公开(公告)号：US08134085B2

公开(公告)日：2012-03-13

申请号：US12259624

申请日：2008-10-28

申请人： Sohei Samejima ,  Sadao Sato ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

发明人： Sohei Samejima ,  Sadao Sato ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

IPC分类号： H05K1/11

CPC分类号： H05K3/445 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09181 ,  H05K2201/09809 ,  Y10T29/49124

摘要： A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through hole for electrically connecting upper and lower signal interconnections via the secondary through hole. A coating layer coats an outer peripheral edge of the CFRP core as seen in a plan view. Thereby, a printed interconnection board with low thermal expansivity and high thermal conductivity capable of preventing exfoliation of a CFRP layer on a side surface of a substrate using CFRP as a core, as well as preventing falling-off of carbon powders from the CFRP layer, and a method of manufacturing the same can be obtained.

摘要翻译： 包括CFRP层的CFRP芯具有主通孔。 粘合剂涂覆在主通孔的壁表面上，并具有在主通孔内延伸的次通孔。 在第二通孔的壁表面上形成导电层，用于经由次级通孔电连接上下信号互连。 如平面图所示，涂覆层涂覆CFRP芯的外周边缘。 因此，具有低热膨胀性和高导热性的印刷互连板能够防止CFRP作为芯的基板的侧表面上的CFRP层的剥离，以及防止碳粉从CFRP层脱落， 并且可以获得其制造方法。

公开(公告)号：US20090107702A1

公开(公告)日：2009-04-30

申请号：US12259624

申请日：2008-10-28

申请人： Sohei SAMEJIMA ,  Sadao Sato ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

发明人： Sohei SAMEJIMA ,  Sadao Sato ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/445 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09181 ,  H05K2201/09809 ,  Y10T29/49124

摘要： A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through hole for electrically connecting upper and lower signal interconnections via the secondary through hole. A coating layer coats an outer peripheral edge of the CFRP core as seen in a plan view. Thereby, a printed interconnection board with low thermal expansivity and high thermal conductivity capable of preventing exfoliation of a CFRP layer on a side surface of a substrate using CFRP as a core, as well as preventing falling-off of carbon powders from the CFRP layer, and a method of manufacturing the same can be obtained.

摘要翻译： 包括CFRP层的CFRP芯具有主通孔。 粘合剂涂覆在主通孔的壁表面上，并具有在主通孔内延伸的次通孔。 在第二通孔的壁表面上形成导电层，用于经由次级通孔电连接上下信号互连。 如平面图所示，涂覆层涂覆CFRP芯的外周边缘。 因此，具有低热膨胀性和高导热性的印刷互连板能够防止CFRP作为芯的基板的侧表面上的CFRP层的剥离，以及防止碳粉从CFRP层脱落， 并且可以获得其制造方法。

公开(公告)号：US09313903B2

公开(公告)日：2016-04-12

申请号：US13142113

申请日：2009-12-24

申请人： Sohei Samejima ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

发明人： Sohei Samejima ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

IPC分类号： H05K3/46 ,  H05K3/44 ,  H05K3/42

CPC分类号： H05K3/445 ,  H05K3/0011 ,  H05K3/40 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09809

摘要： A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.

摘要翻译： 制造印刷电路板（10）的方法包括以下步骤：形成包括具有初级通孔（3a）的碳纤维增强塑料的芯体; 在所述芯的下表面上形成第一粘合构件（4a）以覆盖所述主通孔（3a）; 将绝缘构件加载到所述主通孔（3a）中; 在所述芯的上表面上形成第二粘合构件（4b）; 在所述第一粘合部件（4a）的下方形成第三粘接部件（6a）。 在第二粘合部件（4b）上形成第四粘合部件（6b）; 并在芯上形成互连。

公开(公告)号：US20110290408A1

公开(公告)日：2011-12-01

申请号：US13142113

申请日：2009-12-24

申请人： Sohei Samejima ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

发明人： Sohei Samejima ,  Tsuyoshi Ozaki ,  Hiroyuki Osuga ,  Teruhiko Kumada

IPC分类号： H05K3/46

CPC分类号： H05K3/445 ,  H05K3/0011 ,  H05K3/40 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09809

摘要： A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.

