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    Process for producing fine patterns
    2.
    发明授权
    Process for producing fine patterns 失效
    生产精细图案的过程

    公开(公告)号：US4722883A

    公开(公告)日：1988-02-02

    申请号：US894122

    申请日：1986-08-07

    申请人： Shigeru Koibuchi ,  Asao Isobe ,  Daisuke Makino

    发明人： Shigeru Koibuchi ,  Asao Isobe ,  Daisuke Makino

    IPC分类号： G03C5/00 ,  G03F7/008 ,  G03F7/26 ,  H01L21/312

    CPC分类号： C07C247/00 ,  G03F7/008

    摘要： Fine patterns with high degree of resolution and high resistance to etching can be produced by coating a solution of a photosensitive composition comprising (a) an aromatic azide compound and (b) an alkaline-aqueous-solution-soluble polymer on a substrate, exposing predetermined portions of the coated photosensitive composition to ultraviolet light, developing with an alkaline aqueous solution to form a resist pattern, and etching the substrate using said resist pattern as a mask.

    摘要翻译： 可以通过将包含（a）芳族叠氮化合物和（b）碱溶性水溶性聚合物的感光性组合物的溶液涂布在基材上，使预定的 涂布的感光性组合物的一部分与紫外线的照射，用碱性水溶液显影形成抗蚀剂图案，并使用所述抗蚀剂图案作为掩模蚀刻所述基板。

    Photosensitive composition with 4-azido-2'-methoxychalcone
    3.
    发明授权
    Photosensitive composition with 4-azido-2'-methoxychalcone 失效
    具有4-叠氮基-2'-甲氧基查耳酮的光敏组合物

    公开(公告)号：US4698291A

    公开(公告)日：1987-10-06

    申请号：US886353

    申请日：1986-07-17

    申请人： Shigeru Koibuchi ,  Asao Isobe ,  Daisuke Makino

    发明人： Shigeru Koibuchi ,  Asao Isobe ,  Daisuke Makino

    IPC分类号： C08F2/48 ,  C08F2/50 ,  C08F126/02 ,  G03F7/008 ,  G03F7/26 ,  G03C1/52 ,  G03C1/60 ,  G03C1/72

    CPC分类号： C07C247/00 ,  C08F2/50 ,  G03F7/008

    摘要： 4'-Azidobenzal-2-methoxyacetophenone is an excellent photosensitive compound and can give a photosensitive composition together with an alkaline-aqueous-solution-soluble polymer which can be insolubilized in an alkaline aqueous solution by photochemical curing with 4'-azidobenzal-2-methoxyacetophenone, and if necessary together with an organic solvent, said composition showing a very small change in viscosity with the lapse of long time.

    摘要翻译： 4'-叠氮基亚苄基-2-甲氧基苯乙酮是一种优异的光敏化合物，可以与一种碱溶性水溶性聚合物一起得到感光性组合物，该聚合物可以通过光化学固化在碱性水溶液中不溶于4'-叠氮基亚苄基-2- 甲氧基苯乙酮，如果需要与有机溶剂一起，所述组合物随着时间的推移显示出非常小的粘度变化。

    Photosensitive resin composition and method for forming fine patterns with said composition
    4.
    发明授权
    Photosensitive resin composition and method for forming fine patterns with said composition 失效
    光敏树脂组合物和用所述组合物形成精细图案的方法

    公开(公告)号：US4554237A

    公开(公告)日：1985-11-19

    申请号：US452198

    申请日：1982-12-22

    申请人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

    发明人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

    IPC分类号： G03C1/72 ,  G03F7/008 ,  G03C1/52 ,  G03C1/60 ,  G03C5/16

    CPC分类号： G03F7/008 ,  Y10S430/128

    摘要： Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

    摘要翻译： 公开了用于在半导体器件上形成精细图案的光敏树脂组合物，具有高度敏感性和显影性优异的并且没有问题，例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀，以及方法 用于用所述组合物形成精细图案。 所述光敏树脂组合物包含（a）至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和（b）由通式（1）表示的叠氮化合物：其中 X是-N3或-SO2N3，Y是低级亚烷基，例如-CH2CH2-，-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-，羟基亚烷基或氨基亚烷基，例如

