公开(公告)号：US06824827B2

公开(公告)日：2004-11-30

申请号：US10681179

申请日：2003-10-09

申请人： Shozo Katsuki ,  Toshihiko Anno ,  Osamu Nakayama ,  Hiroaki Yamaguchi

发明人： Shozo Katsuki ,  Toshihiko Anno ,  Osamu Nakayama ,  Hiroaki Yamaguchi

IPC分类号： B05D310

CPC分类号： B32B15/08 ,  B32B27/34 ,  B32B2377/00 ,  C23C14/021 ,  C23C14/20 ,  H05K1/0346 ,  H05K3/381 ,  Y10T428/12569 ,  Y10T428/31681

摘要： A method of surface treating a polyimide film to impart improved adhesion to metal which comprises treating the surface of a polyimide film having a biphenyltetracarboxylic acid component by contact to a solution containing potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and treating said surface with an acid.

摘要翻译： 一种表面处理聚酰亚胺膜以赋予金属粘附性的方法，其包括通过与包含高锰酸钾和/或高锰酸钠和氢氧化钾和/或氢氧化钠的溶液接触来处理具有联苯四羧酸组分的聚酰亚胺膜的表面，以及 用酸处理所述表面。

公开(公告)号：US06838184B2

公开(公告)日：2005-01-04

申请号：US10393255

申请日：2003-03-21

申请人： Takuji Takahashi ,  Toshihiko Anno ,  Kohji Narui ,  Shozo Katsuki

发明人： Takuji Takahashi ,  Toshihiko Anno ,  Kohji Narui ,  Shozo Katsuki

IPC分类号： B32B15/08 ,  B32B27/08 ,  B32B7/04 ,  B32B27/34 ,  C08G73/10

CPC分类号： B32B15/08 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 μm, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2·24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.

公开(公告)号：US07186456B2

公开(公告)日：2007-03-06

申请号：US10952219

申请日：2004-09-28

申请人： Masafumi Hashimoto ,  Toshiyuki Nishino ,  Toshihiko Anno ,  Hiroaki Yamaguchi

发明人： Masafumi Hashimoto ,  Toshiyuki Nishino ,  Toshihiko Anno ,  Hiroaki Yamaguchi

IPC分类号： B32B5/16 ,  B32B15/08 ,  B32B27/08

CPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An easily slidable polyimide film having a polyimide surface layer comprising a polyimide which is thermoplastic and has a glass transition temperature of 190–450° C., wherein there are dispersed in the polyimide of the polyimide surface layer, in a proportion of approximately 0.5–10 mass % based on the polyimide of the polyimide surface layer, wholly aromatic polyimide particles made of a polyimide comprising at least 80 mass % of a pyromellitic acid component and a p-phenylenediamine component, and having a median size of 0.3–0.8 μm and a maximum size of no greater than 2 μm, in at least about 1 μm of the polyimide surface layer.

摘要翻译： 一种容易滑动的聚酰亚胺膜，其具有聚酰亚胺表面层，该聚酰亚胺表面层包含热塑性聚酰亚胺，玻璃化转变温度为190-450℃，其中分散在聚酰亚胺表面层的聚酰亚胺中的比例约为0.5〜 基于聚酰亚胺表面层的聚酰亚胺为10质量％，由包含至少80质量％的均苯四酸酸组分和对苯二胺组分的聚酰亚胺制成的全芳香族聚酰亚胺颗粒，中值粒径为0.3-0.8μm， 最大尺寸不大于2μm，至少约1μm的聚酰亚胺表面层。

公开(公告)号：US6129982A

公开(公告)日：2000-10-10

申请号：US55738

申请日：1998-04-06

申请人： Hiroaki Yamaguchi ,  Hideki Ozawa ,  Hideharu Watakabe ,  Toshihiko Anno

发明人： Hiroaki Yamaguchi ,  Hideki Ozawa ,  Hideharu Watakabe ,  Toshihiko Anno

IPC分类号： C08J5/18 ,  C08K3/22 ,  C08K5/00 ,  C08K5/098 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  B32B7/04 ,  B32B15/08 ,  B32B27/34 ,  C08G73/10

CPC分类号： C08J5/18 ,  C08K3/22 ,  C08K5/0091 ,  C08K5/098 ,  C08L79/08 ,  C09J179/08 ,  H05K1/0373 ,  C08J2379/08 ,  C08K2003/2227 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/121 ,  Y10T428/265

摘要： In a heat-resistant aromatic polyimide/metal (or metal oxide) composite sheet composed of an aromatic polyimide film and a metal or metal oxide layer arranged on the film, the polyimide film is composed of an aromatic polyimide resin and an Al-containing material dispersed in the polyimide resin in an amount of 1 to 1,000 ppm per the amount of polyimide film, and the metal or metal oxide layer is formed on the polyimide film via no adhesive.