摘要翻译： 制造印刷电路板（10）的方法包括以下步骤：形成包括具有主通孔（3a）的碳纤维增强塑料的芯体; 在所述芯的下表面上形成第一粘合构件（4a）以覆盖所述主通孔（3a）; 将绝缘构件加载到所述主通孔（3a）中; 在所述芯的上表面上形成第二粘合构件（4b）; 在所述第一粘合部件（4a）的下方形成第三粘接部件（6a）。 在第二粘合部件（4b）上形成第四粘合部件（6b）; 并在芯上形成互连。

公开(公告)号：US20080047742A1

公开(公告)日：2008-02-28

申请号：US11832376

申请日：2007-08-01

申请人： Souhei SAMEJIMA ,  Sadao Sato ,  Hiroyuki Osuga ,  Shigeru Utsumi ,  Teruhiko Kumada

发明人： Souhei SAMEJIMA ,  Sadao Sato ,  Hiroyuki Osuga ,  Shigeru Utsumi ,  Teruhiko Kumada

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H05K3/4641 ,  H05K1/056 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09809 ,  Y10T29/49155

摘要： An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.

摘要翻译： 本发明的目的是提供一种具有优异的散热性能和优异的可靠性的印刷电路板及其制造方法。 印刷电路板包括：在每个覆盖设置有第一通孔（1a）的金属板（1）的表面和第一通孔（11a）的内壁之后，预浸料（2a）和（2b）被固化 ）; 玻璃衣服（3a）和（3b）夹在预浸料（2a）和（2b）之间，预浸料坯（4a）和（4b）固化的预浸料坯（4a）和（4b） ）， 分别; 和分别设置在预浸料坯（6a）和（6b）的两个表面上的布线层（7a）和（7b）和（7b）和（7b）的第二通孔（8）。 预浸料（2a）和（2b）和预浸料坯（4a）和（4b）的特征在于它们含有无机填料。 此外，预浸料坯（2a）和（2b）以及预浸料坯（4a）和（4b）可以含有弹性体。

公开(公告)号：US08148647B2

公开(公告)日：2012-04-03

申请号：US11832376

申请日：2007-08-01

申请人： Souhei Samejima ,  Sadao Sato ,  Hiroyuki Osuga ,  Shigeru Utsumi ,  Teruhiko Kumada

发明人： Souhei Samejima ,  Sadao Sato ,  Hiroyuki Osuga ,  Shigeru Utsumi ,  Teruhiko Kumada

IPC分类号： H05K1/11

CPC分类号： H05K3/4641 ,  H05K1/056 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09809 ,  Y10T29/49155

摘要： An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.

摘要翻译： 本发明的目的是提供一种具有优异的散热性能和优异的可靠性的印刷电路板及其制造方法。 印刷电路板包括：在每个覆盖设置有第一通孔（1a）的金属板（1）的表面和第一通孔（1a）的内壁之后，预浸料（2a）和（2b）固化; 玻璃衣服（3a）和（3b）夹在预浸料（2a）和（2b）之间，以及预浸料坯（4a）和（4b）分别固化的预浸料坯（4a）和（4b） 以及分别设置在预浸料坯（6a）和（6b）的两个表面上的布线层（7a）和（7c）和（7b）和（7d）的第二通孔（8）。 预浸料（2a）和（2b）和预浸料（4a）和（4b）的特征在于它们含有无机填料。 此外，预浸料（2a）和（2b）和预浸料（4a）和（4b）可以含有弹性体。

公开(公告)号：US08288294B2

公开(公告)日：2012-10-16

申请号：US13001256

申请日：2009-06-25

申请人： Hidetaka Kafuku ,  Toshihito Fujiwara ,  Toshihiko Nishimori ,  Tadashi Shimazu ,  Naoki Yasuda ,  Hideharu Nobutoki ,  Teruhiko Kumada ,  Takuya Kamiyama ,  Tetsuya Yamamoto ,  Shinya Shibata

发明人： Hidetaka Kafuku ,  Toshihito Fujiwara ,  Toshihiko Nishimori ,  Tadashi Shimazu ,  Naoki Yasuda ,  Hideharu Nobutoki ,  Teruhiko Kumada ,  Takuya Kamiyama ,  Tetsuya Yamamoto ,  Shinya Shibata

IPC分类号： H01L21/31

CPC分类号： H01L21/318 ,  C23C16/342 ,  C23C16/507 ,  H01L21/02112 ,  H01L21/02274 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object is to provide an insulating film for a semiconductor device which has characteristics of a low permittivity, a low leakage current, and a high mechanical strength, undergoes less change in these characteristics with the elapse of time, and has an excellent water resistance, as well as to provide a process and an apparatus for producing the insulating film for a semiconductor device, a semiconductor device, and a process for producing the semiconductor device. A gas containing a raw material gas which gasified a predetermined alkylborazine compound is supplied in a chamber (2); an electromagnetic wave is introduced into the chamber (2) using with an inductive coupling type plasma generation mechanism (4, 5, 6) to convert the gas into a plasma; a substrate (8) is placed in a plasma diffusion region of the plasma; gas-phase polymerization is performed with borazine skeletal molecules, as a fundamental unit, dissociated from the alkylborazine compound by the plasma so as to form the insulating film for semiconductor devices on the substrate (8).

