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    Biodegradable and Thermosensitive Poly(Organophosphazene) Hydrogel, Preparation Method Thereof and Use Thereof
    3.
    发明申请
    Biodegradable and Thermosensitive Poly(Organophosphazene) Hydrogel, Preparation Method Thereof and Use Thereof 有权
    可生物降解和热敏聚（有机膦腈）水凝胶，其制备方法及用途

    公开(公告)号：US20090022683A1

    公开(公告)日：2009-01-22

    申请号：US11568851

    申请日：2006-11-03

    Applicant: Soo-Chang Song ,  Sun-Mi Lee ,  Chang-Won Kim ,  Mi-Ran Park

    Inventor： Soo-Chang Song ,  Sun-Mi Lee ,  Chang-Won Kim ,  Mi-Ran Park

    IPC: A61K38/00 ,  C08G79/02 ,  A61K9/00 ,  A61K38/02 ,  A61K39/00 ,  A61K48/00 ,  A61K47/30 ,  A61K38/21 ,  A61K38/26 ,  A61K38/18 ,  A61K38/20 ,  A61K38/28 ,  A61K38/22 ,  A61K38/23 ,  A61K38/27 ,  A61K39/395 ,  A61K39/29 ,  A61K31/337 ,  A61K31/704

    CPC classification number: A61K9/06 ,  A61K9/0024 ,  A61K9/08 ,  A61K47/34 ,  A61K47/6903 ,  C08G79/025

    Abstract: The present invention relates to a biodegradable and thermosensitive poly(organophosphazene) with a functional group, a preparation method thereof, and a use thereof for delivery of bioactive substances. According to the present invention, poly(organophosphazene) is a phosphagen-based polymer showing biodegradability, thermosensitivity, and sol-gel phase transition depending on temperature change, whereby when administered into a living body with bioactive substances such as drugs, the poly(organophosphazene) forms a gel-phase at body temperature to be capable of controlled release of the bioactive substances. Further, the poly(organophosphazene) has functional groups to chemically bind with bioactive substances through an ionic bond, covalent bond, or coordinate covalent bond to be capable of a sustained release of the bioactive substances due to its good binding property. Therefore, the poly(organophosphazene) is useful as a delivery material for bioactive substances.

    Abstract translation: 本发明涉及具有官能团的生物可降解和热敏聚（有机膦腈），其制备方法及其用于递送生物活性物质的用途。 根据本发明，聚（有机膦腈）是基于温度变化显示生物降解性，热敏性和溶胶 - 凝胶相变的基于磷酸酯的聚合物，其中当用生物活性物质如药物施用于生物体时，聚（有机膦腈 ）在体温下形成凝胶相以能够控制释放生物活性物质。 此外，聚（有机膦腈）具有通过离子键，共价键或配位共价键与生物活性物质化学结合的官能团，由于其良好的结合性能，能够持续释放生物活性物质。 因此，聚（有机膦腈）可用作生物活性物质的递送材料。

    OPTICAL WAVEGUIDE PLATFORM WITH HYBRID-INTEGRATED OPTICAL TRANSMISSION DEVICE AND OPTICAL ACTIVE DEVICE AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    OPTICAL WAVEGUIDE PLATFORM WITH HYBRID-INTEGRATED OPTICAL TRANSMISSION DEVICE AND OPTICAL ACTIVE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    具有混合光学传输装置的光波导平台和光学有源装置及其制造方法

    公开(公告)号：US20130163916A1

    公开(公告)日：2013-06-27

    申请号：US13487807

    申请日：2012-06-04

    Applicant: Hyun Soo KIM ,  Jong Sool Jeong ,  Mi-Ran Park ,  Byungseok Choi ,  O-Kyun Kwon

    Inventor： Hyun Soo KIM ,  Jong Sool Jeong ,  Mi-Ran Park ,  Byungseok Choi ,  O-Kyun Kwon

    IPC: G02B6/12 ,  H01L21/02

    CPC classification number: G02B6/43 ,  G02B6/12004 ,  G02B6/1228 ,  G02B6/4224 ,  G02B6/4232

    Abstract: Disclosed are an optical waveguide platform with integrated active transmission device and monitoring photodiode. The optical waveguide platform with hybrid integrated optical transmission device and optical active device includes an optical waveguide region formed by stacking a lower cladding layer, a core layer and an upper cladding layer on a substrate; a trench region formed by etching a portion of the optical waveguide region; and a spot expanding region formed on the core layer in the optical waveguide region, in which the optical transmission device is mounted in the trench region and the optical active device is flip-chip bonded to the spot expanding region. The monitoring photodiode is flip-chip bonded to the spot expanding region of the core layer of the optical waveguide, thereby monitoring output light including an optical coupling loss that occurs during flip-chip bonding.

