中-公开
    具有纹理表面的织物和清洁室组件

    公开(公告)号：US20080038481A1

    公开(公告)日：2008-02-14

    申请号：US11874169

    申请日：2007-10-17

    申请人： Brian West ,  Marc Schweitzer ,  Jennifer Watia

    发明人： Brian West ,  Marc Schweitzer ,  Jennifer Watia

    IPC分类号： B05D3/12 ,  B24C1/00 ,  H05H1/48

    CPC分类号： C23C14/564 ,  B08B3/02 ,  H01L21/67051 ,  Y10T428/24355

    摘要： A method of fabricating a substrate processing chamber component involves forming a component having a textured surface and sweeping a jet of pressurized fluid across the textured surface of the component. The jet of fluid is pressurized sufficiently high to dislodge substantially all the particles from the textured surface. The method can be applied to dislodge grit particles from textured exposed surfaces formed by electromagnetic energy beam scanning and grit blasting. The method can also be applied to remove loosely adhered coating particles from the textured surfaces of coated components.

    摘要翻译： 制造基板处理室部件的方法包括形成具有纹理表面的部件，并且跨过部件的纹理化表面扫掠加压流体的射流。 流体射流被加压得足够高，以从织纹表面去除基本上所有的颗粒。 该方法可应用于通过电磁能量束扫描和喷砂处理形成的纹理暴露表面去除砂粒。 该方法还可以用于从被涂覆部件的织构化表面去除松散粘附的涂层颗粒。

    Fabricating and cleaning chamber components having textured surfaces
    9.
    发明申请
    Fabricating and cleaning chamber components having textured surfaces 审中-公开
    制造和清洁具有纹理表面的腔室部件

    公开(公告)号：US20050048876A1

    公开(公告)日：2005-03-03

    申请号：US10653713

    申请日：2003-09-02

    申请人： Brian West ,  Marc Schweitzer ,  Jennifer Watia

    发明人： Brian West ,  Marc Schweitzer ,  Jennifer Watia

    IPC分类号： B08B3/02 ,  C23C14/56 ,  H01L21/00 ,  B24B1/00

    CPC分类号： C23C14/564 ,  B08B3/02 ,  H01L21/67051 ,  Y10T428/24355

    摘要： A method of fabricating a substrate processing chamber component involves forming a component having a textured surface and sweeping a jet of pressurized fluid across the textured surface of the component. The jet of fluid is pressurized sufficiently high to dislodge substantially all the particles from the textured surface. The method can be applied to dislodge grit particles from textured exposed surfaces formed by electromagnetic energy beam scanning and grit blasting. The method can also be applied to remove loosely adhered coating particles from the textured surfaces of coated components.

    摘要翻译： 制造基板处理室部件的方法包括形成具有纹理表面的部件，并且跨过部件的纹理化表面扫掠加压流体的射流。 流体射流被加压得足够高，以从织纹表面去除基本上所有的颗粒。 该方法可应用于通过电磁能量束扫描和喷砂处理形成的纹理暴露表面去除砂粒。 该方法还可以用于从被涂覆部件的织构化表面去除松散粘附的涂层颗粒。