公开(公告)号：US08942004B2

公开(公告)日：2015-01-27

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

发明人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

IPC分类号： H05K1/18 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US20120080224A1

公开(公告)日：2012-04-05

申请号：US13137871

申请日：2011-09-20

申请人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

发明人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

IPC分类号： H05K9/00 ,  H05K3/02 ,  H05K3/46

CPC分类号： H05K1/0221 ,  H05K3/28 ,  H05K2201/0195 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

摘要翻译： 提供了一种用于信号传输的电路板及其制造方法。 用于信号传输的电路板包括第一绝缘层，布置在第一绝缘层上的多个信号互连，布置在多个信号互连两侧的第一绝缘层上的接地互连，设置在第一绝缘层上的第一绝缘层 包括多个信号互连和接地互连的绝缘层，设置在第二绝缘层上的第一屏蔽层，用于电连接接地互连和第一屏蔽层并穿过第二绝缘层的第一屏蔽层，第二屏蔽层 设置在第一绝缘层下面的第二屏蔽壁和用于电连接接地互连和第二屏蔽层并穿过第一绝缘层的第二屏蔽壁。

公开(公告)号：US20100288535A1

公开(公告)日：2010-11-18

申请号：US12546502

申请日：2009-08-24

申请人： Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

发明人： Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

IPC分类号： H05K1/02 ,  H05K3/30

CPC分类号： H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

摘要： Disclosed herein is an electronic component-embedded printed circuit board, in which a cooling member connecting with an inner circuit layer of a printed circuit board is provided on one side of an electronic component, so that the heat radiation performance thereof can be improved and the thickness thereof can be decreased, and a method of manufacturing the same.

摘要翻译： 这里公开了一种电子部件嵌入式印刷电路板，其中在电子部件的一侧设置有与印刷电路板的内部电路层连接的冷却部件，从而能够提高其散热性能， 其厚度可以减小，及其制造方法。

公开(公告)号：US07278193B2

公开(公告)日：2007-10-09

申请号：US11038048

申请日：2005-01-21

申请人： Bong Kyu Choi ,  Chun Ho Choi

发明人： Bong Kyu Choi ,  Chun Ho Choi

IPC分类号： B23P19/04

CPC分类号： B01F11/0074 ,  B01F5/10 ,  B01F11/0071 ,  B01F13/00 ,  B01F2215/0037 ,  G01N35/10 ,  G01N2035/106 ,  H01L21/485 ,  H01L21/67144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/10598 ,  H05K2203/0165 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/4973 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53196

摘要： A device is provided for coupling (i) a PCB sheet, which includes a first PCB and a space formed after removing a defective PCB from the PCB sheet, with (ii) a replacement second PCB received in the space and has a connecting part spaced from a periphery of the space by a channel. The device includes a PCB securing plate adapted to support the PCB sheet. PCB securing pins project from an upper surface of the PCB securing plate to be inserted into pin receiving holes of the first and second PCBs for positioning the PCBs. PCB securing tapes are integrally attached on the PCB securing plate for securing the PCB sheet and the second PCB to the PCB securing plate. An adhesive is adapted to be filled into the channel to couple, when cured, the PCB sheet and the second PCB together.

摘要翻译： 提供了一种用于耦合（i）PCB板的装置，其包括第一PCB和从PCB板除去有缺陷的PCB之后形成的空间，其中（ii）替换的第二PCB被接收在该空间中并且具有间隔开的连接部分 从空间的边缘通过一个通道。 该装置包括适于支撑PCB片的PCB固定板。 PCB固定销从PCB固定板的上表面突出以插入第一和第二PCB的针脚接收孔中，用于定位PCB。 PCB固定带一体地安装在PCB固定板上，用于将PCB板和第二PCB固定到PCB固定板上。 粘合剂适于填充到通道中，以在固化时将PCB片和第二PCB连接在一起。

公开(公告)号：US07103966B2

公开(公告)日：2006-09-12

申请号：US11038047

申请日：2005-01-21

申请人： Bong Kyu Choi ,  Chun Ho Choi

发明人： Bong Kyu Choi ,  Chun Ho Choi

IPC分类号： B23P19/00

CPC分类号： B01F11/0074 ,  B01F5/10 ,  B01F11/0071 ,  B01F13/00 ,  B01F2215/0037 ,  G01N35/10 ,  G01N2035/106 ,  H01L21/485 ,  H01L21/67144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/10598 ,  H05K2203/0165 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/4973 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53196

摘要： A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2′ is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2′, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2′ is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

公开(公告)号：US07017248B2

公开(公告)日：2006-03-28

申请号：US10177664

申请日：2002-06-24

申请人： Bong Kyu Choi ,  Chun Ho Choi

发明人： Bong Kyu Choi ,  Chun Ho Choi

IPC分类号： B23P19/04

CPC分类号： B01F11/0074 ,  B01F5/10 ,  B01F11/0071 ,  B01F13/00 ,  B01F2215/0037 ,  G01N35/10 ,  G01N2035/106 ,  H01L21/485 ,  H01L21/67144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/10598 ,  H05K2203/0165 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/4973 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53196

摘要： A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2′ is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2′, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2′ is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

摘要翻译： 公开了一种用于连接PCB片的方法和装置。 如果在制造连续布置的电路图案后发现有缺陷的PCB，则去除有缺陷的PCB片部分以用新的PCB片部分替换它。 也就是说，从第一PCB片4a的连续布置的电路图案中去除了有缺陷的电路图案片2'。 在去除有缺陷的电路图案片2'之后，第一PCB片材4a通过位置定位装置12定位。 然后，通过去除缺陷电路图案片2'形成的空间填充有印刷良好质量电路图案2b的第二PCB片4b。 然后，第一PCB片材4a和第二PCB片材4b通过使用粘合剂装置14连接在一起。

