公开(公告)号：US20120281376A1

公开(公告)日：2012-11-08

申请号：US13517415

申请日：2010-12-20

申请人： Taichi Koyama ,  Hironobu Moriyama ,  Takashi Matsumura ,  Takayuki Saito

发明人： Taichi Koyama ,  Hironobu Moriyama ,  Takashi Matsumura ,  Takayuki Saito

IPC分类号： H01B1/20 ,  H01L21/50 ,  H05K1/18 ,  H01L21/78

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08L63/00 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/15788 ,  H05K1/0269 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y02P70/613 ,  C08L33/068 ,  C08L61/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).

摘要翻译： 公开了具有优异的连接可靠性和透明性的环氧树脂组合物，使用该环氧树脂组合物的复合单元的制造方法和复合单元。 该制造方法包括将包含酚醛清漆型酚醛固化剂的环氧树脂组合物（2），由含有二甲基丙烯酰胺和甲基丙烯酸羟基乙酯的共聚物构成的丙烯酸类弹性体，环氧树脂和不小于5重量份的附着工序 相对于100重量份的环氧树脂，不到20重量份的无机填料，以片状的印刷电路板（1）。 该制造方法还包括临时加载环氧树脂组合物（2）上的半导体芯片（3）和电容器（4a）至（4d）的负载步骤以及加压半导体芯片（3）和 电容器（4a）至（4d）通过热粘合头（20）原位以最终将半导体芯片（3）和电容器（4a）至（4d）压接。

公开(公告)号：US08802776B2

公开(公告)日：2014-08-12

申请号：US13517415

申请日：2010-12-20

申请人： Taichi Koyama ,  Hironobu Moriyama ,  Takashi Matsumura ,  Takayuki Saito

发明人： Taichi Koyama ,  Hironobu Moriyama ,  Takashi Matsumura ,  Takayuki Saito

IPC分类号： C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  H05K1/18 ,  H01L21/82

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08L63/00 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/32058 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/15788 ,  H05K1/0269 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y02P70/613 ,  C08L33/068 ,  C08L61/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/066 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).

摘要翻译： 公开了具有优异的连接可靠性和透明性的环氧树脂组合物，使用该环氧树脂组合物的复合单元的制造方法和复合单元。 该制造方法包括将包含酚醛清漆型酚醛固化剂的环氧树脂组合物（2），由含有二甲基丙烯酰胺和甲基丙烯酸羟基乙酯的共聚物构成的丙烯酸类弹性体，环氧树脂和不小于5重量份的附着工序 相对于100重量份的环氧树脂，不到20重量份的无机填料，以片状的印刷电路板（1）。 该制造方法还包括临时加载环氧树脂组合物（2）上的半导体芯片（3）和电容器（4a）至（4d）的负载步骤以及加压半导体芯片（3）和 电容器（4a）至（4d）通过热粘合头（20）原位以最终将半导体芯片（3）和电容器（4a）至（4d）压接。

公开(公告)号：US20230289959A1

公开(公告)日：2023-09-14

申请号：US18040008

申请日：2021-07-30

申请人： Tatsuya Niimi ,  Takashi Matsumura ,  Takuya Saito

发明人： Tatsuya Niimi ,  Takashi Matsumura ,  Takuya Saito

IPC分类号： G06T7/00 ,  G16H30/40

CPC分类号： G06T7/0012 ,  G16H30/40 ,  G06T2207/10088

摘要： A three-dimensional object can be produced based on biological property information indicating a biological property obtained by MRE measurement of an organism. The three-dimensional object has a distribution of a strength property corresponding to a distribution of the biological property.

公开(公告)号：US20230264422A1

公开(公告)日：2023-08-24

申请号：US18169986

申请日：2023-02-16

申请人： Yoichi Ito ,  Tsuyoshi Arao ,  Tomomi Akieda ,  Takashi Matsumura

发明人： Yoichi Ito ,  Tsuyoshi Arao ,  Tomomi Akieda ,  Takashi Matsumura

IPC分类号： B29C64/35 ,  B33Y30/00 ,  B29C64/393 ,  B33Y50/02 ,  B29C64/112 ,  B33Y40/00 ,  B33Y10/00

CPC分类号： B29C64/35 ,  B29C64/112 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02

摘要： A three-dimensional fabricating apparatus includes a discharge head, a detector, a non-contact cleaner, and a controller. The discharge head discharges droplets to fabricate a three-dimensional object. The detector detects a state of the discharge head. The non-contact cleaner cleans the discharge head in a non-contact manner. The controller controls an operation of the three-dimensional fabricating apparatus according to the state of the discharge head detected by the detector after the non-contact cleaner cleans the discharge head.

