公开(公告)号：US4673724A

公开(公告)日：1987-06-16

申请号：US804419

申请日：1985-12-04

申请人： Seiji Endoh ,  Kunio Kimura ,  Toshihiko Ohta ,  Yasuo Kato

发明人： Seiji Endoh ,  Kunio Kimura ,  Toshihiko Ohta ,  Yasuo Kato

IPC分类号： C08G63/06 ,  C08G65/38

CPC分类号： C08G63/065

摘要： A crystalline polymeric whisker comprising repeating units derived from a compound selected from the group consisting of p-oxybenzoyl and 2-oxy-6-naphthoyl, which has high elasticity and tenacity as well as good heat resistance.

摘要翻译： 一种结晶聚合物晶须，其包含衍生自选自对氧基苯甲酰基和2-氧基-6-萘甲酰基的化合物的重复单元，其具有高弹性和韧性以及良好的耐热性。

公开(公告)号：US5461527A

公开(公告)日：1995-10-24

申请号：US340448

申请日：1994-11-14

申请人： Junichi Akiyama ,  Yuichi Ohsawa ,  Hitoshi Iwasaki ,  Reiko Kondoh ,  Kohichi Tateyama ,  Toshihiko Ohta ,  Hiroaki Yoda

发明人： Junichi Akiyama ,  Yuichi Ohsawa ,  Hitoshi Iwasaki ,  Reiko Kondoh ,  Kohichi Tateyama ,  Toshihiko Ohta ,  Hiroaki Yoda

IPC分类号： G11B5/39

CPC分类号： G11B5/3932 ,  G11B5/399

摘要： A member having a first and a second magnetic layer are magnetostatically coupled and laminated and the first magnetic layer formed on a magneto-resistive element, for creating the exchange coupling on the magneto-resistive element and the first magnetic layer. The member is formed by sequentially laminating a first ferromagnetic layer magnetized in a sense along the direction of the longitudinal bias of the magneto-resistive element, non-magnetic layer and second ferromagnetic layer magnetized in a direction opposite to the magnetized direction of the first ferromagnetic layer, for example.

摘要翻译： 具有第一和第二磁性层的构件被静磁耦合和层叠，并且第一磁性层形成在磁阻元件上，用于在磁阻元件和第一磁性层上产生交换耦合。 该构件通过沿着磁阻元件的方向磁化的第一铁磁层顺序地层叠，非磁性层和第二铁磁层沿与第一铁磁体的磁化方向相反的方向被磁化的方向 层，例如。

公开(公告)号：US5361382A

公开(公告)日：1994-11-01

申请号：US966147

申请日：1993-01-07

申请人： Shirou Nakamura ,  Takeo Shimizu ,  Hisaharu Yanagawa ,  Toshihiko Ohta ,  Takashi Shigematsu ,  Toshihiro Ochiai ,  Koichi Kobayashi

发明人： Shirou Nakamura ,  Takeo Shimizu ,  Hisaharu Yanagawa ,  Toshihiko Ohta ,  Takashi Shigematsu ,  Toshihiro Ochiai ,  Koichi Kobayashi

IPC分类号： G02B6/30 ,  G02B6/38

CPC分类号： G02B6/3838 ,  G02B6/30 ,  G02B6/3839 ,  G02B6/3865 ,  G02B6/3858 ,  G02B6/3873 ,  G02B6/3885 ,  Y10S359/90

摘要： A method of connecting waveguides and optical fibers includes the steps of forming the waveguides and a marker at the same time on a waveguide substrate when patterning the waveguides by a photolithography method, forming a clad layer on a region other than another region when the marker is formed so as to embed the waveguides, and forming a fitting pin groove at a position corresponding to a position of the marker. By using this fitting pin groove, a waveguide module and an optical fiber connector are connected so as to connect each of the waveguides and each of the optical fibers with each other. With this method, waveguides and optical fibers can be aligned and connected with each other easily and in a short period of time without employing an expensive aligning device.

