Oxynitride semiconductor thin film
    8.
    发明授权
    Oxynitride semiconductor thin film 有权
    氧氮化物半导体薄膜

    公开(公告)号:US09543447B2

    公开(公告)日:2017-01-10

    申请号:US14773531

    申请日:2014-03-06

    Abstract: The purpose of the present invention is to provide an oxide semiconductor thin film, which has relatively high carrier mobility and is suitable as a channel layer material for a TFT, from an oxynitride crystalline thin film. According to the present invention, a crystalline oxynitride semiconductor thin film is obtained by annealing an amorphous oxynitride semiconductor thin film containing In, O, and N or an amorphous oxynitride semiconductor thin film containing In, O, N, and an additional element M, where M is one or more elements selected from among Zn, Ga, Ti, Si, Ge, Sn, W, Mg, Al, Y and rare earth elements, at a heating temperature of 200° C. or more for a heating time of 1 minute to 120 minutes.

    Abstract translation: 本发明的目的是提供一种氧化物半导体薄膜,其具有相对高的载流子迁移率,并且适合作为来自氮氧化物晶体薄膜的TFT的沟道层材料。 根据本发明,通过对包含In,O和N的非晶氮氧化物半导体薄膜或含有In,O,N和附加元素M的非晶氮氧化物半导体薄膜进行退火,得到结晶氮氧化物半导体薄膜,其中 M是选自Zn,Ga,Ti,Si,Ge,Sn,W,Mg,Al,Y和稀土元素中的一种或多种元素,加热温度为200℃以上,加热时间为1 分钟至120分钟。

    OXIDE SEMICONDUCTOR THIN FILM AND THIN FILM TRANSISTOR
    10.
    发明申请
    OXIDE SEMICONDUCTOR THIN FILM AND THIN FILM TRANSISTOR 有权
    氧化物半导体薄膜和薄膜晶体管

    公开(公告)号:US20150279943A1

    公开(公告)日:2015-10-01

    申请号:US14434939

    申请日:2013-10-10

    CPC classification number: H01L29/24 H01L29/04 H01L29/66969 H01L29/7869

    Abstract: An oxide crystalline thin film having a comparatively high carrier mobility and suitable as TFT channel layer material is provided. The oxide semiconductor thin film of the present invention comprises an oxide that includes indium and tungsten, with the tungsten content in the W/In atomic ratio being 0.005 to 0.12, is crystalline, comprises only the In2O3 phase of bixbyite structure, and has a carrier density of 1×1018 cm−3 or less and a carrier mobility of higher than 1 cm2/Vsec. The oxide is able to include zinc further with the zinc content in the Z/In atomic ratio of 0.05 or less.

    Abstract translation: 提供具有较高载流子迁移率且适合作为TFT沟道层材料的氧化物晶体薄膜。 本发明的氧化物半导体薄膜包含含有铟和钨的氧化物,W / In原子比为0.005〜0.12的钨含量为结晶,仅包含双峰结构的In 2 O 3相,并具有载体 密度为1×1018 cm -3以下,载流子迁移率高于1cm2 / Vsec。 氧化物能够进一步包含Z / In原子比为0.05以下的锌含量。

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