摘要:
On carrying out a hole filling method for a printed wiring board having an interlayer connection hole, first and second printed wiring boards (1 and 2) are prepared, each of which has the interlayer connection hole. The first printed wiring board is placed on a bottom plate (7). On the first printed wiring board, a first hole guide plate (8) having a first guide hole formed at a position corresponding to the interlayer connection hole of the first printed wiring board is placed in such a manner that the first guide hole is coincident with the interlayer connection hole of the first printed wiring board. A hole filling resin (9) is superposed on the first hole guide plate. On the hole filling resin, a second hole guide plate (10) having a second guide hole formed at a position corresponding to the interlayer connection hole of the second printed wiring board is placed. On the second hole guide plate, the second printed wiring board is placed in such a manner that the interlayer connection hole of the second printed wiring board is coincident with the second guide hole of the second hole guide plate. A top plate (11) is placed on the second printed wiring board to form a stacked assembly which includes the first printed wiring board, the first hole guide plate, the hole filling resin, the second hole guide plate, and the second printed wiring board between the bottom plate and the top plate. The stacked assembly is vacuum-pressed between the bottom plate and the top plate to simultaneously fill the interlayer connection holes of the first and the second printed wiring boards with a part of the hole filling resin.
摘要:
A method includes the steps of forming a first metal foil (82) on a surface of an insulator substrate (1a), drilling, with a thermosetting resin film (84) temporarily fixed to an opposite surface of the substrate, a through hole (86) simultaneously in the first foil, the substrate, and the resin film, simultaneously heating and vacuum-pressing the first foil, the substrate, the resin film, and a second metal foil (87) brought into contact with the resin film to obtain an intermediate board in which a bottom of the through hole is covered with the second foil and has a corner with a corner rounded portion (93) formed by the resin film, and forming a metal plating layer (95) on the first and the second foils, on the bottom and an inner wall of the through hole, and on the corner rounded portion to obtain a final printed wiring board.
摘要:
A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25° C. and is represented by the following average compositional formula: R1aSiO(4-a)/2, where, R1 is a monovalent hydrocarbon group; and “a” is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B1) to (B3) given below, wherein: constituent (B1) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 μm; constituent (B2) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 μm; constituent (B3) is aluminum oxide powder with an average particle size not exceeding 1 μm; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.
摘要:
A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.
摘要:
A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25° C. and is represented by the following average compositional formula: R1aSiO(4-a)/2, where, R1 is a monovalent hydrocarbon group; and “a” is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B1) to (B3) given below, wherein: constituent (B1) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 μm; constituent (B2) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 μm; constituent (B3) is aluminum oxide powder with an average particle size not exceeding 1 μm; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.
摘要:
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion.
摘要:
A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.
摘要:
A method of manufacturing an optical semiconductor device (16) sealed in a transparent or semitransparent cured silicone body (50) by placing an unsealed optical semiconductor device (16) into a mold (23, 34) and subjecting a transparent or semitransparent curable silicone composition (50) that fills the spaces between the mold and the unsealed device (70) to compression molding; provides the sealed optical semiconductor device that is free of voids, allows control of the coating layer thickness, protects the bonding wires from breakage and accidental contact, reduces concentration of stress on an optical semiconductor element, has long service life with reducing discoloration and disconnection of the sealing resin from the optical semiconductor element (16), and has excellent reliability.
摘要:
A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
摘要:
A method to automatically operate a CAD/CAM apparatus corresponding to a plurality of machines. Machining definition data corresponding to machines is generated and stored as multiple machine inter-reference type machining definition data. Pre-defined data is referenced from the multiple machine inter-reference type machining definition data so as to automatically generate machining definition data corresponding to other machines. Specifically, by at least combining product graphic data and machining conditions, and utilizing two dimension and three dimension machining definition tables as required, shapes and machining conditions can be formed.