公开(公告)号：US06574862B1

公开(公告)日：2003-06-10

申请号：US09510298

申请日：2000-02-22

申请人： Bong Kyu Choi ,  Chun Ho Choi

发明人： Bong Kyu Choi ,  Chun Ho Choi

IPC分类号： H05K302

CPC分类号： B01F11/0074 ,  B01F5/10 ,  B01F11/0071 ,  B01F13/00 ,  B01F2215/0037 ,  G01N35/10 ,  G01N2035/106 ,  H01L21/485 ,  H01L21/67144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/10598 ,  H05K2203/0165 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/4973 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53196

摘要： In a method for coupling a PCB sheet, if a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet is removed from continuously arranged circuit patterns of a first PCB sheet. After removal of the defective circuit pattern sheet, the first PCB sheet is position-located by a position locator. Then, the space which is formed by removing, the defective circuit pattern sheet is filled with a second PCB sheet on which a good quality circuit pattern is printed. Then, the first PCB sheet and the second PCB sheet are coupled together by using an adhesive.

摘要翻译： 在一种用于连接PCB板的方法中，如果在制造连续布置的电路图案之后发现有缺陷的PCB，则去除有缺陷的PCB片部分以用新的PCB片部分替换它。 也就是说，从第一PCB片的连续布置的电路图案中去除了有缺陷的电路图案片。 在去除有缺陷的电路图案片之后，第一PCB片通过位置定位器定位。 然后，通过去除形成有缺陷的电路图案片的空间填充有印刷良好质量电路图案的第二PCB片。 然后，使用粘合剂将第一PCB片和第二PCB片连接在一起。

公开(公告)号：US20070241438A1

公开(公告)日：2007-10-18

申请号：US11783874

申请日：2007-04-12

申请人： Tae Hyeog Kang ,  Kwang Seop Youm ,  Kyu Hyun Shim ,  Bong Kyu Choi ,  Kyu Il Hwang ,  Won Hee Kim

发明人： Tae Hyeog Kang ,  Kwang Seop Youm ,  Kyu Hyun Shim ,  Bong Kyu Choi ,  Kyu Il Hwang ,  Won Hee Kim

IPC分类号： H01L23/02

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a strip format of a semiconductor package board and an array thereof, in which a dummy area of the strip format of the semiconductor package board is formed into a predetermined shape such that, when several strip formats of semiconductor package boards are arranged on a panel, the number of strip formats of semiconductor package boards arranged on the panel can be increased.

摘要翻译： 这里公开了一种半导体封装板及其阵列的条形格式，其中半导体封装板的条形格式的虚拟区域形成为预定形状，使得当半导体封装板的多个条形格式布置在 可以增加布置在面板上的半导体封装板的条形格式的数量。

公开(公告)号：US07234217B2

公开(公告)日：2007-06-26

申请号：US11038050

申请日：2005-01-21

申请人： Bong Kyu Choi ,  Chun Ho Choi

发明人： Bong Kyu Choi ,  Chun Ho Choi

IPC分类号： B23P19/04

CPC分类号： B01F11/0074 ,  B01F5/10 ,  B01F11/0071 ,  B01F13/00 ,  B01F2215/0037 ,  G01N35/10 ,  G01N2035/106 ,  H01L21/485 ,  H01L21/67144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/10598 ,  H05K2203/0165 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/4973 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53196

摘要： A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2′ is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2′, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2′ is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

摘要翻译： 公开了一种用于连接PCB片的方法和装置。 如果在制造连续布置的电路图案后发现有缺陷的PCB，则去除有缺陷的PCB片部分以用新的PCB片部分替换它。 也就是说，从第一PCB片4a的连续布置的电路图案中去除了有缺陷的电路图案片2'。 在去除有缺陷的电路图案片2'之后，第一PCB片材4a通过位置定位装置12定位。 然后，通过去除缺陷电路图案片2'形成的空间填充有印刷良好质量电路图案2b的第二PCB片4b。 然后，第一PCB片材4a和第二PCB片材4b通过使用粘合剂装置14连接在一起。

公开(公告)号：US07175501B2

公开(公告)日：2007-02-13

申请号：US11075898

申请日：2005-03-09

申请人： Bong Kyu Choi

发明人： Bong Kyu Choi

IPC分类号： A63H17/36

CPC分类号： B62K9/00

摘要： The present invention relates to a children's car that moves forward with a simple and easy operation with particular care taken of the safety of the child riding the car. A steering block which can be steered with a steering wheel and a steering column is provided at the front of the car body. Drive wheels having a ratchet wheel are provided on opposed sides of the steering block. Auxiliary wheels are provided at the front and the rear of the steering block to stably support the car body. As a child sits on or in the car and turns the steering wheel in alternating directions, the right and left drive wheels rotate in a forward direction. A pawl linked to the steering block engages the ratchet wheels to prevent inverse rotation of the drive wheels, causing the car to proceed ahead in a zig-zag pattern.

摘要翻译： 本发明涉及一种儿童车，其特征在于驾驶汽车的儿童的安全性，简单且容易的操作向前移动。 在车身前部设置有能够转向方向盘和转向柱的转向块。 具有棘轮的驱动轮设置在转向块的相对侧上。 辅助轮设置在转向块的前后，以稳定地支撑车体。 当孩子坐在车上或在车内转动方向盘时，左右驱动轮沿向前的方向转动。 连接到转向块的棘爪接合棘轮以防止驱动轮的反向旋转，导致轿厢以锯齿形图案前进。