公开(公告)号：US08179691B2

公开(公告)日：2012-05-15

申请号：US12318689

申请日：2009-01-06

申请人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H05K7/00

CPC分类号： H05K1/0245 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0216 ,  H05K1/0248 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09736

摘要： A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is ⅓ or less of the thickness of the second insulating layer.

摘要翻译： 布线电路板包括第一绝缘层; 形成在所述第一绝缘层上的第一线; 形成在所述第一绝缘层上以覆盖所述第一线的第二绝缘层; 以及形成在所述第二绝缘层上以在厚度方向上相对于所述第一布线布置的第二布线。 第一线的厚度为1μm以下，为第二绝缘层的厚度的1/3以下。

公开(公告)号：US20090173521A1

公开(公告)日：2009-07-09

申请号：US12318689

申请日：2009-01-06

申请人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H05K1/02

CPC分类号： H05K1/0245 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0216 ,  H05K1/0248 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09736

摘要： A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is ⅓ or less of the thickness of the second insulating layer.

摘要翻译： 布线电路板包括第一绝缘层; 形成在所述第一绝缘层上的第一线; 形成在所述第一绝缘层上以覆盖所述第一线的第二绝缘层; 以及形成在所述第二绝缘层上以在厚度方向上相对于所述第一布线布置的第二布线。 第一线的厚度为1μm以下，为第二绝缘层的厚度的1/3以下。

公开(公告)号：US20090283314A1

公开(公告)日：2009-11-19

申请号：US12453473

申请日：2009-05-12

申请人： Tetsuya Ohsawa ,  Yasunari Ooyabu ,  Jun Ishii

发明人： Tetsuya Ohsawa ,  Yasunari Ooyabu ,  Jun Ishii

IPC分类号： H05K1/11 ,  H05K3/02

CPC分类号： H05K3/242 ,  G11B5/484 ,  H05K1/056 ,  H05K1/117 ,  H05K3/06 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2203/175

摘要： A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern.

摘要翻译： 布线电路板的制造方法包括以下步骤：一体地形成导电图案，与导电图案电连接的镀层引线，以及设置在电镀引线中的调节部分，以调节蚀刻剂穿入导电图案; 并用蚀刻剂蚀刻镀层，同时调节部分调节蚀刻剂穿入导电图案。

公开(公告)号：US07471519B2

公开(公告)日：2008-12-30

申请号：US11187865

申请日：2005-07-25

申请人： Yasunari Ooyabu ,  Yasuhito Funada ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

发明人： Yasunari Ooyabu ,  Yasuhito Funada ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

IPC分类号： H05K1/00

CPC分类号： H05K1/181 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/09972 ,  Y02P70/611

摘要： A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board is constructed so that a suspension board portion for supporting the magnetic head and a control board portion for controlling the magnetic head are formed to be continuous and integral with each other. To be more specific, a first conductor layer connected to the magnetic head in the suspension board portion and a second conductor layer connected to a preamplifier IC in the control board portion are formed from the same material and formed on a common insulating base layer simultaneously. Further, a common insulating cover layer to cover the first conductor layer and the second conductor layer is formed on the common insulating base layer.

摘要翻译： 一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。 布线电路板被构造成使得用于支撑磁头的悬架板部分和用于控制磁头的控制板部分彼此连续并且一体地形成。 更具体地说，连接到悬架板部分中的磁头的第一导体层和连接到控制板部分中的前置放大器IC的第二导体层由相同的材料形成并同时形成在公共绝缘基底层上。 此外，在公共绝缘基底层上形成覆盖第一导体层和第二导体层的公共绝缘覆盖层。

公开(公告)号：US20080277142A1

公开(公告)日：2008-11-13

申请号：US12081835

申请日：2008-04-22

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H05K1/00

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

摘要翻译： 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子 如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。 此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。 这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。

公开(公告)号：US08015703B2

公开(公告)日：2011-09-13

申请号：US12081835

申请日：2008-04-22

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A method of manufacturing a wired circuit board including a metal supporting board. An insulating layer is formed on the metal supporting board in a pattern in which concave portions are formed. A conductive pattern in a pattern having terminals for connecting with external terminals via a molten metal is formed on the metal supporting board and the insulating layer. The terminals include shoulder portions corresponding to the concave portions and are concaved downward from an upper surface. First through holes penetrate the terminals in a thickness direction thereof Second through holes are formed communicating with the first through holes in portions of the insulating layer corresponding to the terminals by removing the concave portions to expose a lower surface of the terminals such that the second through holes penetrate the insulating layer in a thickness direction thereof and have a diameter larger than that of the first through holes.

