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公开(公告)号：US08710654B2
公开(公告)日：2014-04-29
申请号：US13477387
申请日：2012-05-22
CPC分类号： H01L24/81 , H01L21/50 , H01L23/3128 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/14151 , H01L2224/14155 , H01L2224/14156 , H01L2224/14177 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81139 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/83104 , H01L2224/83815 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/01047 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.
摘要翻译： 在一个实施例中，半导体器件包括堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片。 第一和第二半导体芯片通过第一凸块连接部电连接。 止动器突起和接合突起设置在第一和第二半导体芯片中的至少一个上。 止动突起与未粘合状态的第一和第二半导体芯片中的另一个接触。 接合突起接合到第一和第二半导体芯片。
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公开(公告)号：US20130134583A1
公开(公告)日：2013-05-30
申请号：US13477387
申请日：2012-05-22
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： H01L24/81 , H01L21/50 , H01L23/3128 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/10135 , H01L2224/10165 , H01L2224/13025 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/14151 , H01L2224/14155 , H01L2224/14156 , H01L2224/14177 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81139 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/83104 , H01L2224/83815 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012 , H01L2924/01083 , H01L2924/01029 , H01L2924/01047 , H01L2924/00
摘要： In one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first and second semiconductor chips are electrically connected via first bump connection parts. Stopper projections and bonding projections are provided at least one of the first and second semiconductor chips. The stopper projections are in contact with the other of the first and second semiconductor chips in an unbonded state. The bonding projections are bonded to the first and second semiconductor chips.
摘要翻译： 在一个实施例中，半导体器件包括堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片。 第一和第二半导体芯片通过第一凸块连接部电连接。 止动器突起和接合突起设置在第一和第二半导体芯片中的至少一个上。 止动突起与未粘合状态的第一和第二半导体芯片中的另一个接触。 接合突起接合到第一和第二半导体芯片。
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公开(公告)号：US09024424B2
公开(公告)日：2015-05-05
申请号：US13586914
申请日：2012-08-16
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065 , H01L25/03 , H01L23/495
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
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公开(公告)号：US20120306103A1
公开(公告)日：2012-12-06
申请号：US13586914
申请日：2012-08-16
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
摘要翻译： 堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。 第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。 双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。 第一层在粘合剂温度下软化或熔化。 第二层在粘合剂温度下保持层状。 根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。
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公开(公告)号：US08268673B2
公开(公告)日：2012-09-18
申请号：US13137097
申请日：2011-07-20
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L21/00 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02 , H01L23/14 , H01L23/34 , H01L23/29 , H01L25/11 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
摘要翻译： 堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。 第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。 双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。 第一层在粘合剂温度下软化或熔化。 第二层在粘合剂温度下保持层状。 根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。
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公开(公告)号：US08008763B2
公开(公告)日：2011-08-30
申请号：US12011253
申请日：2008-01-25
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L23/02 , H01L23/34 , H01L23/06 , H01L23/04 , H01L23/12 , H01L23/48 , H01L23/52 , H01L23/40
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
摘要翻译： 堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。 第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。 双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。 第一层在粘合剂温度下软化或熔化。 第二层在粘合剂温度下保持层状。 根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。
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公开(公告)号：US20100320258A1
公开(公告)日：2010-12-23
申请号：US12815693
申请日：2010-06-15
申请人： Kanako Sawada , Hideo Aoki , Naoyuki Komuta , Koji Ogiso
发明人： Kanako Sawada , Hideo Aoki , Naoyuki Komuta , Koji Ogiso
IPC分类号： B23K31/02
CPC分类号： B23K1/008 , B23K1/0016 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/056 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/16 , H01L2224/81065 , H01L2224/81193 , H01L2224/81801 , H01L2224/81986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , Y10T29/49144 , Y10T29/49149 , H01L2924/00 , H01L2924/01083 , H01L2224/05099
摘要： In one embodiment, a first substrate having first solder bumps and a second substrate having second solder bumps are stacked while temporarily tacking the solder bumps to each other, and then a stack is disposed inside a furnace. The gas in the furnace is exhausted to be in a reduced pressure atmosphere, and then a carboxylic acid gas is introduced into the furnace. While increasing a temperature inside the furnace where the carboxylic acid gas is introduced, the gas in the furnace is exhausted to be in a reduced pressure atmosphere at a temperature in a range from a reduction temperature of oxide films by the carboxylic acid gas to lower than a melting temperature of the solder bumps. By increasing the temperature inside the furnace up to a temperature in a range of the melting temperature of the solder bumps and higher, the first solder bumps and the second solder bumps are melted and joined.