摘要翻译： 本发明的目的是提供具有低介电常数，低漏电流和高机械强度特性的半导体器件用绝缘膜，随着时间的推移，这些特性的变化变小，具有优异的耐水性， 以及提供用于制造用于半导体器件的绝缘膜，半导体器件和用于制造半导体器件的工艺的工艺和设备。 在室（2）内供给含有气化了规定的烷基
硼氮化合物的原料气体的气体。 使用电感耦合型等离子体产生机构（4,5,6）将电磁波引入腔室（2），以将气体转换成等离子体; 将衬底（8）放置在等离子体的等离子体扩散区域中; 用作为基本单元的环硼烷骨架分子进行气相聚合，通过等离子体与烷基硼氮化合物离解，从而在基板（8）上形成用于半导体器件的绝缘膜。

公开(公告)号：US20110315360A1

公开(公告)日：2011-12-29

申请号：US13254511

申请日：2010-03-10

申请人： Yoshinori Yamamoto ,  Yasuhiro Yoshida ,  Teruhiko Kumada ,  Reiji Morioka

发明人： Yoshinori Yamamoto ,  Yasuhiro Yoshida ,  Teruhiko Kumada ,  Reiji Morioka

IPC分类号： F28F13/00 ,  C09D7/12 ,  C09D127/12 ,  B32B5/16 ,  B05D3/00 ,  B05D3/02 ,  F24F7/007 ,  C09D5/00 ,  B05D7/24

CPC分类号： C09D7/1216 ,  C08K3/012 ,  C08K3/22 ,  C08K3/28 ,  C09D5/024 ,  C09D5/1618 ,  C09D5/1637 ,  C09D7/61 ,  C09D7/67 ,  C09D127/18 ,  Y10T428/254 ,  C08K3/36 ,  C08K3/0025

摘要： A coating composition having high dirt prevention properties and improved adhesiveness to hydrophobic surfaces such as those made of a plastic, and a coating method are provided. More specifically, provided is a coating composition, including: hydrophobic resin particles dispersed in an aqueous medium; hydrophilic inorganic fine particles; and an oxidizing agent containing at least one of a peroxide, a perchloric acid, a chlorate, a persulfuric acid, a superphosphoric acid, and a periodate, and also provided is a coating method including the steps of: preparing a first agent having hydrophilic inorganic fine particles and hydrophobic resin particles dispersed in an aqueous medium; preparing a second agent by adding, to the first agent, an oxidizing agent containing at least one of a peroxide, a perchloric acid, a chlorate, a persulfuric acid, a superphosphoric acid, and a periodate; applying the second agent onto a member to be coated; and drying the second agent on the member to be coated.

摘要翻译： 提供具有高防污性和改善与疏水性表面的粘合性的涂料组合物，例如由塑料制成的涂料组合物和涂布方法。 更具体地，提供一种涂料组合物，其包括：分散在水性介质中的疏水性树脂颗粒; 亲水无机细颗粒; 以及包含过氧化物，高氯酸，氯酸盐，过硫酸，过磷酸和高碘酸盐中的至少一种的氧化剂，并且还提供了一种涂布方法，包括以下步骤：制备具有亲水性无机 分散在水介质中的细颗粒和疏水性树脂颗粒; 通过向第一试剂中加入含有过氧化物，高氯酸，氯酸盐，过硫酸，过磷酸和高碘酸盐中的至少一种的氧化剂来制备第二试剂; 将第二试剂施加到待涂覆的构件上; 并将待涂覆的构件上的第二试剂干燥。

公开(公告)号：US07981790B2

公开(公告)日：2011-07-19

申请号：US12683949

申请日：2010-01-07

申请人： Teruhiko Kumada ,  Hideharu Nobutoki ,  Naoki Yasuda ,  Kinya Goto ,  Masazumi Matsuura

发明人： Teruhiko Kumada ,  Hideharu Nobutoki ,  Naoki Yasuda ,  Kinya Goto ,  Masazumi Matsuura