    Soldering mask formed from a photosensitive resin composition and a photosensitive element
    5.
    发明授权
    Soldering mask formed from a photosensitive resin composition and a photosensitive element 失效
    由感光性树脂组合物和光敏元件形成的焊接掩模

    公开(公告)号：US4499163A

    公开(公告)日：1985-02-12

    申请号：US512660

    申请日：1983-07-11

    申请人： Toshiaki Ishimaru ,  Katsushige Tsukada ,  Nobuyuki Hayashi ,  Shigeru Koibuchi ,  Asao Isobe

    发明人： Toshiaki Ishimaru ,  Katsushige Tsukada ,  Nobuyuki Hayashi ,  Shigeru Koibuchi ,  Asao Isobe

    IPC分类号： G03F7/004 ,  C08F2/50 ,  C08F299/06 ,  C08G18/67 ,  G03F7/027 ,  G03C5/00 ,  G03C1/78

    CPC分类号： G03F7/027 ,  C08F2/50 ,  C08F299/065 ,  C08G18/672

    摘要： A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.

    摘要翻译： 一种感光性树脂组合物，其含有（a）20〜75重量份通过使三甲基六亚甲基二异氰酸酯和/或异佛尔酮二异氰酸酯二元醇与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的氨基甲酸酯二丙烯酸酯或二甲基丙烯酸酯化合物，（b）20〜75 重量的玻璃化转变温度为约40〜150℃的线性高分子化合物，和（c）由于光化性光而产生自由基的敏化剂和/或敏化剂体系，耐热性优异， 耐热冲击和耐溶剂性，并且适于形成焊接掩模。 此外，通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性，耐热冲击性和耐溶剂性优异的保护涂膜，特别适用于焊接掩模。

    Water-dispersible epoxy modified alkyd resins
    9.
    发明授权
    Water-dispersible epoxy modified alkyd resins 失效
    水分散性环氧改性醇酸树脂

    公开(公告)号：US4154709A

    公开(公告)日：1979-05-15

    申请号：US883706

    申请日：1978-03-06

    申请人： Ryoji Ukita ,  Asao Isobe ,  Takao Hirayama ,  Shigeyoshi Tanaka

    发明人： Ryoji Ukita ,  Asao Isobe ,  Takao Hirayama ,  Shigeyoshi Tanaka

    IPC分类号： C08G63/66 ,  C09D167/08 ,  C09D3/64 ,  C09D3/66 ,  C09D5/02

    CPC分类号： C08G63/66 ,  C09D167/08

    摘要： A water-dispersible epoxy modified alkyd resin produced by reacting (A) 0-50 parts by weight of oil or oil fatty acid, (B) 10-50 parts by weight of polyhydric alcohol, (C) 0-25 parts by weight of monobasic acid having 6 to 18 carbon atoms, (D) 15-70 parts by weight of polybasic acid having 4 to 10 carbon atoms or its anhydride, (E) 5-25 parts by weight of polyoxyalkylene glycol having a molecular weight of 600 to 20,000, and (F) an epoxy compound, wherein the ratio of the hydroxyl groups to the carboxyl groups in the components (A) through (E) is 0.625-1.8 and the amount of the component (F) is 3-50 parts by weight per 100 parts by weight of the total weight of the components (A) through (E), can provide water-dispersible coatings having improved drying characteristics and water resistance as well as corrosion resistance.

    摘要翻译： （A）0-50重量份的油或油脂肪酸，（B）10-50重量份的多元醇，（C）0-25重量份的 具有6至18个碳原子的一元酸，（D）15-70重量份的具有4至10个碳原子的多元酸或其酸酐，（E）5-25重量份的分子量为600至100的聚氧化亚烷基二醇 20,000和（F）环氧化合物，其中组分（A）至（E）中羟基与羧基的比例为0.625-1.8，组分（F）的量为3-50份， （A）至（E）中每100重量份的重量，可以提供具有改进的干燥特性和耐水性以及耐腐蚀性的水分散性涂料。