摘要:
A liquid source container device is used for a liquid gas source for a semiconductor manufacturing device. This container device includes a main body for containing a source liquid, to which a gas supply line for transferring the source liquid, and a source liquid delivery line for delivering the liquid are connected. The gas supply line has first and second gas supply valves provided thereon, and the liquid delivery line has first and second liquid delivery valves also provided thereon. A section of the gas supply line which is located between the first and second gas supply valves and a section of the liquid delivery line which is located between the first and second delivery valves are connected with each other by means of a purge line which has a purge valve provided thereon. By operating the purge line, the purge valve, and the four valves, the efficiency of purge-drying procedures carried out before and after transferring the source liquid, is improved, and therefore the container device, as well as the semiconductor manufacturing device can be prevented from being contaminated.
摘要:
A vertical heat processing apparatus for performing a heat process on a plurality of target substrates all together includes a vertical process container configured to accommodate the target substrates and having a transfer port at a bottom; a holder configured to support the target substrates at intervals in a vertical direction inside the process container; and a heater disposed around the process container, and configured to supply heat rays through a sidewall of the process container, so as to heat an interior of the process container. A thermal buffer member is disposed between the heater and a lower end side of the process container to surround the lower end side, and is configured to decrease transmissibility of the lower end side for heat rays between the heater and target substrates inside the process container.
摘要:
A clean gas circulates to pass through a loading area provided below a vertical heat treatment furnace. The clean gas unidirectionally flows through the loading area. After completion of wafer processing, a wafer boat lowers from the heat treatment furnace to the loading area, where the wafers are removed from the wafer boat. Subsequently, a clean gas jetting nozzle arranged in the loading area jets a clean gas toward the emptied wafer boat. Fragment of thin film which may readily peel off are blown away from the wafer boat, and are discharged out of the loading area together with the unidirectional flow. Thus, it is possible to avoid wafer contamination due to the unexpected peel-off of thin film fragments from the wafer boat.
摘要:
A magneto-optical recording medium comprises a substrate, and a magnetic multilayer 4 on a surface side thereof. The magnetic multilayer comprises an amplifying layer A.sub.1 and a recording layer R.sub.2 which are laminated together and are each a magnetic layer. A nonmagnetic intermediate layer I.sub.12 is interleaved between the amplifying layer A.sub.1 and the recording layer R.sub.2 to couple them magnetostatically. The nonmagnetic intermediate layer I.sub.12 is made up of a metal oxide and has a thickness of 2 to 30 nm. The magnetic field intensity needed for magnetic field modulation reading or light modulation reading can be lowered.
摘要:
A magnetic recording medium having excellent electromagnetic characteristics, still characteristics and cupping resistance, reduced rust generation and increased durability, comprises a non-magnetic substrate and a magnetic layer formed thereon by oblique deposition, the magnetic layer being composed of at least two ferromagnetic metal thin films containing Co and Ni as main components, in which the Co content of the thin film closest to the substrate is less than 70 atomic per cent and the Co content of the film farthest from the substrate is 75 atomic per cent or more.
摘要:
After a polysilicon film is formed on a wafer, a cleaning gas containing ClF.sub.3 at 10 to 50 vol % is supplied into a reaction tube and an exhaust pipe system at a flow rate of 3000 to 3500 SCCM, so as to remove a polysilicon-based film deposited on an inner wall surface of the reaction tube, the surface of a member incorporated in the reaction tube, and an inner wall surface of the exhaust pipe system while the film forming process, by etching using ClF.sub.3. The cleaning gas is supplied while the temperature in the reaction tube is maintained at 450.degree. C. or higher, and in a pressure condition set at the maintained temperature such that an etching rate of the polysilicon-based film by the cleaning gas is higher than an etching rate of silicon which is the material of the reaction tube or the member incorporated in the reaction tube.
摘要:
A magnetic recording medium comprising a nonmagnetic base, an SiO.sub.x (x=1.2-1.95) undercoat, an under-layer ferromagnetic metal film consisting of a Co--Ni alloy, an SiO.sub.x (x=1.2-1.95) intermediate layer, an upper-layer ferromagnetic metal protective film consisting of a Co--Ni alloy, a diamond-like carbon protective film, and a lubricant layer, formed in the order of mention, the angles of vapor deposition as measured from lines normal to the upper- and under-layer ferromagnetic metal films being all decreasing toward the upper surfaces. The magnetic recording medium is made by forming an SiO.sub.x (x=1.2-1.95) undercoat by vapor deposition on a flexible nonmagnetic base being fed, forming an under-layer ferromagnetic metal film by vapor deposition of a Co--Ni alloy at a large deposition angle on the supply side and at a small deposition angle on the take up side, rewinding the semi-finished product thus obtained, repeating the foregoing process steps, forming a diamond-like carbon protective film, and further forming a lubricant layer over the diamond-like carbon protective film, all within a vacuum chamber.
摘要:
The present invention provides a cross-linking agent capable of preventing formation of scum from a bottom anti-reflective coating, and also provides a composition for forming a bottom anti-reflection coating containing the agent. The cross-linking agent is a nitrogen-containing aromatic compound having at least one vinyloxy group or N-methoxymethylamide group, and the composition contains the cross-linking agent. The cross-linking agent of the formula (1) can be produced by reaction of a nitrogen-containing aromatic compound, a halogen compound having a vinyloxy group or N-methoxymethylamide group and a basic compound.
摘要:
A clean gas circulates to pass through a loading area provided below a vertical heat treatment furnace. The clean gas unidirectionally flows through the loading area. After completion of wafer processing, a wafer boat lowers from the heat treatment furnace to the loading area, where the wafers are removed from the wafer boat. Subsequently, a clean gas jetting nozzle arranged in the loading area jets a clean gas toward the emptied wafer boat. Fragment of thin film which may readily peel off are blown away from the wafer boat, and are discharged out of the loading area together with the unidirectional flow. Thus, it is possible to avoid wafer contamination due to the unexpected peel-off of thin film fragments from the wafer boat.
摘要:
The present invention relates to a positive bottom photoimageable antireflective coating composition which is capable of being developed in an aqueous alkaline developer, wherein the antireflective coating composition comprises a polymer comprising at least one recurring unit with a chromophore group and one recurring unit with a hydroxyl and/or a carboxyl group, a vinyl ether terminated crosslinking agent of structure (7), and optionally, a photoacid generator and/or an acid and/or a thermal acid generator, where structure (7) is wherein W is selected from (C1-C30) linear, branched or cyclic alkyl moiety, substituted or unsubstituted (C3-C40) alicyclic hydrocarbon moiety and substituted is or unsubstituted (C3-C40) cycloalkylalkylene moiety; R is selected from C1-C10 linear or branched alkylene and n≧2. The invention further relates to a process for using such a composition.