IPC分类号： H01L21/4763

CPC分类号： H01L21/02271 ,  H01L21/314 ,  H01L21/76826 ,  H01L21/76829 ,  H01L21/76831 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76835

摘要： There is provided a semiconductor device and method of fabricating the same that employs an insulation film of a borazine-based compound to provided enhanced contact between a material for insulation and that for interconnection, increased mechanical strength, and other improved characteristics. The semiconductor device includes a first insulation layer having a recess with a first conductor layer buried therein, an etching stopper layer formed on the first insulation layer, a second insulation layer formed on the etching stopper layer, a third insulation layer formed on the second insulation layer, and a second conductor layer buried in a recess of the second and third insulation layers. The second and third insulation layers are grown by chemical vapor deposition with a carbon-containing borazine compound used as a source material and the third insulation layer is smaller in carbon content than the second insulation layer.

摘要翻译： 提供一种半导体器件及其制造方法，其采用环硼氮烷化合物的绝缘膜，以提供绝缘材料和互连材料，增加的机械强度和其它改进的特性之间的增强的接触。 半导体器件包括具有埋设有第一导体层的凹部的第一绝缘层，形成在第一绝缘层上的蚀刻阻挡层，形成在蚀刻停止层上的第二绝缘层，形成在第二绝缘层上的第三绝缘层 层，以及埋在第二绝缘层和第三绝缘层的凹部中的第二导体层。 第二绝缘层和第三绝缘层通过化学气相沉积生长，其中含有碳源的环硼氮烷化合物用作源材料，第三绝缘层的碳含量比第二绝缘层小。

公开(公告)号：US20100181654A1

公开(公告)日：2010-07-22

申请号：US12664605

申请日：2009-06-13

申请人： Toshihito Fujiwara ,  Toshihiko Nishimori ,  Toshiya Watanabe ,  Naoki Yasuda ,  Hideharu Nobutoki ,  Teruhiko Kumada ,  Chiho Mizushima ,  Takuya Kamiyama ,  Tetsuya Yamamoto

发明人： Toshihito Fujiwara ,  Toshihiko Nishimori ,  Toshiya Watanabe ,  Naoki Yasuda ,  Hideharu Nobutoki ,  Teruhiko Kumada ,  Chiho Mizushima ,  Takuya Kamiyama ,  Tetsuya Yamamoto

IPC分类号： H01L23/58 ,  H01L21/471

CPC分类号： H01L21/02118 ,  C23C16/342 ,  C23C16/505 ,  H01L21/02274 ,  H01L21/02348 ,  H01L21/02351 ,  H01L21/312 ,  H01L21/76801

摘要： An object to provide an insulating film for a semiconductor device, which has characteristics of low permittivity, a low leak current, and high mechanical strength, undergoes small time-dependent change of these characteristics, and has excellent water resistance, and to provide a manufacturing apparatus of the same, and a manufacturing method of the semiconductor device using the insulating film. The production process comprises a film forming step of supplying a mixed gas containing a carrier gas and a raw material gas, which is a gasified material having borazine skeletal molecules, into a chamber, causing the mixed gas to be in a plasma state, applying a bias to the substrate placed in the chamber, and carrying out gas-phase polymerization by using the borazine skeletal molecule as a fundamental unit so as to form the insulating film on the substrate; and a reaction promoting step of, after the film forming step, bringing the bias applied to the substrate to a different magnitude from the bias in the film forming step, supplying the mixed gas while gradually reducing only the raw material gas, which is the gasified material having the borazine skeletal molecules, treating the insulating film with a plasma mainly comprising the carrier gas.

摘要翻译： 提供具有低介电常数，低泄漏电流和高机械强度特性的半导体器件绝缘膜的目的是经历这些特性的小的时间依赖性变化，并且具有优异的耐水性，并且提供制造 以及使用该绝缘膜的半导体器件的制造方法。 制造方法包括：将含有载气的混合气体和作为具有环硼氮烷骨架分子的气化材料的原料气体供给到室中的成膜工序，使混合气体处于等离子体状态， 偏置于放置在室内的基板上，通过使用环硼氮烷骨架分子作为基本单元进行气相聚合，以在基板上形成绝缘膜; 以及反应促进步骤，在成膜步骤之后，使得施加到基板上的偏压与成膜步骤中的偏压大小不同，供给混合气体，同时逐渐减少气化的原料气体 具有环硼烷骨架分子的材料，以主要包含载气的等离子体处理绝缘膜。