摘要翻译： PCT No.PCT / JP92 / 00643 Sec。 371日期：1993年1月7日 102（e）日期1993年1月7日PCT提交1992年5月20日PCT公布。 出版物WO92 / 21047 日期：1992年11月26日。一种连接波导和光纤的方法包括以下步骤：在通过光刻法对波导进行图案化时在波导基板上同时形成波导和标记物，在其它区域上形成覆盖层 比标记物形成为嵌入波导时的另一区域，并且在与标记的位置对应的位置处形成嵌合销槽。 通过使用该嵌合销槽，连接波导模块和光纤连接器，以将每个波导和每个光纤彼此连接。 利用这种方法，波导和光纤可以容易地并且在短时间内彼此对准和连接，而不需要使用昂贵的对准装置。

公开(公告)号：US4910394A

公开(公告)日：1990-03-20

申请号：US152391

申请日：1988-02-04

申请人： Toshihiko Ohta

发明人： Toshihiko Ohta

IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G11B5/31

CPC分类号： G06K19/07779 ,  G06K19/0723 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07783 ,  G06K19/07784

摘要： A transducer for an IC card having a built-in semiconductor memory performs signal conversion by magnetic coupling to read out data. This transducer comprises a substrate, which has a first section of a predetermined thickness, and a second section, thinner than and formed in contact with the first section. A pair of first thin-film spiral coils, both would in the same direction, are formed on the first section of the substrate, and thin-film connection pads, respectively coupled to the first spiral coils, are formed on the second section. Then, an insulating film is deposited on the substrate and the first spiral coil. Through holes are made in the insulating film, thus exposing the center portion of the first spiral coil. A pair of second thin-film spiral coils, both also would in the same direction, are formed on the insulating film such that they are coupled to the first spiral coils. An anisotropic conductive film, for supplying a signal from the memory, is coupled to the pads by means of the through holes.

摘要翻译： 用于具有内置半导体存储器的IC卡的换能器通过磁耦合执行信号转换以读出数据。 该换能器包括具有预定厚度的第一部分的基底和比第一部分更薄并且形成为与第一部分接触的第二部分。 在基板的第一部分上形成一对第一薄膜螺旋线圈，两者都将沿相同的方向，并且分别耦合到第一螺旋线圈的薄膜连接焊盘形成在第二部分上。 然后，在基板和第一螺旋线圈上沉积绝缘膜。 在绝缘膜中形成通孔，从而露出第一螺旋线圈的中心部分。 一对第二薄膜螺旋线圈也将沿相同的方向形成在绝缘膜上，使得它们耦合到第一螺旋线圈。 用于从存储器提供信号的各向异性导电膜通过通孔耦合到焊盘。

公开(公告)号：US4824619A

公开(公告)日：1989-04-25

申请号：US135235

申请日：1987-12-21

申请人： Fujio Okada ,  Toshihiko Ohta

发明人： Fujio Okada ,  Toshihiko Ohta

IPC分类号： B29C55/02 ,  B29C55/00 ,  B29K23/00 ,  B29L7/00 ,  C08J5/18 ,  D01F6/04 ,  D02J1/22 ,  B29C47/92

CPC分类号： C08J5/18 ,  B29C55/005 ,  D01F6/04 ,  B29K2023/06 ,  C08J2323/04

摘要： A process for producing polyethylene drawn filaments and drawn films which comprises molding under pressure a mixture of 51 to 90 parts by weight of polyethylene powder having a weight average molecular weight of at least 4.times.10.sup.5 and having no history of being molten or dissolved after polymerization, and 49 to 10 parts by weight of a solvent at a temperature lower than the melting point of the mixture, and then hot-stretching the molded product.