摘要翻译： 在由芳族聚酰亚胺膜和布置在膜上的金属或金属氧化物层构成的耐热芳香族聚酰亚胺/金属（或金属氧化物）复合片中，聚酰亚胺膜由芳香族聚酰亚胺树脂和含Al材料构成 以聚酰亚胺膜的量分散在聚酰亚胺树脂中的量为1〜1000ppm，并且通过无粘合剂在聚酰亚胺膜上形成金属或金属氧化物层。

公开(公告)号：US20050074592A1

公开(公告)日：2005-04-07

申请号：US10952219

申请日：2004-09-28

申请人： Masafumi Hashimoto ,  Toshiyuki Nishino ,  Toshihiko Anno ,  Hiroaki Yamaguchi

发明人： Masafumi Hashimoto ,  Toshiyuki Nishino ,  Toshihiko Anno ,  Hiroaki Yamaguchi

IPC分类号： B32B15/08 ,  B32B27/34 ,  C08J5/18 ,  C08L79/08 ,  H05K1/03 ,  B32B27/06

CPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An easily slidable polyimide film having a polyimide surface layer comprising a polyimide which is thermoplastic and has a glass transition temperature of 190-450° C., wherein there are dispersed in the polyimide of the polyimide surface layer, in a proportion of approximately 0.5-10 mass % based on the polyimide of the polyimide surface layer, wholly aromatic polyimide particles made of a polyimide comprising at least 80 mass % of a pyromellitic acid component and a p-phenylenediamine component, and having a median size of 0.3-0.8 μm and a maximum size of no greater than 2 μm, in at least about 1 μm of the polyimide surface layer.

摘要翻译： 一种容易滑动的聚酰亚胺膜，其具有聚酰亚胺表面层，该聚酰亚胺表面层包含热塑性聚酰亚胺，玻璃化转变温度为190-450℃，其中分散在聚酰亚胺表面层的聚酰亚胺中的比例约为0.5〜 基于聚酰亚胺表面层的聚酰亚胺为10质量％，由包含至少80质量％的均苯四酸酸组分和对苯二胺组分的聚酰亚胺制成的全芳香族聚酰亚胺颗粒，中值粒径为0.3-0.8μm， 最大尺寸不大于2μm，至少约1μm的聚酰亚胺表面层。

公开(公告)号：US07998553B2

公开(公告)日：2011-08-16

申请号：US12838808

申请日：2010-07-19

申请人： Kohji Narui ,  Nobuyuki Yamamoto ,  Toshihiko Anno

发明人： Kohji Narui ,  Nobuyuki Yamamoto ,  Toshihiko Anno

IPC分类号： B32B15/08

CPC分类号： B32B15/08 ,  H05K1/0346 ,  H05K3/022 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/24355 ,  Y10T428/31667 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and the polyimide film shows a light transmittance of ≧40% for a light of wavelength of 600 nm and a haze of ≧30% [the light transmittance and haze are values measured after the copper foil is removed by etching].

摘要翻译： 覆铜层压板由铜箔和芳香族聚酰亚胺膜构成，铜箔以500N / m的接合强度与聚酰亚胺膜接合，聚酰亚胺膜的透光率为≧ 对于波长为600nm的光，并且雾度≥30％[透光率和雾度是通过蚀刻除去铜箔后测量的值）的40％。

公开(公告)号：US20070196675A1

公开(公告)日：2007-08-23

申请号：US10591749

申请日：2005-03-02

申请人： Masafumi Hashimoto ,  Takeshi Uekido ,  Toshiyuki Nishino ,  Toshihiko Anno

发明人： Masafumi Hashimoto ,  Takeshi Uekido ,  Toshiyuki Nishino ,  Toshihiko Anno

IPC分类号： B32B15/08 ,  B32B27/00 ,  B05D3/02

CPC分类号： B32B27/281 ,  B32B15/08 ,  B32B27/08 ,  B32B2307/306 ,  B32B2379/08 ,  Y10T428/31681 ,  Y10T428/31721

摘要： An adhesion-enhanced polyimide film which includes a core layer composed of a polyimide (a) having high rigidity and a low linear expansion coefficient, at least one side of which has a thin-layer formed by heating a coated layer including a heat-resistant surface treatment agent and a polyimide precursor which yields a highly heat-resistant amorphous polyimide (B).

