Abstract:
A method of forming a microelectronic non-volatile memory cell, a memory cell formed according to the method, and a system including the memory cell. The method comprises: providing a substrate; providing a pair of spaced apart isolation bodies on the substrate, the isolation bodies including respective raised isolation portions, providing the pair comprising providing a buffer layer on the substrate; providing pillar spacers on side walls of the raised isolation portions; removing the buffer layer after providing the pillar spacers; removing the pillar spacers during removing the buffer layer; providing a tunnel dielectric on the surface of the substrate after removing the buffer layer; providing a floating gate on the tunnel dielectric; reducing a height of the isolation bodies to yield corresponding isolation regions; providing source and drain regions on opposite sides of the floating gate; providing an interpoly dielectric on the floating gate; and providing a control gate on the interpoly dielectric to yield the memory cell.
Abstract:
Memory devices, methods for programming sense flags, methods for sensing flags, and memory systems are disclosed. In one such memory device, the odd bit lines of a flag memory cell array are connected with a short circuit to a dynamic data cache. The even bit lines of the flag memory cell array are disconnected from the dynamic data cache. When an even page of a main memory cell array is read, the odd flag memory cells, comprising flag data, are read at the same time so that it can be determined whether the odd page of the main memory cell array has been programmed. If the flag data indicates that the odd page has not been programmed, threshold voltage windows can be adjusted to determine the states of the sensed even memory cell page.
Abstract:
A method and device using bitline-bitline capacitance between adjacent bitlines to boost seed voltage in a memory device are provided. The method may include a precharge phase, a boost phase, an equalize phase, and a lock in phase. In one embodiment, the method may include boosting the seed voltage twice. The bitlines may be divided into one or more segments.
Abstract:
Floating gate structures are generally described. In one example, an electronic device includes a semiconductor substrate, a tunnel dielectric coupled with the semiconductor substrate, and a floating gate structure comprising at least a first region having a first electron energy level or electron workfunction or carrier capture efficiency coupled with the tunnel dielectric and a second region having a second electron energy level or electron workfunction or carrier capture efficiency coupled with the first region wherein the first electron energy level or electron workfunction or carrier capture efficiency is less than the second electron energy level or electron workfunction or carrier capture efficiency. Such electronic device may reduce the thickness of the floating gate structure or reduce leakage current through an inter-gate dielectric, or combinations thereof, compared with a floating gate structure that comprises only polysilicon.
Abstract:
Disclosed is a non-volatile memory cell. The non-volatile memory cell includes a substrate having an active area. A bottom dielectric layer is disposed over the active area of the substrate which provides tunneling migration to the charge carriers towards the active area. A charge storage node is disposed above the bottom dielectric layer. Further, the non-volatile memory cell includes a plurality of top dielectric layers disposed above the charge storage node. Each of the plurality of top dielectric layers can be tuned with a set of attributes for reducing a leakage current through the plurality of top dielectric layers. Over the plurality of top dielectric layers, a control gate is disposed.
Abstract:
Devices, systems and methods of biasing in memory devices facilitate memory device programming and/or erase operations. In at least one embodiment, a first string of memory cells comprising a selected memory cell and a second string of memory cells are coupled to a common data line and a common source where the data line and the source are biased to substantially the same potential during a programming and/or erase operation performed on one or more of the strings of memory cells.
Abstract:
Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods.
Abstract:
Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation.
Abstract:
Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods.
Abstract:
Methods for programming a memory device, memory devices configured to perform the disclosed programming methods, and memory systems having a memory device configured to perform the disclosed programming methods, for example, are provided. According to at least one such method, multiple independent semiconductor well regions each having strings of memory cells are independently biased during a programming operation performed on a memory device. Reduced charge leakage may be realized during a programming operation in response to independent well biasing methods.