    Abstract translation: 公开了一种具有集成主动传输装置和监测光电二极管的光波导平台。 具有混合集成光传输装置和光学有源装置的光波导平台包括通过在基板上层叠下包层，芯层和上包层而形成的光波导区域; 通过蚀刻光波导区域的一部分形成的沟槽区域; 以及形成在光波导区域的芯层上的点扩展区域，其中光传输装置安装在沟槽区域中，并且光学有源器件被倒装芯片接合到点扩展区域。 监视光电二极管被倒装芯片接合到光波导的芯层的点扩展区域，从而监视包括在倒装芯片接合期间发生的光耦合损耗的输出光。

    SEMICONDUCTOR INTEGRATED CIRCUITS INCLUDING OPTOELECTRONIC DEVICE FOR CHANGING OPTICAL PHASE
    7.
    发明申请
    SEMICONDUCTOR INTEGRATED CIRCUITS INCLUDING OPTOELECTRONIC DEVICE FOR CHANGING OPTICAL PHASE 有权
    半导体集成电路，包括用于改变光学相位的光电器件

    公开(公告)号：US20100278477A1

    公开(公告)日：2010-11-04

    申请号：US12746167

    申请日：2008-06-03

    Applicant: Jeong-Woo Park ,  Gyung-Ock Kim ,  Mi-Ran Park ,  Jong-Bum You

    Inventor： Jeong-Woo Park ,  Gyung-Ock Kim ,  Mi-Ran Park ,  Jong-Bum You

    IPC: G02B6/12 ,  G02B6/34

    CPC classification number: G02F1/218 ,  G02F2001/212 ,  G02F2201/302

    Abstract: Provided is a semiconductor integrated circuit. The semiconductor integrated circuit includes a semiconductor pattern disposed on a substrate and including an optical waveguide part and a pair of recessed portions. The optical waveguide part has a thickness ranging from about 0.05 m to about 0.5 μm. The recessed portions are disposed on both sides of the optical waveguide part and have a thinner thickness than the optical waveguide part. A first doped region and a second doped region are disposed in the recessed portions, respectively. The first and second doped regions are doped with a first conductive type dopant and a second conductive type dopant, respectively. An intrinsic region is formed in at least the optical waveguide part to contact the first and second doped regions.

    Abstract translation: 提供了一种半导体集成电路。 半导体集成电路包括设置在基板上并且包括光波导部分和一对凹部的半导体图案。 光波导部分的厚度范围为约0.05μm至约0.5μm。 凹部设置在光波导部分的两侧，并且具有比光波导部分更薄的厚度。 第一掺杂区域和第二掺杂区域分别设置在凹部中。 第一和第二掺杂区域分别掺杂有第一导电型掺杂剂和第二导电型掺杂剂。 在至少光波导部分中形成本征区域以接触第一和第二掺杂区域。

    Multi-channel receiver optical sub assembly
    8.
    发明授权
    Multi-channel receiver optical sub assembly 有权
    多通道接收机光子组件

    公开(公告)号：US09229183B2

    公开(公告)日：2016-01-05

    申请号：US14012384

    申请日：2013-08-28

    Applicant: Mi-Ran Park ,  Jong Sool Jeong ,  Hyun Soo Kim ,  Byungseok Choi ,  Young Tak Han ,  O-Kyun Kwon

    Inventor： Mi-Ran Park ,  Jong Sool Jeong ,  Hyun Soo Kim ,  Byungseok Choi ,  Young Tak Han ,  O-Kyun Kwon

    IPC: H04B10/60 ,  G02B6/42

    CPC classification number: G02B6/4274 ,  G02B6/4249 ,  G02B6/4263 ,  G02B6/4279

    Abstract: Disclosed is a multi-channel receiver optical sub assembly. The a multi-channel receiver optical sub assembly includes: a multi-channel PD array, in which a plurality of photodiodes (PDs) disposed on a first capacitor, and including receiving areas disposed at centers thereof and anode electrode pads arranged in an opposite direction at an angle of 180 degrees based on the receiving areas between the adjacent PDs is monolithically integrated; a plurality of transimpedance amplifiers (TIAs) arranged on a plurality of second capacitors, respectively, and connected with the anode pads of the respective PDs through wire bonding; a submount on which the first capacitor.