摘要翻译： 一种粘合增强聚酰亚胺膜，其包括由具有高刚性和低线膨胀系数的聚酰亚胺（a）构成的芯层，其至少一侧具有通过加热包括耐热性的涂层而形成的薄层 表面处理剂和产生高耐热性无定形聚酰亚胺（B）的聚酰亚胺前体。

公开(公告)号：US06147438A

公开(公告)日：2000-11-14

申请号：US100882

申请日：1998-06-22

申请人： Tsutomu Nishiwaki ,  Masami Murai ,  Kazuo Hashimoto ,  Toshihiko Anno

发明人： Tsutomu Nishiwaki ,  Masami Murai ,  Kazuo Hashimoto ,  Toshihiko Anno

IPC分类号： H01L41/09 ,  H01L41/317 ,  H01L41/319 ,  H01L41/331 ,  H01L41/08

CPC分类号： H01L41/0973 ,  H01L41/1876 ,  H01L41/317 ,  H01L41/319 ,  H01L41/331

摘要： The present invention provides a piezoelectric film element with improved adhesion between a first protective film and a substrate. This invention also provides a method of manufacturing a piezoelectric film element, which makes it possible to selectively form, by a hydrothermal synthesis, a piezoelectric film with excellent piezoelectric properties in a specified area. This piezoelectric element comprises, over a substrate 12: a piezoelectric film; a common electrode and an individual electrode located to hold the piezoelectric film in between; a first protective film 14 which is formed over almost the entire surface of the substrate 12 and which protects the substrate 12 to avoid the formation of the piezoelectric film directly over the substrate 12; and a base film 16 which is formed over the first protective film 14 in the area for forming the piezoelectric film, and which functions as a base when the piezoelectric film is caused to grow to be formed. The piezoelectric film is formed over the base film 16.

摘要翻译： 本发明提供一种具有改善的第一保护膜和基底之间的粘附性的压电膜元件。 本发明还提供一种制造压电膜元件的方法，其使得可以通过水热合成在特定区域中选择性地形成具有优异的压电性能的压电膜。 该压电元件包括​​：衬底12上的压电膜; 公共电极和位于将压电膜保持在其间的单独电极; 第一保护膜14，其形成在基板12的几乎整个表面上，并且保护基板12以避免直接在基板12上形成压电膜; 以及形成在用于形成压电膜的区域中的第一保护膜14上的基膜16，并且当使压电膜生长形成时用作基底。 压电膜形成在基膜16上。

公开(公告)号：US20100316884A1

公开(公告)日：2010-12-16

申请号：US12838808

申请日：2010-07-19

申请人： Kohji Narui ,  Nobuyuki Yamamoto ,  Toshihiko Anno

发明人： Kohji Narui ,  Nobuyuki Yamamoto ,  Toshihiko Anno

IPC分类号： B32B3/30

CPC分类号： B32B15/08 ,  H05K1/0346 ,  H05K3/022 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/12438 ,  Y10T428/24355 ,  Y10T428/31667 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of ≧500 N/m and the polyimide film shows a light transmittance of ≧40% for a light of wavelength of 600 nm and a haze of ≦30% [the light transmittance and haze are values measured after the copper foil is removed by etching].

摘要翻译： 覆铜层压板由铜箔和芳香族聚酰亚胺膜构成，铜箔以500N / m的接合强度与聚酰亚胺膜接合，聚酰亚胺膜的透光率为≧ 对于波长为600nm的光和＆lt; nIE的雾度为30％[透光率和雾度是通过蚀刻除去铜箔后测量的值]的40％。

公开(公告)号：US20060154037A1

公开(公告)日：2006-07-13

申请号：US11052829

申请日：2005-02-09

申请人： Hiroto Shimokawa ,  Kohji Narui ,  Toshinori Hosoma ,  Toshihiko Anno

发明人： Hiroto Shimokawa ,  Kohji Narui ,  Toshinori Hosoma ,  Toshihiko Anno

IPC分类号： B32B15/08 ,  B32B27/06

CPC分类号： B32B9/005 ,  B32B9/041 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2274/00 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2457/08 ,  H05K1/0346 ,  H05K3/025 ,  H05K2201/0154 ,  H05K2203/0152 ,  Y10T428/24975 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 μm and a thin copper film having a thickness of 1-8 μm, and an intervening heat-resistant layer and an aromatic polyimide film directly fixed to the thin copper film without adhesive.

摘要翻译： 聚酰亚胺 - 铜复合层叠体由厚度为10-35μm的金属载体和厚度为1-8μm的薄铜膜构成，并且将中间耐热层和芳香族聚酰亚胺膜直接固定在 薄铜膜无粘合剂。