公开(公告)号：US20120037303A1

公开(公告)日：2012-02-16

申请号：US13179798

申请日：2011-07-11

申请人： Satoshi ARAI ,  Shigeharu Tsunoda ,  Yoshio Oozeki ,  Taihei Yotsuya ,  Shizuo Imaoka

发明人： Satoshi ARAI ,  Shigeharu Tsunoda ,  Yoshio Oozeki ,  Taihei Yotsuya ,  Shizuo Imaoka

IPC分类号： B32B38/10 ,  B32B37/12

CPC分类号： F16L3/00

摘要： To ensure required adhesion even when a pipe of a piping module collides with a temporary material during transport and achieve easier dismantling, the following measure is taken: the temporary material is fixed on a support rack to prevent the piping module placed on the support rack from largely displaced during conveyance and after the conveyance of the piping module, the temporary material is removed from the support rack. In this method, the following measures are taken: at the step of fixing the temporary material to the support rack, the temporary material is bonded to the support rack with the piping module set therein using adhesive; and at the step of removing the temporary material from the support rack after the conveyance of the piping module, the temporary material bonded to the support rack with the adhesive is peeled off from the support rack with heat applied thereto.

摘要翻译： 为了确保在运输过程中管道模块的管道与临时材料碰撞时所需的附着力，拆卸方便，采取以下措施：将临时材料固定在支撑架上，以防止支撑架上放置的管道模块 在输送过程中和在输送管道模块之后大大偏移，临时材料从支撑架上移除。 在该方法中，采取以下措施：在将临时材料固定到支撑架上的步骤中，临时材料使用粘合剂将管道模块设置在支撑架上; 并且在输送管道模块之后从支撑架移除临时材料的步骤中，用粘合剂粘合到支撑架上的临时材料通过加热而从支撑架上剥离。

公开(公告)号：US20120040122A1

公开(公告)日：2012-02-16

申请号：US13179725

申请日：2011-07-11

申请人： Yoshio Oozeki ,  Satoshi Arai ,  Shigeharu Tsunoda ,  Taihei Yotsuya ,  Shizuo Imaoka

发明人： Yoshio Oozeki ,  Satoshi Arai ,  Shigeharu Tsunoda ,  Taihei Yotsuya ,  Shizuo Imaoka

IPC分类号： B32B1/08

CPC分类号： C09J5/00 ,  C09J163/00 ,  C09J2433/00 ,  C09J2463/00 ,  Y10T428/131 ,  Y10T428/1355 ,  Y10T428/1359 ,  Y10T428/1372 ,  Y10T428/1386 ,  Y10T428/139 ,  Y10T428/1393 ,  Y10T428/1397

摘要： A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.

摘要翻译： 通过使用以预定密度混合填料的粘合剂层将临时部分固定到基底。 当临时部件被加热时，对填料和粘合剂层施加热量。 在等于或高于粘合剂的玻璃化转变温度的温度下，加热的粘合剂层热收缩以释放剩余应力，另一方面，加热的填料热膨胀。 以这种方式，粘合剂层和基底（或临时部分）之间的剥离强度降低，并且易于拆卸。

公开(公告)号：US08524345B2

公开(公告)日：2013-09-03

申请号：US13179725

申请日：2011-07-11

申请人： Yoshio Oozeki ,  Satoshi Arai ,  Shigeharu Tsunoda ,  Taihei Yotsuya ,  Shizuo Imaoka

发明人： Yoshio Oozeki ,  Satoshi Arai ,  Shigeharu Tsunoda ,  Taihei Yotsuya ,  Shizuo Imaoka

IPC分类号： B32B1/08 ,  B32B15/082 ,  B32B15/092

CPC分类号： C09J5/00 ,  C09J163/00 ,  C09J2433/00 ,  C09J2463/00 ,  Y10T428/131 ,  Y10T428/1355 ,  Y10T428/1359 ,  Y10T428/1372 ,  Y10T428/1386 ,  Y10T428/139 ,  Y10T428/1393 ,  Y10T428/1397

摘要： A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.

