摘要:
A power converter includes a power module allowing supply and cutoff of main current, a driver module controlling supply and cutoff of the main current, a high potential side semiconductor device, and a low potential side semiconductor device. Plural power module side wirings are connected with respective electrodes contained in the high and low potential side semiconductor devices. Plural driver module side wirings are provided on the driver module as wirings connected with the plural corresponding power module side wirings. Conductors are disposed in the vicinity of a plane on which the plural power module side wirings are provided and a plane on which the plural driver module side wirings are provided, and electrically connected to surround magnetic flux generated by current looping at least through a power source transformer, the driver module side wirings, and the power module side wirings.
摘要:
A power converter which has a power module allowing supply and cutoff of main current, and a driver module controlling supply and cutoff of the main current allowed by the power module includes: a high potential side semiconductor device which allows supply and cutoff of the main current on the high potential side of the power module; a low potential side semiconductor device which allows supply and cutoff of the main current on the low potential side of the power module, and is connected with the high potential side semiconductor device in series; plural power module side wirings connected with respective electrodes contained in the high potential side semiconductor device and the low potential side semiconductor device, and disposed adjacent to each other substantially on the same plane as the power module in the order of applied potentials with a connection end between the plural power module side wirings and the driver module located along the end of the power module; plural driver module side wirings provided on the driver module as wirings connected with the plural corresponding power module side wirings, and disposed adjacent to each other substantially on the same plane as the driver module in the order corresponding to the positions of the plural power module side wirings in positions along the end of the driver module; a power source transformer as a circuit which converts a signal voltage for controlling the supply and cutoff of the main current by the driver module into voltage applied to a control electrode of the high potential side semiconductor device and a control electrode of the low potential side semiconductor device, plural terminals of the power source transformer in correspondence with the plural driver module side wirings being provided in the order of the positions of the plural corresponding driver module side wirings; and conductors disposed in the vicinity of the plane on which the plural power module side wirings are provided and in the vicinity of the plane on which the plural driver module side wirings are provided, and electrically connected in such positions as to surround magnetic flux generated by current looping at least through the power source transformer, the driver module side wirings, and the power module side wirings.
摘要:
A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.
摘要:
A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.
摘要:
A particulate water absorbent resin is obtained by polymerizing an unsaturated monomer so as to form a cross-linked polymer hydrogel and drying and pulverizing the cross-linked polymer hydrogel, and plural classification steps different from each other are carried out so as to remove fine powder. In this manner, the present invention provides the method for classification of particulate water absorbent resin which method allows particulate water absorbent resin having a desired particle diameter range to be efficiently obtained at low cost while securing the high productivity even in case where a larger production equipment is used.
摘要:
Provided is a method for producing a water absorbent resin, which promotes the formation of interconnected voids (continuous gas bubbles) in a foamed polymer (foam-like water absorbent resin) by a more convenient method, and produces with high efficiency a water absorbent resin which exhibits a high water absorption rate even when stepped into a sheet form or a powder form in hygiene articles and the like. Disclosed is a a method for producing a polyacrylic acid-type water absorbent resin, comprising (A) a step of obtaining an aqueous solution of acrylic acid-type monomers containing gas bubbles dispersed therein; (B) a step of polymerizing the aqueous monomer solution and thereby obtaining a foamed polymer; and (C) a step of heating and drying the foamed polymer, wherein gas bubbles are incorporated such that the volumetric expansion factor defined by the following formula (1); [Formula 1] Volumetric expansion factor=(Volume of aqueous monomer solution after gas bubble dispersion)/(volume of aqueous mononer solution before gas bubble dispersion) Formula (1); exceeds 1.1 times, and the aqueous monomer solution having a monomer concentration defined by the following formula (2); [Formula 2] Monomer concentration [wt %]=(Weight of a monomer)/{(weight of a monomer)+(weight of solvent)}×100 Formula (2); of 40% by weight or greater is boiling polymerized at a temperature of 100° C. or higher.
摘要:
A production method for a water-absorbent resin, comprising a polymerization step for obtaining hydrogel by subjecting a monomer aqueous solution to a polymerization reaction, and a drying step for drying the hydrogel, wherein drying in the drying step is performed using a continuous through-flow belt-type drying machine, the pore opening rate of the through-flow belt in the continuous through-flow belt-type drying machine is 20 to 50%, the solid content of the hydrogel supplied to the drying step is 35% by weight or more, and the area occupancy rate of the hydrogel is 85 to 100% relative to the through-flow belt.
摘要:
Provided is a method which does not require alteration of the raw materials or high capital investment, and improves and stabilizes the physical property (for example, liquid permeability) of a water absorbent resin by means of a simple technique. A method for producing a water absorbent resin is disclosed, which method includes a polymerization step of polymerizing an aqueous solution of acrylic acid (salt) to obtain a water-containing gel-like crosslinked polymer; a drying step of drying the water-containing gel-like crosslinked polymer to obtain a water absorbent resin powder; a classification step of classifying the water absorbent resin powder; and a surface crosslinking step of surface crosslinking the water absorbent resin powder, wherein in the classification steps that are carried before the surface crosslinking step and/or after the surface crosslinking step, the stretch tension (tension) of the metal sieve mesh used in the classification step is from 35 [N/cm] to 100 [N/cm].