摘要翻译： 一种聚乙烯拉伸长丝和拉伸膜的制造方法，其包括在压力下成型51〜90重量份的重均分子量为4×10 5以上且聚合后没有熔融或溶解的聚乙烯粉末的混合物，以及 在比混合物的熔点低的温度下加入49〜10重量份的溶剂，然后热成型制品。

公开(公告)号：US4818853A

公开(公告)日：1989-04-04

申请号：US53758

申请日：1987-05-26

申请人： Toshihiko Ohta ,  Kazuyoshi Fuse ,  Kunio Ohmi ,  Toshiaki Sato ,  Masayuki Shinozaki

发明人： Toshihiko Ohta ,  Kazuyoshi Fuse ,  Kunio Ohmi ,  Toshiaki Sato ,  Masayuki Shinozaki

IPC分类号： G06K7/08 ,  G06K19/077 ,  G06K19/06

CPC分类号： G06K19/07779 ,  G06K19/07749 ,  G06K19/07783 ,  G06K7/10336

摘要： A data card which can be resiliently flexed to a degree. The data card includes a laminated structure member having at least a synthetic resin protective layer and a ferromagnetic material layer, an electric circuit device embedded in the laminated structure member and an electro-magnetic transducer having a pair of coils which are formed on the laminated structure member. The pair of coils are coupled to the electric circuit device for generating magnetic fluxes of opposite directions with each other according to an information signal applied from the electric circuit device. Alternatively, the pair of coils are provided for receiving magnetic fluxes of opposite directions with each other and coupled to the electric circuit device for applying an electric signal generated by the magnetic fluxes of opposite directions thereto.

公开(公告)号：US07091870B2

公开(公告)日：2006-08-15

申请号：US10078374

申请日：2002-02-21

申请人： Hirofumi Tsutsumi ,  Keiko Nakashige ,  Seiji Tanaka ,  Yoshihiro Nishikawa ,  Yasuaki Takada ,  Toshihiko Ohta ,  Akio Torii ,  Tomoyuki Hisada ,  Kenji Kusumoto

发明人： Hirofumi Tsutsumi ,  Keiko Nakashige ,  Seiji Tanaka ,  Yoshihiro Nishikawa ,  Yasuaki Takada ,  Toshihiko Ohta ,  Akio Torii ,  Tomoyuki Hisada ,  Kenji Kusumoto

IPC分类号： G08B17/10

CPC分类号： H01J49/04

摘要： A terminal system has a mass spectrometric for inspecting of dangerous substances is installed in an inspection area, and a support system for determining whether or not a dangerous substance is present and identifying the type of the substance, based on the mass spectrometric data on the target element that has been measured by the mass spectrometric, is installed in a security service enterprise's office. Both systems are connected to each other via a communication network so that they can exchange information. Thus, the support system can send the determination result of dangerous substances and a precautions guide to the terminal system via the communication network.

摘要翻译： 终端系统具有用于检查危险物质的质谱，安装在检查区域中，并且基于目标上的质谱数据，确定是否存在危险物质并确定物质的类型的支持系统 已经通过质谱测量的元素安装在安全服务企业的办公室。 两个系统通过通信网络彼此连接，使得它们可以交换信息。 因此，支持系统可以通过通信网络向终端系统发送危险物质的确定结果和预防措施指导。

公开(公告)号：US5940728A

公开(公告)日：1999-08-17

申请号：US647672

申请日：1996-05-15

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/81 ,  H05K3/3489 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174

摘要： A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

摘要翻译： 一种用于制造电子电路的方法，根据该方法，可以通过施加允许在金属表面上的氧化物膜，有机物质，碳等的金属表面处理方法而不使用复合物来进行焊接，而不使用焊剂 过程也不利于影响电子设备或电路基板。 通过焊料连接电子设备和电路基板的过程包括以下步骤：用激光束照射焊料以清洁焊料，将电子器件对准和安装在电路基板上，并将所述焊料热熔化成 低氧含量的气氛来粘合电子器件和电路基板。

公开(公告)号：US5249100A

公开(公告)日：1993-09-28

申请号：US522531

申请日：1990-05-11

申请人： Ryohei Satoh ,  Kazuo Hirota ,  Takaji Takenaka ,  Hideki Watanabe ,  Toshinori Ameya ,  Toshihiko Ohta

