公开(公告)号：US20050026455A1

公开(公告)日：2005-02-03

申请号：US10854281

申请日：2004-05-27

申请人： Satomi Hamada ,  Michihisa Kono ,  Ichiro Katakabe ,  Shohei Shima

发明人： Satomi Hamada ,  Michihisa Kono ,  Ichiro Katakabe ,  Shohei Shima

IPC分类号： C23F1/18 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/306 ,  H01L21/321 ,  H01L21/3213 ,  C23F1/00 ,  H01L21/31

CPC分类号： H01L21/02087 ,  C23F1/18 ,  H01L21/02074 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32134 ,  H01L21/67028 ,  H01L21/67051

摘要： The present invention provides a substrate processing apparatus having a drying mechanism for removing water from the surface of a substrate which has been cleaned by a wet cleaning process, and a substrate processing apparatus and a substrate processing method which are capable of efficiently removing an unnecessary thin film deposited on or adhering to a bevel or edge portion of a substrate. The substrate processing apparatus of this invention has a substrate holder for holding a substrate, and a dry gas supply section for turning an atmosphere to which at least a portion of a surface of the substrate held by the substrate holder is exposed into a humidity-controlled dry gas atmosphere.

摘要翻译： 本发明提供了一种具有干燥机构的基板处理装置，该干燥机构用于通过湿式清洗工艺清洗的基板表面除去水，以及基板处理装置和基板处理方法，其能够有效地除去不必要的薄片 膜沉积在或粘附到基底的斜面或边缘部分上。 本发明的基板处理装置具有用于保持基板的基板保持件和用于转动由基板保持件保持的基板的表面的至少一部分暴露于湿度控制的气氛的干燥气体供给部 干气体气氛。

公开(公告)号：US20080017220A1

公开(公告)日：2008-01-24

申请号：US11902163

申请日：2007-09-19

申请人： Masako Kodera ,  Kenya Ito ,  Masayuki Kamezawa ,  Satomi Hamada ,  Ichiro Katakabe

发明人： Masako Kodera ,  Kenya Ito ,  Masayuki Kamezawa ,  Satomi Hamada ,  Ichiro Katakabe

IPC分类号： C23G1/00

CPC分类号： H01L21/67173 ,  B08B1/04 ,  B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  B08B3/12 ,  C23G3/00 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67219

摘要： The present invention relates to a cleaning apparatus which can reduce a potential difference between metals or alloys used to form interconnects on a substrate for thereby minimizing corrosion which may occur during and after a substrate cleaning process. The cleaning apparatus for cleaning a substrate having metal interconnects comprises a cleaning mechanism for cleaning the substrate, and a functional water supply mechanism for supplying functional water to the cleaning mechanism. The cleaning mechanism cleans a surface of the substrate with use of the functional water.

摘要翻译： 本发明涉及一种清洁装置，其可以减少用于在基板上形成互连件的金属或合金之间的电位差，从而最小化在基板清洗处理期间和之后可能发生的腐蚀。 用于清洁具有金属互连件的基板的清洁装置包括用于清洁基板的清洁机构和用于向清洁机构供应功能性水的功能性供水机构。 清洁机构使用功能性水清洗基材的表面。

公开(公告)号：US07578887B2

公开(公告)日：2009-08-25

申请号：US10765182

申请日：2004-01-28

申请人： Shinji Kajita ,  Ichiro Katakabe ,  Haruko Ono ,  Yuki Inoue ,  Sachiko Takeda

发明人： Shinji Kajita ,  Ichiro Katakabe ,  Haruko Ono ,  Yuki Inoue ,  Sachiko Takeda

IPC分类号： B08B3/00

CPC分类号： H01L21/67051

摘要： An apparatus for processing a substrate through successive steps including spin-drying the substrate with a single processing facility while preventing the substrate from being contaminated by a substrate processing liquid, etc. The apparatus for processing a substrate includes a substrate holder for holding and rotating a substrate, a scattering prevention cup for circumferentially surrounding the substrate held by the substrate holder to prevent a substrate processing liquid supplied to the substrate from being scattered around, and a scattering prevention cup cleaner for cleaning an inner wall surface of the scattering prevention cup.

