公开(公告)号：US11309338B2

公开(公告)日：2022-04-19

申请号：US16301067

申请日：2017-03-28

Applicant: SONY CORPORATION

Inventor： Toshihiko Watanabe ,  Akiyoshi Aoyagi ,  Hirokazu Nakayama

IPC: H01L27/12 ,  H05K3/34 ,  H05K3/46 ,  H05K1/18 ,  H01L23/498 ,  H01L23/14 ,  H05K1/11 ,  H05K3/42

Abstract: Provided is a display device and an electronic apparatus that prevent the occurrence of failure in the connection between a mounting substrate and an electronic component. The display device includes an interconnection layer provided on a support substrate, a plurality of insulating layers provided above the interconnection layer, an opening provided in parts of the insulating layers, and a metal layer electrically connected to the interconnection layer and filling the opening up to a height below a layer surface of the insulating layer.

公开(公告)号：US11195971B2

公开(公告)日：2021-12-07

申请号：US16996306

申请日：2020-08-18

Applicant: SONY CORPORATION

Inventor： Toshihiko Watanabe

IPC: H01L23/04 ,  H01L23/48 ,  H05K7/00 ,  H01L33/20 ,  H01L33/62 ,  H05K3/18 ,  H05K3/42 ,  H05K1/02 ,  H05K1/18 ,  H05K3/14 ,  H05K1/11 ,  H01L27/12 ,  H01L27/15

Abstract: A glass wiring substrate includes a glass substrate, a first wiring portion formed on a first surface of the glass substrate, a second wiring portion formed on a second surface opposite to the first surface, a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side, and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch P1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P2 of the second wiring portion in the vicinity of the through-hole portion.

公开(公告)号：US20140008674A1

公开(公告)日：2014-01-09

申请号：US13933208

申请日：2013-07-02

Applicant: SONY CORPORATION

Inventor： Toshihiko Watanabe ,  Yoichi Ohshige ,  Masato Doi ,  Akiyoshi Aoyagi

IPC: H01L23/495

CPC classification number: H01L23/49548 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires.

Abstract translation: 安装基板包括：布线基板; 以及多个光学元件，其安装在所述布线基板的安装表面上，并且每个具有第一电极和第二电极。 布线基板包括支撑基板，多个第一布线和多个第二布线。 第一线和第二线设置在支撑基板和安装表面之间的层内。 第一导线与第一电极电连接。 第二导线与第二电极电连接，并且每个导线的横截面积大于每个第一导线的横截面面积。

公开(公告)号：US10784403B2

公开(公告)日：2020-09-22

申请号：US16081626

申请日：2017-02-08

Applicant: SONY CORPORATION

Inventor： Toshihiko Watanabe

IPC: H01L33/20 ,  H01L33/62 ,  H01L27/15 ,  H01L27/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/18 ,  H05K3/42 ,  H05K1/18 ,  H05K3/14

Abstract: A glass wiring substrate includes a glass substrate, a first wiring portion being formed on a first surface of the glass substrate, a second wiring portion being formed on a second surface opposite to the first surface; a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side; and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch P1 of the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch P2 of the second wiring portion in the vicinity of the through-hole portion.

公开(公告)号：US09814139B2

公开(公告)日：2017-11-07

申请号：US15124499

申请日：2015-02-27

Applicant: Sony Corporation

Inventor： Toshihiko Watanabe

IPC: H05K1/16 ,  H05K1/11 ,  H05K3/34 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K1/03 ,  H01L33/48

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L33/48 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3489 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/09863 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2203/1383 ,  H05K2203/1394 ,  Y02P70/613

Abstract: A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume Vh of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

公开(公告)号：US09006968B2

公开(公告)日：2015-04-14

申请号：US13933208

申请日：2013-07-02

Applicant: Sony Corporation

Inventor： Toshihiko Watanabe ,  Yoichi Ohshige ,  Masato Doi ,  Akiyoshi Aoyagi

IPC: H01L51/50 ,  H01L51/52 ,  H01L23/495 ,  H01L25/075 ,  H05K1/02 ,  H01L33/62

CPC classification number: H01L23/49548 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires.

Abstract translation: 安装基板包括：布线基板; 以及多个光学元件，其安装在所述布线基板的安装表面上，并且每个具有第一电极和第二电极。 布线基板包括支撑基板，多个第一布线和多个第二布线。 第一线和第二线设置在支撑基板和安装表面之间的层内。 第一导线与第一电极电连接。 第二导线与第二电极电连接，并且每个导线的横截面积大于每个第一导线的横截面面积。

公开(公告)号：US12002910B2

公开(公告)日：2024-06-04

申请号：US17281011

申请日：2019-09-09

Applicant: SONY CORPORATION

Inventor： Toshihiko Watanabe ,  Jun Suzuki

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/62

Abstract: A display device that includes a plurality of light-emitting elements, a first light-absorbing layer having an opening at a position that faces the light-emitting elements, and a second light-absorbing layer that faces the first light-absorbing layer with the light-emitting elements therebetween.