摘要翻译： 通过使用以预定密度混合填料的粘合剂层将临时部分固定到基底。 当临时部件被加热时，对填料和粘合剂层施加热量。 在等于或高于粘合剂的玻璃化转变温度的温度下，加热的粘合剂层热收缩以释放剩余应力，另一方面，加热的填料热膨胀。 以这种方式，粘合剂层和基底（或临时部分）之间的剥离强度降低，并且易于拆卸。

公开(公告)号：US09778086B2

公开(公告)日：2017-10-03

申请号：US14407763

申请日：2012-06-15

申请人： Satoshi Arai ,  Shigeharu Tsunoda ,  Keiji Hanzawa ,  Shinobu Tashiro

发明人： Satoshi Arai ,  Shigeharu Tsunoda ,  Keiji Hanzawa ,  Shinobu Tashiro

IPC分类号： G01F15/14 ,  G01F1/684 ,  G01F5/00 ,  G01F15/00 ,  G01F15/18 ,  B29C65/00 ,  B32B37/18 ,  B32B38/00 ,  B29C65/78 ,  B29L31/34 ,  B29C65/16

CPC分类号： G01F15/14 ,  B29C65/1612 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1677 ,  B29C65/7829 ,  B29C66/1122 ,  B29C66/1222 ,  B29C66/1224 ,  B29C66/232 ,  B29C66/242 ,  B29C66/244 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/53461 ,  B29C66/542 ,  B29C66/61 ,  B29C66/612 ,  B29C66/71 ,  B29C66/7352 ,  B29C66/73772 ,  B29C66/73776 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81267 ,  B29C66/8322 ,  B29K2995/0027 ,  B29L2031/3481 ,  B32B37/18 ,  B32B38/0008 ,  B32B2457/00 ,  G01F1/6842 ,  G01F1/6845 ,  G01F5/00 ,  G01F15/006 ,  G01F15/185 ,  B29K2909/08 ,  B29K2081/06 ,  B29K2081/04 ,  B29K2079/08 ,  B29K2077/00 ,  B29K2071/00 ,  B29K2069/00 ,  B29K2067/006 ,  B29K2067/003 ,  B29K2067/00 ,  B29K2059/00 ,  B29K2055/02 ,  B29K2033/12 ,  B29K2027/18 ,  B29K2027/08 ,  B29K2027/06 ,  B29K2025/08 ,  B29K2025/06 ,  B29K2023/38 ,  B29K2023/12 ,  B29K2023/06

摘要： A flow sensor includes an auxiliary channel having an opening into which a fluid to be measured is taken; a sensor element that measures the flow of the fluid to be measured; a housing that accommodates electronic parts; and a resin cover. The flow sensor is configured such that junctions of the housing and the cover are formed in locations where first target weld portions, which are formed so that the circuit chamber is surrounded, face each other and second target weld portions, which are disposed for additional reinforcement of the joints, face each other on a bonding face of the housing and a bonding face of the cover with a step being provided. The positioning of the housing and the cover is determined, and the first target weld portions are welded to each other and second target weld portions are welded to each other by way of laser radiation.

公开(公告)号：US20050130425A1

公开(公告)日：2005-06-16

申请号：US10985934

申请日：2004-11-12

申请人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

发明人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

IPC分类号： G06K19/07 ,  G06K19/077 ,  H01R43/02 ,  H01L21/302 ,  H01L21/461

CPC分类号： G06K19/0775 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2924/01079

摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

摘要翻译： 存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。 在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。 该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。 因此，该方法抑制天线的变形。

公开(公告)号：US06861294B2

公开(公告)日：2005-03-01

申请号：US10673459

申请日：2003-09-30

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US5914531A

公开(公告)日：1999-06-22

申请号：US805737

申请日：1997-02-25

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/04 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US08110907B2

公开(公告)日：2012-02-07

申请号：US12318798

申请日：2009-01-08

申请人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

发明人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/50 ,  H01L24/93 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/78313 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

摘要翻译： 半导体器件包括半导体芯片，第一基板和第二基板。 第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。 第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。 第一基板的导线的宽度根据导线的长度而不同。 通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

公开(公告)号：US20090206492A1

公开(公告)日：2009-08-20

申请号：US12318798

申请日：2009-01-08

申请人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

发明人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/50 ,  H01L24/93 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/78313 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

摘要翻译： 半导体器件包括半导体芯片，第一基板和第二基板。 第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。 第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。 第一基板的导线的宽度根据导线的长度而不同。 通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

公开(公告)号：US07172130B2

公开(公告)日：2007-02-06

申请号：US10960074

申请日：2004-10-08

申请人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

发明人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

IPC分类号： G06K19/06 ,  H05B3/30 ,  B29V45/14 ,  G08B13/14

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/07764

摘要： The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

摘要翻译： 本发明旨在提高RFID芯片入口的耐久性。 包括与天线对应的RFID芯片的模块被具有粘合剂层的聚酰亚胺膜覆盖以构成RFID入口。 然后，RFID入口的外表面被处理的表面覆盖以增加基部的表面润滑性。 当RFID入口用于橡胶制品时，它被安装到橡胶制品的橡胶基座上，RFID入口的暴露表面被未硫化橡胶覆盖，然后将未硫化橡胶压制和加热，使得RFID 入口嵌入橡胶底座。