    Abstract translation: 公开了一种多通道接收机光学子组件。 多通道接收机光学子组件包括：多通道PD阵列，其中设置在第一电容器上的多个光电二极管（PD），并且包括设置在其中心处的接收区域和布置在相反方向的阳极电极焊盘 基于相邻PD之间的接收区域以180度的角度被整体地集成; 分别布置在多个第二电容器上并通过引线接合与相应PD的阳极焊盘连接的多个跨阻抗放大器（TIA）; 第一电容器的基座。

    Methods of forming a compound semiconductor device including a diffusion region
    9.
    发明授权
    Methods of forming a compound semiconductor device including a diffusion region 有权
    形成包括扩散区域的化合物半导体器件的方法

    公开(公告)号：US08030188B2

    公开(公告)日：2011-10-04

    申请号：US12508382

    申请日：2009-07-23

    Applicant: Mi-Ran Park ,  Jae-Sik Sim ,  Yong-Hwan Kwon ,  Bongki Mheen ,  Dae Kon Oh

    Inventor： Mi-Ran Park ,  Jae-Sik Sim ,  Yong-Hwan Kwon ,  Bongki Mheen ,  Dae Kon Oh

    IPC: H01L21/20 ,  H01L21/36

    CPC classification number: H01L21/2258

    Abstract: Provided is a method of forming a compound semiconductor device. In the method, a dopant element layer is formed on an undoped compound semiconductor layer. An annealing process is performed to diffuse dopants in the dopant element layer into the undoped compound semiconductor layer, thereby forming a dopant diffusion region. A rapid cooling process is performed using liquid nitrogen with respect to the substrate having the dopant diffusion region.

    Abstract translation: 提供一种形成化合物半导体器件的方法。 在该方法中，在未掺杂的化合物半导体层上形成掺杂剂元素层。 执行退火处理以将掺杂剂元素层中的掺杂剂扩散到未掺杂的化合物半导体层中，从而形成掺杂剂扩散区域。 相对于具有掺杂剂扩散区域的基板，使用液氮进行快速冷却处理。

    Optical waveguide platform with hybrid-integrated optical transmission device and optical active device and method of manufacturing the same
    10.
    发明授权
    Optical waveguide platform with hybrid-integrated optical transmission device and optical active device and method of manufacturing the same 有权
    具有混合集成光传输装置和光学有源装置的光波导平台及其制造方法

    公开(公告)号：US09042686B2

    公开(公告)日：2015-05-26

    申请号：US13487807

    申请日：2012-06-04

    Applicant: Hyun Soo Kim ,  Jong Sool Jeong ,  Mi-Ran Park ,  Byungseok Choi ,  O-Kyun Kwon

    Inventor： Hyun Soo Kim ,  Jong Sool Jeong ,  Mi-Ran Park ,  Byungseok Choi ,  O-Kyun Kwon

    IPC: G02B6/12 ,  G02B6/26 ,  G02B6/42 ,  G02B6/10 ,  G02B6/43 ,  G02B6/122

    CPC classification number: G02B6/43 ,  G02B6/12004 ,  G02B6/1228 ,  G02B6/4224 ,  G02B6/4232

    Abstract: Disclosed are an optical waveguide platform with integrated active transmission device and monitoring photodiode. The optical waveguide platform with hybrid integrated optical transmission device and optical active device includes an optical waveguide region formed by stacking a lower cladding layer, a core layer and an upper cladding layer on a substrate; a trench region formed by etching a portion of the optical waveguide region; and a spot expanding region formed on the core layer in the optical waveguide region, in which the optical transmission device is mounted in the trench region and the optical active device is flip-chip bonded to the spot expanding region. The monitoring photodiode is flip-chip bonded to the spot expanding region of the core layer of the optical waveguide, thereby monitoring output light including an optical coupling loss that occurs during flip-chip bonding.

    Abstract translation: 公开了一种具有集成主动传输装置和监测光电二极管的光波导平台。 具有混合集成光传输装置和光学有源装置的光波导平台包括通过在基板上层叠下包层，芯层和上包层而形成的光波导区域; 通过蚀刻光波导区域的一部分形成的沟槽区域; 以及形成在光波导区域的芯层上的点扩展区域，其中光传输装置安装在沟槽区域中，并且光学有源器件被倒装芯片接合到点扩展区域。 监视光电二极管被倒装芯片接合到光波导的芯层的点扩展区域，从而监视包括在倒装芯片接合期间发生的光耦合损耗的输出光。

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