摘要翻译： 一种用于通过连续步骤处理衬底的装置，包括用单一处理设备旋转衬底，同时防止衬底被衬底处理液体等污染。用于处理衬底的设备包括用于保持和旋转衬底的衬底保持器 衬底，用于周向地围绕由衬底保持器保持的衬底的防散射杯，以防止供应到衬底的衬底处理液体被散射;以及用于清洁散射防止杯的内壁表面的防散射杯清洁器。

公开(公告)号：US20090026068A1

公开(公告)日：2009-01-29

申请号：US12232364

申请日：2008-09-16

申请人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

发明人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

IPC分类号： C25D17/06

CPC分类号： H01L21/68728 ,  B24B37/345 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/68707

摘要： A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable member which rotates about an axis of rotation, and a plurality of holding members which are disposed along a circle having a center corresponding to the axis of rotation of the rotatable member. The holding members revolve around the axis of rotation when the rotatable member rotates and are allowed to swing about their own central axes.

摘要翻译： 旋转构件支撑装置保持并旋转诸如半导体晶片的盘形物体（待旋转物体）。 旋转构件支撑装置包括围绕旋转轴线旋转的可旋转构件，以及沿着具有与可旋转构件的旋转轴线对应的中心的圆形的多个保持构件。 当可旋转构件旋转时，保持构件围绕旋转轴线旋转并且允许其绕其自身的中心轴线摆动。

公开(公告)号：US20080110861A1

公开(公告)日：2008-05-15

申请号：US10585482

申请日：2005-02-23

申请人： Shinji Kajita ,  Ichiro Katakabe

发明人： Shinji Kajita ,  Ichiro Katakabe

IPC分类号： B08B3/04 ,  H01L21/306

CPC分类号： H01L21/68728 ,  B08B3/02 ,  B08B11/02 ,  C23F1/08 ,  H01L21/6708

摘要： The substrate processing apparatus has substrate holding mechanisms (14) for holding the substrate (W) under a holding force which is changed according to a rotational speed of the substrate holding mechanisms (14), a substrate rotation mechanism (22) for rotating the substrate holding mechanisms (14) to rotate the substrate (W) held by the substrate holding mechanisms (14), and a treatment liquid supply mechanism (12, 15, 19) for supplying a treatment liquid to a desired portion of the substrate (W) held by the substrate holding mechanisms (14).

摘要翻译： 基板处理装置具有基板保持机构（14），用于将基板（W）保持在根据基板保持机构（14）的旋转速度而变化的保持力，基板旋转机构（22） 用于使由基板保持机构（14）保持的基板（W）旋转的保持机构（14）和用于将处理液供给到基板（W）的期望部分的处理液供给机构（12,15,19） 由衬底保持机构（14）保持。

公开(公告)号：US07578886B2

公开(公告)日：2009-08-25

申请号：US10564980

申请日：2004-07-28

申请人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

发明人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

IPC分类号： B08B5/04

CPC分类号： H01L21/02052 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0229 ,  B08B2203/0288 ,  C23C18/1628 ,  C25D17/001 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： A substrate processing apparatus and a substrate processing method is provided for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. A substrate holding apparatus is provided for holding and rotating a substrate. The substrate processing apparatus for processing a substrate while supplying a fluid to the substrate includes a substrate holder for holding and rotating the substrate, and a holder suction unit for sucking the fluid from the substrate holder. The substrate holding apparatus includes a plurality of rollers which are brought into contact with an edge portion of a substrate so as to hold and rotate the substrate, and at least one moving mechanism for moving the rollers.

摘要翻译： 提供了一种基板处理装置和基板处理方法，用于在旋转诸如半导体晶片或液晶基板的基板的同时进行化学液体处理，清洁处理，干燥处理等。 提供用于保持和旋转衬底的衬底保持装置。 用于在向衬底供应流体的同时处理衬底的衬底处理设备包括用于保持和旋转衬底的衬底保持器，以及用于从衬底保持器吸取流体的保持器抽吸单元。 基板保持装置包括与基板的边缘部分接触以便​​保持和旋转基板的多个辊以及用于移动辊的至少一个移动机构。

公开(公告)号：US5878191A

公开(公告)日：1999-03-02

申请号：US451509

申请日：1995-05-26

申请人： Naoto Miyashita ,  Ichiro Katakabe ,  Hiroshi Kawamoto ,  Kenji Doi ,  Tsuyoshi Okuda

发明人： Naoto Miyashita ,  Ichiro Katakabe ,  Hiroshi Kawamoto ,  Kenji Doi ,  Tsuyoshi Okuda

