摘要:
A resin composition for laser beam welding, including an aromatic polysulfone resin, a filler and a crystalline resin, wherein the weight ratio of the aromatic polysulfone resin to the filler being 20 to 99:80 to 1, the filler includes a glass fiber having a monofilament diameter of 10 to 50 μm, and the amount of the crystalline resin, relative to 100 parts by weight of the total of the aromatic polysulfone resin and the glass fiber being 0 to 10 parts by weight.
摘要:
The present invention provides a composition comprising a liquid crystal polyester, a white pigment and a glass fiber bundle obtained by bundling glass fibers using a sizing agent comprising a polyurethane having a polyester polyol unit and at least one of an aliphatic diisocyanate unit or an alicyclic diisocyanate unit, wherein the polyester polyol unit is a polyol unit having an aliphatic polyhydric alcohol unit and at least one of an aliphatic polybasic acid unit or an alicyclic polybasic acid unit. The liquid crystal polyester composition can provide a reflective plate having a high reflectivity.
摘要:
An aromatic polysulfone resin composition including an aromatic polysulfone resin and at least one compound selected from the group consisting of a monoacylglycerol, a diacylglycerol and a triacylglycerol, wherein the amount of the at least one compound, relative to 100 parts by weight of the aromatic polysulfone resin is preferably 0.02 to 4 parts by weight, and the aromatic polysulfone resin composition is preferably in the form of pellet obtained by subjecting the aromatic polysulfone resin and the at least one compound to melt-kneading.
摘要:
With the stage kept in an as-heated state, the semiconductor wafer is placed over the stage (step S10). Then, with the elapse of first time, a controller causes a pressure inside a vacuum chamber to rise to a second pressure higher than a first pressure (step S40). After the semiconductor wafer is placed over the stage, a pressure difference between a pressure inside the vacuum chamber and a pressure inside the adsorption port is set to a minimum value at which the semiconductor wafer is not allowed to slide over the protrusions. Further, in step S40 as well, the pressure difference is kept at the minimum value at which the semiconductor wafer is not allowed to slide over the protrusions.
摘要:
A method of producing a liquid crystal polyester composition, the twin-screw extruder including a cylinder having a supply port for supplying the liquid crystal polyester, a first addition port for adding the filler other than fibrous fillers and a second addition port for adding a fibrous filler which are provided downstream of the supply port, and a screw provided with kneading portions on the upstream side and downstream side of the first addition port, a resin temperature (T1) of the liquid crystal polyester after kneading in the nearest upstream kneading portion satisfying formula (1), and a resin temperature (T2) of the liquid crystal polyester after kneading in the nearest downstream kneading portion satisfying formula (2): FT−100(° C.)≦T1≦FT+20(° C.) (1) FT−100(° C.)≦T2≦FT+30(° C.) (2) wherein FT represents the flow starting temperature of the liquid crystal polyester.
摘要翻译:一种液晶聚酯组合物的制造方法,所述双螺杆挤出机包括具有用于供给液晶聚酯的供给口的圆筒,用于添加纤维状填料以外的填料的第一加料口和第二加料口, 设置在供给口下游的填料和在第一加料口的上游侧和下游侧具有混炼部的螺杆,在最近的上游捏合部捏合后的液晶聚酯的树脂温度(T1)满足 式(1)和在满足式(2)的最近的下游捏合部分捏合后的液晶聚酯的树脂温度(T2):FT-100(℃)≦̸ T1≦̸ FT + 20(℃) )(1)FT-100(℃)≦̸ T2≦̸ FT + 30(℃)(2)其中FT表示液晶聚酯的流动起始温度。
摘要:
The present invention provides a resin composition comprising (A) a thermoplastic resin, (B) alumina fine particles and (C) a plate-like filler, wherein the component (B) is contained in the larger amount than the amount of the component (C) in the composition, and the resin composition has a specific volume resistance of 1×1010 Ωm or more.
摘要:
An object is to provide a method for producing a liquid crystal polyester composition which is excellent in mechanical strength and has semiconductivity. The present invention provides a method for producing a liquid crystal polyester composition, which includes the step of melt-kneading a liquid crystal polyester in the amount of 85 to 99 parts by mass and a nanostructured hollow-carbon material in the amount of 1 to 15 parts by mass, based on 100 parts by mass in total of the liquid crystal polyester and the nanostructured hollow-carbon material, under shear rate of 1,000 to 9,000/second, the nanostructured hollow-carbon material including a carbon part and a hollow part, and having such a structure that a part or all of the hollow part is surrounded by the carbon part.
摘要:
A liquid crystalline polyester resin composition is provided, by which a molded article with an enhanced specific modulus can be produced. The liquid crystalline polyester resin composition comprises mica fillers in an amount of 15 to 30 parts by mass and carbon fibers with specific volume resistance of 108 Ωcm or more in an amount of 5 to 20 parts by mass with respect to 100 parts by mass of the liquid crystalline polyester.
摘要:
A method for fusion bonding a molded article of a liquid crystalline polymer and a glass substrate to each other, comprising bringing the molded article into contact with the glass substrate; and setting the temperature of a contact portion of the molded article in contact with the glass substrate, at a predetermined temperature, wherein when the predetermined temperature of the contact portion is represented by T1(° C.), a flow initiation temperature of the liquid crystalline polymer is represented by T2(° C.) and a decomposition initiation temperature of the liquid crystalline polymer is represented by T3(° C.), the following relation is satisfied: T3(° C.)>T1(° C.)≧T2(° C.)+80° C.
摘要:
The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.