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1.发明申请EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING THE EPOXY RESIN COMPOSITION, AND COMPOSITE UNIT 有权环氧树脂组合物，使用环氧树脂组合物生产复合单元的方法和复合单元公开(公告)号：US20120281376A1
公开(公告)日：2012-11-08
申请号：US13517415
申请日：2010-12-20
CPC分类号： H01L23/293 , C08G59/621 , C08L63/00 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/27334 , H01L2224/2929 , H01L2224/32058 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/75316 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/83132 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/83907 , H01L2224/9211 , H01L2224/94 , H01L2924/01012 , H01L2924/01029 , H01L2924/07802 , H01L2924/15788 , H05K1/0269 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/09918 , H05K2201/10674 , H05K2203/0195 , H05K2203/0278 , Y02P70/613 , C08L33/068 , C08L61/06 , H01L2924/0635 , H01L2924/0665 , H01L2924/066 , H01L2924/014 , H01L2924/00014 , H01L2224/27 , H01L2924/01047 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).
摘要翻译： 公开了具有优异的连接可靠性和透明性的环氧树脂组合物，使用该环氧树脂组合物的复合单元的制造方法和复合单元。 该制造方法包括将包含酚醛清漆型酚醛固化剂的环氧树脂组合物（2），由含有二甲基丙烯酰胺和甲基丙烯酸羟基乙酯的共聚物构成的丙烯酸类弹性体，环氧树脂和不小于5重量份的附着工序 相对于100重量份的环氧树脂，不到20重量份的无机填料，以片状的印刷电路板（1）。 该制造方法还包括临时加载环氧树脂组合物（2）上的半导体芯片（3）和电容器（4a）至（4d）的负载步骤以及加压半导体芯片（3）和 电容器（4a）至（4d）通过热粘合头（20）原位以最终将半导体芯片（3）和电容器（4a）至（4d）压接。
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2.发明授权Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit 有权环氧树脂组合物，使用该环氧树脂组合物的复合体的制造方法以及复合体公开(公告)号：US08802776B2
公开(公告)日：2014-08-12
申请号：US13517415
申请日：2010-12-20
CPC分类号： H01L23/293 , C08G59/621 , C08L63/00 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/27334 , H01L2224/2929 , H01L2224/32058 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/75316 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/83132 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/83907 , H01L2224/9211 , H01L2224/94 , H01L2924/01012 , H01L2924/01029 , H01L2924/07802 , H01L2924/15788 , H05K1/0269 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/09918 , H05K2201/10674 , H05K2203/0195 , H05K2203/0278 , Y02P70/613 , C08L33/068 , C08L61/06 , H01L2924/0635 , H01L2924/0665 , H01L2924/066 , H01L2924/014 , H01L2924/00014 , H01L2224/27 , H01L2924/01047 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).
摘要翻译： 公开了具有优异的连接可靠性和透明性的环氧树脂组合物，使用该环氧树脂组合物的复合单元的制造方法和复合单元。 该制造方法包括将包含酚醛清漆型酚醛固化剂的环氧树脂组合物（2），由含有二甲基丙烯酰胺和甲基丙烯酸羟基乙酯的共聚物构成的丙烯酸类弹性体，环氧树脂和不小于5重量份的附着工序 相对于100重量份的环氧树脂，不到20重量份的无机填料，以片状的印刷电路板（1）。 该制造方法还包括临时加载环氧树脂组合物（2）上的半导体芯片（3）和电容器（4a）至（4d）的负载步骤以及加压半导体芯片（3）和 电容器（4a）至（4d）通过热粘合头（20）原位以最终将半导体芯片（3）和电容器（4a）至（4d）压接。
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公开(公告)号：US09084373B2
公开(公告)日：2015-07-14
申请号：US13978600
申请日：2011-12-15
申请人： Taichi Koyama , Takayuki Saito
发明人： Taichi Koyama , Takayuki Saito
CPC分类号： H05K7/2039 , C08G59/42 , C08K3/08 , C08K2003/0806 , C09J9/00 , C09J11/04 , C09J163/00 , H01L23/3737 , H01L24/29 , H01L2224/29298 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H01L2924/07811 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.
摘要翻译： 一种导热粘合剂，其具有：含有可固化组分的热固性粘合剂和用于可固化组分的固化剂，以及分散在热固性粘合剂中的金属填料使用银粉和焊料粉末作为金属填料。 使用的焊料粉末的熔融温度低于导热性粘合剂的热固化温度，并且当焊料粉末反应时产生熔点高于焊料粉末的熔融温度的高熔点焊料合金 在导热粘合剂的热固化条件下，银粉末。 使用对金属填充剂具有助熔活性的固化剂作为固化剂。
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公开(公告)号：US20130279118A1
公开(公告)日：2013-10-24
申请号：US13978600
申请日：2011-12-15
申请人： Taichi Koyama , Takayuki Saito
发明人： Taichi Koyama , Takayuki Saito
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , C08G59/42 , C08K3/08 , C08K2003/0806 , C09J9/00 , C09J11/04 , C09J163/00 , H01L23/3737 , H01L24/29 , H01L2224/29298 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H01L2924/07811 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.
摘要翻译： 一种导热粘合剂，其具有：含有可固化组分的热固性粘合剂和用于可固化组分的固化剂，以及分散在热固性粘合剂中的金属填料使用银粉和焊料粉末作为金属填料。 使用的焊料粉末的熔融温度低于导热性粘合剂的热固化温度，并且当焊料粉末反应时产生熔点高于焊料粉末的熔融温度的高熔点焊料合金 在导热粘合剂的热固化条件下，银粉末。 使用对金属填充剂具有助熔活性的固化剂作为固化剂。
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