IPC分类号： H01L21/22 ,  H01L21/00 ,  H01L21/324 ,  C23L16/00

CPC分类号： H01L21/67115

摘要： A heat treatment apparatus for semiconductor wafers includes a reaction chamber, a heater, a heat-insulating member, a first cooling gas path, a second cooling gas path, a blower and a controller. The reaction chamber houses semiconductor wafers. The heater is provided outside the reaction chamber to heat it. The heat-insulating member is provided outside the heater to keep the temperature of the reaction chamber. The first cooling gas path is interposed between the reaction chamber and heater, while the second cooling gas path is disposed between the heater and heat-insulating member. The blower allows gas to flow through the first and second gas paths to cool the reaction chamber. The controller controls the heater to increase the temperature of the reaction chamber and does the blower to decrease the temperature thereof.

摘要翻译： 用于半导体晶片的热处理装置包括反应室，加热器，绝热构件，第一冷却气体路径，第二冷却气体路径，鼓风机和控制器。 反应室容纳半导体晶片。 加热器设置在反应室外部以加热。 隔热构件设置在加热器的外侧，以保持反应室的温度。 第一冷却气体路径介于反应室和加热器之间，而第二冷却气体路径设置在加热器和绝热构件之间。 鼓风机允许气体流过第一和第二气体通道以冷却反应室。 控制器控制加热器以增加反应室的温度，并且鼓风机降低其温度。

公开(公告)号：US20070113977A1

公开(公告)日：2007-05-24

申请号：US11652082

申请日：2007-01-11

申请人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

发明人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

IPC分类号： B05C13/02 ,  C23F1/00

CPC分类号： H01L21/68728 ,  B24B37/345 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/68707

摘要： A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable member which rotates about an axis of rotation, and a plurality of holding members which are disposed along a circle having a center corresponding to the axis of rotation of the rotatable member, and which revolve around the axis of rotation when the rotatable member rotates, wherein the holding members are allowed to swing about their own central axes.

摘要翻译： 旋转构件支撑装置保持并旋转诸如半导体晶片的盘形物体（待旋转物体）。 旋转构件支撑装置包括围绕旋转轴线旋转的可旋转构件，以及沿着具有对应于可旋转构件的旋转轴线的中心的圆设置的多个保持构件，并且围绕轴线旋转 可旋转构件旋转时的旋转，其中保持构件绕其自身的中心轴线摆动。

公开(公告)号：US20050087441A1

公开(公告)日：2005-04-28

申请号：US10987574

申请日：2004-11-15

申请人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

发明人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

IPC分类号： B24B37/34 ,  H01L21/00 ,  H01L21/687 ,  C25D17/04 ,  C25D17/06 ,  C25D17/16

CPC分类号： H01L21/68728 ,  B24B37/345 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/68707

摘要： A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable member which rotates about an axis of rotation, and a plurality of holding members which are disposed along a circle having a center corresponding to the axis of rotation of the rotatable member, and which revolve around the axis of rotation when the rotatable member rotates, wherein the holding members are allowed to swing about their own central axes.

摘要翻译： 旋转构件支撑装置保持并旋转诸如半导体晶片的盘形物体（待旋转物体）。 旋转构件支撑装置包括围绕旋转轴线旋转的可旋转构件，以及沿着具有对应于可旋转构件的旋转轴线的中心的圆设置的多个保持构件，并且围绕轴线旋转 可旋转构件旋转时的旋转，其中保持构件绕其自身的中心轴线摆动。

公开(公告)号：US06558478B1

公开(公告)日：2003-05-06

申请号：US09679305

申请日：2000-10-06

申请人： Ichiro Katakabe ,  Shinya Morisawa ,  Haruko Ohno ,  Sachiko Kihara ,  Akira Fukunaga

发明人： Ichiro Katakabe ,  Shinya Morisawa ,  Haruko Ohno ,  Sachiko Kihara ,  Akira Fukunaga

IPC分类号： B08B302

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： An acid solution is continuously supplied to a central portion of a surface of a substrate while the substrate is rotating, and an oxidizing agent solution is continuously or intermittently supplied to a periphery of the substrate. In addition, an oxidizing agent solution and an acid solution are simultaneously or alternately supplied to a reverse side of the substrate.

摘要翻译： 在基板旋转的同时，将酸性溶液连续地供给到基板的表面的中央部分，并且将氧化剂溶液连续或间歇地供给到基板的周边。 此外，将氧化剂溶液和酸溶液同时或交替地供给到基板的相反侧。