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    Wired circuit board
    1.
    发明授权
    Wired circuit board 有权
    有线电路板

    公开(公告)号：US08179691B2

    公开(公告)日：2012-05-15

    申请号：US12318689

    申请日：2009-01-06

    申请人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

    发明人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

    IPC分类号： H05K7/00

    CPC分类号： H05K1/0245 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0216 ,  H05K1/0248 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09736

    摘要： A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is ⅓ or less of the thickness of the second insulating layer.

    摘要翻译： 布线电路板包括第一绝缘层; 形成在所述第一绝缘层上的第一线; 形成在所述第一绝缘层上以覆盖所述第一线的第二绝缘层; 以及形成在所述第二绝缘层上以在厚度方向上相对于所述第一布线布置的第二布线。 第一线的厚度为1μm以下，为第二绝缘层的厚度的1/3以下。

    Wired circuit board
    2.
    发明申请
    Wired circuit board 有权
    有线电路板

    公开(公告)号：US20090173521A1

    公开(公告)日：2009-07-09

    申请号：US12318689

    申请日：2009-01-06

    申请人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

    发明人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0245 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0216 ,  H05K1/0248 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09736

    摘要： A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is ⅓ or less of the thickness of the second insulating layer.

    摘要翻译： 布线电路板包括第一绝缘层; 形成在所述第一绝缘层上的第一线; 形成在所述第一绝缘层上以覆盖所述第一线的第二绝缘层; 以及形成在所述第二绝缘层上以在厚度方向上相对于所述第一布线布置的第二布线。 第一线的厚度为1μm以下，为第二绝缘层的厚度的1/3以下。

    Wired circuit board and connection structure between wired circuit boards
    3.
    发明授权
    Wired circuit board and connection structure between wired circuit boards 有权
    有线电路板和有线电路板之间的连接结构

    公开(公告)号：US07872200B2

    公开(公告)日：2011-01-18

    申请号：US11717706

    申请日：2007-03-14

    申请人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

    发明人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

    IPC分类号： H05K1/00

    CPC分类号： H01R12/592 ,  H01R12/52 ,  H05K1/056 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/10477 ,  H05K2203/041

    摘要： A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer and a conductive pattern formed on the insulating layer, and having a terminal portion for connecting to an external terminal. The terminal portion is disposed at an end portion of the conductive pattern, supported on the insulating layer, and exposed from the metal supporting layer to have an end surface thereof used as a point of contact with the external terminal.

    摘要翻译： 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电图案，并且具有用于连接到外部端子的端子部分。 端子部分设置在导电图案的端部，被支撑在绝缘层上，并从金属支撑层露出，使其端面用作与外部端子的接触点。

    Producing method of suspension board with circuit
    4.
    发明申请
    Producing method of suspension board with circuit 有权
    带电路的悬挂板的制作方法

    公开(公告)号：US20090014410A1

    公开(公告)日：2009-01-15

    申请号：US12216589

    申请日：2008-07-08

    申请人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

    发明人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

    IPC分类号： H01B13/34

    CPC分类号： G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/44 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0323 ,  H05K2203/056

    摘要： A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.

    摘要翻译： 具有电路的悬挂板的制造方法包括同时形成形成在金属支撑板上的绝缘层上的导电图案，并且具有用于连接到电子部件的端子部分，以及形成在金属支撑板上的标记， 所述绝缘层具有用于形成用于安装所述电子部件的基准孔的开口，并且通过蚀刻设置在所述标记的开口中的所述金属支撑板，或者设置在所述绝缘层和所述金属支撑板上而形成所述基准孔 打开标记。

    Wired circuit board and connection structure between wired circuit boards
    6.
    发明申请
    Wired circuit board and connection structure between wired circuit boards 有权
    有线电路板和有线电路板之间的连接结构

    公开(公告)号：US20070218781A1

    公开(公告)日：2007-09-20

    申请号：US11717706

    申请日：2007-03-14

    申请人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

    发明人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

    IPC分类号： H01R13/514

    CPC分类号： H01R12/592 ,  H01R12/52 ,  H05K1/056 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/10477 ,  H05K2203/041

    摘要： A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer and a conductive pattern formed on the insulating layer, and having a terminal portion for connecting to an external terminal. The terminal portion is disposed at an end portion of the conductive pattern, supported on the insulating layer, and exposed from the metal supporting layer to have an end surface thereof used as a point of contact with the external terminal.

    摘要翻译： 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电图案，并且具有用于连接到外部端子的端子部分。 端子部分设置在导电图案的端部，被支撑在绝缘层上，并从金属支撑层露出，使其端面用作与外部端子的接触点。

    Manufacturing method of printed circuit board
    7.
    发明授权
    Manufacturing method of printed circuit board 有权
    印刷电路板的制造方法

    公开(公告)号：US08105644B2

    公开(公告)日：2012-01-31

    申请号：US12043460

    申请日：2008-03-06

    申请人： Takahiko Yokai

    发明人： Takahiko Yokai

    IPC分类号： B05D5/12 ,  B05D5/00

    CPC分类号： H05K3/1225 ,  H05K3/3484

    摘要： A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through the openings. A recess that is inwardly bent is formed in each of the openings of the screen plate.

    摘要翻译： 具有多个开口的筛板被放置在其上形成有多个导电垫的悬置基板上。 导电浆料在筛板的上表面上沿一个方向移动，使得导电浆料通过开口施加到导电垫片上。 在筛板的每个开口中形成向内弯曲的凹部。

    Underlay substrate, screen printing method and manufacturing method of printed circuit substrate
    8.
    发明授权
    Underlay substrate, screen printing method and manufacturing method of printed circuit substrate 有权
    衬底基板，丝网印刷法及印刷电路基板的制造方法

    公开(公告)号：US07851013B2

    公开(公告)日：2010-12-14

    申请号：US12043412

    申请日：2008-03-06

    申请人： Takahiko Yokai

    发明人： Takahiko Yokai

    IPC分类号： H05K3/30 ,  H05K3/10 ,  B05C17/06

    CPC分类号： H05K3/1216 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2203/0165 ,  H05K2203/082 ,  Y10T29/49155 ,  Y10T428/24273

    摘要： A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate.

    摘要翻译： 具有相同尺寸的多个通孔形成在底层基板中。 多个贯通孔的位置根据基板的形状适当设定。 具体而言，在底板对应区域中，当底板和底层基板彼此重叠时，与衬底基板的基板的端部空白区域重叠，形成相同数量的通孔。 此外，在底衬底基板的空白对应区域中的与底板的空白区域重叠的部分除外的端部坯料对应区域之间的部分以相等的间隔形成通孔。

    Wired circuit board and producing method thererof
    10.
    发明申请
    Wired circuit board and producing method thererof 有权
    有线电路板及其制造方法

    公开(公告)号：US20090008137A1

    公开(公告)日：2009-01-08

    申请号：US12216511

    申请日：2008-07-07

    申请人： Takahiko Yokai ,  Toshiki Naito

    发明人： Takahiko Yokai ,  Toshiki Naito

    IPC分类号： H05K1/00 ,  H05K3/00

    CPC分类号： H05K1/05 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/0723 ,  Y10T29/49124

    摘要： A wired circuit board includes a metal supporting board having a depressed portion, a conductive portion embedded in the depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wired formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.

    摘要翻译： 布线电路板包括具有凹陷部分的金属支撑板，嵌入在凹陷部分中的导电部分，并且由具有比金属支撑板导电性高的材料形成的导电部分形成在金属支撑板上的绝缘层， 覆盖导电部分，并且以互相间隔的关系形成在绝缘层上以与导电部分相对的多个布线。