摘要翻译： 在一个实施例中，堆叠具有第一焊料凸块的第一基板和具有第二焊料凸块的第二基板，同时临时将焊料凸块彼此粘贴，然后将堆叠设置在炉内。 将炉内的气体排出到减压气氛中，然后将羧酸气体引入炉中。 在提高引入了羧酸气体的炉内的温度的同时，将炉内的气体在由氧化物膜的还原温度通过羧酸气体降低至低于室温的温度下排出到减压气氛中 焊料凸块的熔化温度。 通过将炉内的温度升高到焊锡凸块的熔融温度范围内的温度，使第一焊料凸块和第二焊料凸点熔化并接合。
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公开(公告)号：US08191758B2
公开(公告)日：2012-06-05
申请号：US12815693
申请日：2010-06-15
申请人： Kanako Sawada , Hideo Aoki , Naoyuki Komuta , Koji Ogiso
发明人： Kanako Sawada , Hideo Aoki , Naoyuki Komuta , Koji Ogiso
CPC分类号： B23K1/008 , B23K1/0016 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/056 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/16 , H01L2224/81065 , H01L2224/81193 , H01L2224/81801 , H01L2224/81986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , Y10T29/49144 , Y10T29/49149 , H01L2924/00 , H01L2924/01083 , H01L2224/05099
摘要： In one embodiment, a first substrate having first solder bumps and a second substrate having second solder bumps are stacked while temporarily tacking the solder bumps to each other, and then a stack is disposed inside a furnace. The gas in the furnace is exhausted to be in a reduced pressure atmosphere, and then a carboxylic acid gas is introduced into the furnace. While increasing a temperature inside the furnace where the carboxylic acid gas is introduced, the gas in the furnace is exhausted to be in a reduced pressure atmosphere at a temperature in a range from a reduction temperature of oxide films by the carboxylic acid gas to lower than a melting temperature of the solder bumps. By increasing the temperature inside the furnace up to a temperature in a range of the melting temperature of the solder bumps and higher, the first solder bumps and the second solder bumps are melted and joined.
摘要翻译： 在一个实施例中，堆叠具有第一焊料凸块的第一基板和具有第二焊料凸块的第二基板，同时临时将焊料凸块彼此粘贴，然后将堆叠设置在炉内。 将炉内的气体排出到减压气氛中，然后将羧酸气体引入炉中。 在提高引入了羧酸气体的炉内的温度的同时，将炉内的气体在由氧化物膜的还原温度通过羧酸气体降低至低于室温的温度下排出到减压气氛中 焊料凸块的熔化温度。 通过将炉内的温度升高到焊锡凸块的熔融温度范围内的温度，使第一焊料凸块和第二焊料凸点熔化并接合。
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公开(公告)号：US20110281396A1
公开(公告)日：2011-11-17
申请号：US13137097
申请日：2011-07-20
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L21/50
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
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公开(公告)号：US07629695B2
公开(公告)日：2009-12-08
申请号：US11132290
申请日：2005-05-19
申请人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
发明人： Atsushi Yoshimura , Naoyuki Komuta , Hideo Numata
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02 , H01L23/14 , H01L23/34 , H01L23/29 , H01L25/11 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/49575 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06586 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.
摘要翻译： 堆叠的电子部件包括经由第一粘合剂层粘附在基板上的第一电子部件和通过使用第二粘合层粘附的第二电子部件。 第二粘合剂层具有由相同材料形成且具有不同弹性模量的两层结构。 双层结构的第二粘合剂层具有设置在第一电子部件侧的第一层和设置在第二电子部件侧的第二层。 第一层在粘合剂温度下软化或熔化。 第二层在粘合剂温度下保持层状。 根据堆叠的电子元件，可以防止绝缘故障和短路的发生，并且还可以抑制电子部件之间的剥离故障，制造成本的增加等。
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