公开(公告)号：US10854113B2

公开(公告)日：2020-12-01

申请号：US15450720

申请日：2017-03-06

申请人： Yoshihiro Norikane ,  Tatsuya Niimi ,  Takashi Matsumura ,  Hiroshi Iwata ,  Hiroyuki Naito

发明人： Yoshihiro Norikane ,  Tatsuya Niimi ,  Takashi Matsumura ,  Hiroshi Iwata ,  Hiroyuki Naito

IPC分类号： G09B23/30 ,  B29C64/20 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  B29L31/00 ,  B29K105/00 ,  B29L31/40

摘要： A solid freeform fabrication object includes a hydrogel including a polymer, water, and a coloring material inclusion substance.

公开(公告)号：US10442181B2

公开(公告)日：2019-10-15

申请号：US15209268

申请日：2016-07-13

申请人： Hiroshi Iwata ,  Tatsuya Niimi ,  Yoshihiro Norikane ,  Takashi Matsumura

发明人： Hiroshi Iwata ,  Tatsuya Niimi ,  Yoshihiro Norikane ,  Takashi Matsumura

IPC分类号： B33Y70/00 ,  B29C64/112 ,  C08K5/053 ,  C08K5/05 ,  B29C64/40 ,  B33Y10/00 ,  B29L31/00

摘要： A hydrogel object includes a polymer and water, wherein the rate of mass loss is not greater than 20 percent by mass when the hydrogel object is left undone for one week at 25 degrees C. and relative humidity of 50 percent.

公开(公告)号：US09368374B2

公开(公告)日：2016-06-14

申请号：US13131427

申请日：2010-02-23

申请人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

发明人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

摘要翻译： 提供一种制造半导体器件的方法。 该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入 紧迫。 该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。

公开(公告)号：US08441507B2

公开(公告)日：2013-05-14

申请号：US12880525

申请日：2010-09-13

申请人： Yoshinori Yamaguchi ,  Hirohito Yoneyama ,  Yohei Nishino ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

发明人： Yoshinori Yamaguchi ,  Hirohito Yoneyama ,  Yohei Nishino ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

IPC分类号： G01D15/06

CPC分类号： B41J2/45 ,  G03G15/04045 ,  G03G15/326 ,  G03G2215/0409 ,  G03G2215/0412

摘要： The present invention provides an annular exposure device, including: plural light emitting members that are provided two-dimensionally along an outer circumferential surface of the annular exposure device, the annular exposure device rotating when the annular exposure device contacts a surface of an image holding member.

摘要翻译： 本发明提供了一种环形曝光装置，包括：沿着环形曝光装置的外圆周表面二维设置的多个发光部件，环形曝光装置在环形曝光装置接触图像保持部件的表面时旋转 。

公开(公告)号：US08421339B2

公开(公告)日：2013-04-16

申请号：US12620182

申请日：2009-11-17

申请人： Yohei Nishino ,  Hirohito Yoneyama ,  Yoshinori Yamaguchi ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

发明人： Yohei Nishino ,  Hirohito Yoneyama ,  Yoshinori Yamaguchi ,  Takashi Matsumura ,  Kiyokazu Mashimo ,  Katsuhiro Sato

IPC分类号： H01L51/52

CPC分类号： B41J2/451 ,  G03G15/04072 ,  G03G15/326 ,  G03G2215/0412 ,  H01L51/5012 ,  H01L2251/564

摘要： An organic electroluminescent device includes: a pair of electrodes; a first light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that one of the pair of electrodes serves as an anode; and a second light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that the other of the pair of electrodes serves as an anode.

摘要翻译： 一种有机电致发光器件包括：一对电极; 第一发光区域，其设置在所述一对电极之间，并且当在所述一对电极之间施加电压时发光，使得所述一对电极中的一个用作阳极; 以及第二发光区域，其设置在所述一对电极之间，并且当在所述一对电极之间施加电压时发光，使得所述一对电极中的另一个用作阳极。

公开(公告)号：US08011407B2

公开(公告)日：2011-09-06

申请号：US12461763

申请日：2009-08-24

申请人： Takashi Matsumura

发明人： Takashi Matsumura

IPC分类号： B29C65/02 ,  B29C65/48 ,  B32B37/10 ,  B30B5/02 ,  B30B15/34

CPC分类号： H05K3/303 ,  B30B5/02 ,  B30B15/024 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/753 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75754 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/83907 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/19105 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/0278 ,  Y02P70/613 ,  Y10T156/16 ,  H01L2924/00 ,  H01L2224/0401

摘要： A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.

摘要翻译： 压接装置具有阻挡构件，使得当按压头被按压被按压物体时，接合部被堤坝构件包围。 因此，即使接合部的表面通过按压而凸起，凸起部被阻挡构件阻止，接合部的表面也不会水平延伸。 由于不存在接合部的水平延伸，所以被加压物的电气部件不会受到使电气部件水平移动并且电气部件被垂直向下压并连接到基板的端子的力 。 因此，获得了具有高连接可靠性的电气装置。