摘要:
Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356.degree. C. to 450.degree. C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the solder (14) from the melting point thereof is low and the substrate (2) does not break. The solder (14) is a Au-Ge alloy containing 10-15 wt % of Ge. Electronic circuit devices, which employ the above solder (14) in the connections, are free from damages in the ceramic wiring substrate (2) due to the bonding. Further, when the electronic circuit device undergoes a series of assembly processes after the above bonding, such solder (14) does not melt, and wettability of such solder (14) is favorable.
摘要:
In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.
摘要:
A member having a first and a second magnetic layer are magnetostatically coupled and laminated and the first magnetic layer formed on a magneto-resistive element, for creating the exchange coupling on the magneto-resistive element and the first magnetic layer. The member is formed by sequentially laminating a first ferromagnetic layer magnetized in a sense along the direction of the longitudinal bias of the magneto-resistive element, non-magnetic layer and second ferromagnetic layer magnetized in a direction opposite to the magnetized direction of the first ferromagnetic layer, for example.
摘要:
A method of connecting waveguides and optical fibers includes the steps of forming the waveguides and a marker at the same time on a waveguide substrate when patterning the waveguides by a photolithography method, forming a clad layer on a region other than another region when the marker is formed so as to embed the waveguides, and forming a fitting pin groove at a position corresponding to a position of the marker. By using this fitting pin groove, a waveguide module and an optical fiber connector are connected so as to connect each of the waveguides and each of the optical fibers with each other. With this method, waveguides and optical fibers can be aligned and connected with each other easily and in a short period of time without employing an expensive aligning device.
摘要:
A transducer for an IC card having a built-in semiconductor memory performs signal conversion by magnetic coupling to read out data. This transducer comprises a substrate, which has a first section of a predetermined thickness, and a second section, thinner than and formed in contact with the first section. A pair of first thin-film spiral coils, both would in the same direction, are formed on the first section of the substrate, and thin-film connection pads, respectively coupled to the first spiral coils, are formed on the second section. Then, an insulating film is deposited on the substrate and the first spiral coil. Through holes are made in the insulating film, thus exposing the center portion of the first spiral coil. A pair of second thin-film spiral coils, both also would in the same direction, are formed on the insulating film such that they are coupled to the first spiral coils. An anisotropic conductive film, for supplying a signal from the memory, is coupled to the pads by means of the through holes.
摘要:
A process for producing polyethylene drawn filaments and drawn films which comprises molding under pressure a mixture of 51 to 90 parts by weight of polyethylene powder having a weight average molecular weight of at least 4.times.10.sup.5 and having no history of being molten or dissolved after polymerization, and 49 to 10 parts by weight of a solvent at a temperature lower than the melting point of the mixture, and then hot-stretching the molded product.
摘要:
A data card which can be resiliently flexed to a degree. The data card includes a laminated structure member having at least a synthetic resin protective layer and a ferromagnetic material layer, an electric circuit device embedded in the laminated structure member and an electro-magnetic transducer having a pair of coils which are formed on the laminated structure member. The pair of coils are coupled to the electric circuit device for generating magnetic fluxes of opposite directions with each other according to an information signal applied from the electric circuit device. Alternatively, the pair of coils are provided for receiving magnetic fluxes of opposite directions with each other and coupled to the electric circuit device for applying an electric signal generated by the magnetic fluxes of opposite directions thereto.
摘要:
A terminal system has a mass spectrometric for inspecting of dangerous substances is installed in an inspection area, and a support system for determining whether or not a dangerous substance is present and identifying the type of the substance, based on the mass spectrometric data on the target element that has been measured by the mass spectrometric, is installed in a security service enterprise's office. Both systems are connected to each other via a communication network so that they can exchange information. Thus, the support system can send the determination result of dangerous substances and a precautions guide to the terminal system via the communication network.
摘要:
A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.
摘要:
A thin-film type electromagnetic transducer formed on a nonmagnetic substrate by a thin-film forming process. The transducer includes a magnetic core formed on the substrate by the thin-film forming process, and a conductor coil formed on the substrate by the thin-film forming process, so as to be wound around the core. The core is shaped so that a leakage flux generated along the plane of the substrate is greater than that generated in a direction intersecting with the plane of the substrate, the leakage fluxes being generated from the core when a current is supplied to the coil. In a method for transferring signals from the thin-film type electromagnetic transducer described above, a magnetic head is located so as to face that region of the core of the transducer where the maximum leakage flux is generated. The magnetic head has a magnetic gap such that the direction of a leakage flux generated in the gap is coincident with that of the maximum leakage flux from the core, and whereby magnetic signals are transferred between the magnetic head and the maximum-leakage-flux generating region of the core.