摘要:
Graphite is placed in a case, and the case is set in a furnace. The interior of the furnace is subjected to sintering to produce a porous sintered member of graphite. After that, the case with the porous sintered member therein is taken out of the furnace, and is set in a recess of a press machine. Subsequently, molten metal of metal is poured into the case, and then a punch is inserted into the recess to forcibly press the molten metal in the case downwardly. Open pores of the porous sintered member are infiltrated with the molten metal of the metal by the pressing treatment with the punch.
摘要:
A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.
摘要:
A mass of graphite is placed into a case, and the case is put into a furnace (step S301). The space in the furnace is heated to produce a porous sintered body of graphite (step S302). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S303). Then, a molten mass of a metal is poured into the case (step S304), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S305).
摘要:
A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
摘要翻译:用于电子电路的部件具有安装在散热器上的导热层。 导热层包括绝缘基板,将绝缘基板连接到散热器并且包含有源元件的第一接合构件,设置在绝缘基板上的第二接头构件和设置在第二接头构件上的电极。 绝缘衬底包括AlN层或Si 3 N 4 N 4层。 第一和第二接头构件中的每一个由包含有源元件的硬钎焊材料制成。 散热片由SiC / Cu复合材料或C / Cu复合材料制成。
摘要:
There is provided a heat sink module having good thermal conductivity, excellent reliability without separation, and a space-saving property with a mechanism of sufficiently high heat radiation. The heat sink module includes: two or more heat conduction sections each having a heat sink layer formed from a heat sink material having a thermal expansion coefficient of 1×10−6/K to 8×10−6/K, an intermediate layer formed from Cu, a Cu alloy, Al, or an Al alloy, an electrically insulating layer, and an electrode layer formed from said metals, being joined in layers by a first brazing material; and a heat-radiating cooling section 7 having two or more seat surfaces being at least formed from said metals and the two or more heat conduction sections are joined by a second brazing material to seat surfaces with the heat sink layers of heat conduction sections disposed on seat surfaces.
摘要:
A mounting structure including: an outer housing having a first locking portion; a ceiling including a lamp opening portion in a central portion thereof; an inner housing including: a first locking facing portion which is locked in the first locking portion of the outer housing; and a second locking portion on and directly attached to the inner housing; and a reinforcement having a second locking facing portion which is locked on the second locking portion of the inner housing. The ceiling is fixed between the outer housing and the inner housing by locking the first locking facing portion of the inner housing in the first locking portion of the outer housing via the lamp opening portion in the ceiling. A bracket portion shaped so as to follow a shape of an upper side of the ceiling is provided along an outer circumference of the inner housing.
摘要:
A disposable lancing device including: a housing; a spring member; a lancet having a skin puncture needle, the spring member and the lancet being housed within the housing such that a needle tip of the skin puncture needle is adapted to be projected out from the housing under urging of the lancet by the spring member to perform skin puncture procedure; and a protective cap having a needle passage hole and covering the needle tip of the skin puncture needle, the protective cap being adapted to separate from the skin puncture needle and rotate so that the needle passage hole of the protective cap is positioned on a path of projection of the skin puncture needle, and the skin puncture procedure is performed with the protective cap supported on the housing.
摘要:
An oxidation catalyst for use in the oxidation of a substrate with a molecular oxygen, comprising at least one member selected from the group consisting of a specific hydrazyl radical (such as 2,2-diphenyl-1-picrylhydrazyl) and a specific hydrazine compound (such as 2,2-diphenyl-1-picrylhydrazine). A method for producing a chemical compound, comprising contacting a substrate with a molecular oxygen in the presence of the above-mentioned oxidation catalyst.
摘要:
A method of coloring a surface of a zirconium-based metallic glass component that includes the step of imparting interference colors by carrying out an anodizing process using an alkaline solution to form a film having a thickness of 300 nm or less on the surface of the zirconium-based metallic glass component.
摘要:
A supported composite particle material comprises: a composite particle formed of an oxidized nickel and X (wherein X represents at least one of elements selected from the group consisting of nickel, palladium, platinum, ruthenium, gold, silver and copper); and a support on which the composite particle is supported, the supported composite particle material having a supported layer in which the composite particle is localized.