摘要翻译： 一种制造包括金属支撑板的布线电路板的方法。 绝缘层以形成有凹部的图案形成在金属支撑板上。 在金属支撑板和绝缘层上形成具有用于经由熔融金属与外部端子连接的端子的图案中的导体图案。 端子包括对应于凹部的肩部，并且从上表面向下凹入。 第一通孔在厚度方向上贯穿端子。通过除去凹部以露出端子的下表面，在绝缘层的与端子对应的部分中的第一通孔形成第二通孔，以使第二通孔 孔的厚度方向穿过绝缘层，其直径大于第一通孔的直径。

公开(公告)号：US08227705B2

公开(公告)日：2012-07-24

申请号：US12453473

申请日：2009-05-12

申请人： Tetsuya Ohsawa ,  Yasunari Ooyabu ,  Jun Ishii

发明人： Tetsuya Ohsawa ,  Yasunari Ooyabu ,  Jun Ishii

IPC分类号： H05K1/11 ,  G11B21/16

CPC分类号： H05K3/242 ,  G11B5/484 ,  H05K1/056 ,  H05K1/117 ,  H05K3/06 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2203/175

摘要： A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern.

摘要翻译： 布线电路板的制造方法包括以下步骤：一体地形成导电图案，与导电图案电连接的镀层引线，以及设置在电镀引线中的调节部分，以调节蚀刻剂穿入导电图案; 并用蚀刻剂蚀刻镀层，同时调节部分调节蚀刻剂穿入导电图案。

公开(公告)号：US07732900B2

公开(公告)日：2010-06-08

申请号：US11236815

申请日：2005-09-28

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01L23/495

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

摘要翻译： 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，从而导线4a，4b，4c，4d，磁头连接端子7和外部 连接端子8一体形成，并且在外部连接端子8中也形成有第一通孔9.然后，在形成绝缘覆盖层10之后，在支撑板2上形成第三通孔20和第二通孔19， 绝缘基底层3分别与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时可以进行连接，同时确认焊球的位置 21从相应的通孔。

公开(公告)号：US07405479B2

公开(公告)日：2008-07-29

申请号：US11224108

申请日：2005-09-13

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01L23/48

CPC分类号： G11B5/4853 ,  G11B5/4846 ,  G11B5/486 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3478 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/041 ,  Y02P70/611 ,  H01L2924/00

摘要： A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer 3 is formed on a supporting board 2 so that insulating concave portions 13 are formed at portions thereof where external connecting terminals 8 are to be formed. A conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, the magnetic head connecting terminals 7, and the external connecting portions 8 are integrally formed, and conductive concave portions 9 are formed in the external connecting terminals 8. Thereafter, an insulating cover layer 10 is formed on the insulating base layer 3 so that the magnetic head connecting terminals 7 and the external connecting terminals 8 are exposed from the insulating cover layer 10. In the suspension board with circuit 1 thus formed, when the external connecting terminals 8 are connected with connecting terminals of a read/write substrate via the solder balls 21, reliable connection therebetween can be ensured.

摘要翻译： 一种具有能够确保大的电气连接区域的端子的布线电路板，同时防止相邻端子的短路，以确保端子通过熔融金属与外部端子电连接。 绝缘基层3形成在支撑板2上，使得绝缘凹部13形成在其外部连接端子8将要形成的部分处。 导电图案4形成在绝缘基底层3上，使得线4a，4b，4c，4d的线数，磁头连接端子7和外部连接部8一体形成， 导电凹部9形成在外部连接端子8中。此后，在绝缘基底层3上形成绝缘覆盖层10，使得磁头连接端子7和外部连接端子8从绝缘覆盖层10露出 在具有如此形成的电路1的悬挂板中，当外部连接端子8经由焊球21与读取/写入基板的连接端子连接时，可以确保其间的可靠连接。

公开(公告)号：US20060087011A1

公开(公告)日：2006-04-27

申请号：US11236815

申请日：2005-09-28

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01L23/495

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

摘要翻译： 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子 如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。 此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。 这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。