发明人： Ryohei Satoh ,  Kazuo Hirota ,  Takaji Takenaka ,  Hideki Watanabe ,  Toshinori Ameya ,  Toshihiko Ohta

IPC分类号： H01L23/50 ,  B23K35/30 ,  C04B37/02 ,  H01L21/60 ,  H01L23/433 ,  H01L23/498

CPC分类号： H01L24/81 ,  B23K35/3013 ,  C04B37/026 ,  H01L23/433 ,  H01L23/49811 ,  C04B2235/6565 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/40 ,  C04B2237/568 ,  C04B2237/76 ,  C04B2237/80 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/351

摘要： Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356.degree. C. to 450.degree. C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the solder (14) from the melting point thereof is low and the substrate (2) does not break. The solder (14) is a Au-Ge alloy containing 10-15 wt % of Ge. Electronic circuit devices, which employ the above solder (14) in the connections, are free from damages in the ceramic wiring substrate (2) due to the bonding. Further, when the electronic circuit device undergoes a series of assembly processes after the above bonding, such solder (14) does not melt, and wettability of such solder (14) is favorable.

摘要翻译： 公开了一种电子电路装置，其中将引脚（6）连接到陶瓷基板（2）的焊料（14）的熔点为356℃至450℃，并且在这种 在焊料（14）的熔点冷却过程中产生的热收缩应力低，基板（2）不破裂的程度。 焊料（14）是含有10-15重量％的Ge的Au-Ge合金。 在连接中使用上述焊料（14）的电子电路装置在陶瓷布线基板（2）中由于接合而没有损坏。 此外，当电子电路装置经过上述接合之后的一系列装配工艺时，这种焊料（14）不熔化，并且这种焊料（14）的润湿性是有利的。

公开(公告)号：US4825056A

公开(公告)日：1989-04-25

申请号：US932521

申请日：1986-11-20

申请人： Toshihiko Ohta ,  Fumio Izawa

发明人： Toshihiko Ohta ,  Fumio Izawa

IPC分类号： G06K7/08 ,  G06K19/077 ,  G06K19/06

CPC分类号： G06K7/10336 ,  G06K19/06206 ,  G06K19/07749

摘要： A thin-film type electromagnetic transducer formed on a nonmagnetic substrate by a thin-film forming process. The transducer includes a magnetic core formed on the substrate by the thin-film forming process, and a conductor coil formed on the substrate by the thin-film forming process, so as to be wound around the core. The core is shaped so that a leakage flux generated along the plane of the substrate is greater than that generated in a direction intersecting with the plane of the substrate, the leakage fluxes being generated from the core when a current is supplied to the coil. In a method for transferring signals from the thin-film type electromagnetic transducer described above, a magnetic head is located so as to face that region of the core of the transducer where the maximum leakage flux is generated. The magnetic head has a magnetic gap such that the direction of a leakage flux generated in the gap is coincident with that of the maximum leakage flux from the core, and whereby magnetic signals are transferred between the magnetic head and the maximum-leakage-flux generating region of the core.

摘要翻译： 通过薄膜形成工艺形成在非磁性基底上的薄膜型电磁换能器。 换能器包括通过薄膜形成工艺在基板上形成的磁芯，以及通过薄膜形成工艺在基板上形成的导体线圈，以缠绕在芯上。 芯的形状使得沿着基板的平面产生的漏磁通大于在与基板的平面交叉的方向上产生的漏磁通，当电流被提供给线圈时，漏磁通是从磁芯产生的。 在用于从上述薄膜型电磁换能器传送信号的方法中，磁头被定位成面对产生最大漏磁通的换能器的芯的区域。 磁头具有磁隙，使得在间隙中产生的漏磁通的方向与来自芯的最大漏磁通的方向一致，从而磁信号在磁头和最大泄漏磁通产生之间传递 核心区域。