公开(公告)号：US06474538B1

公开(公告)日：2002-11-05

申请号：US09691247

申请日：2000-10-19

申请人： Takahiro Yonezawa ,  Akihiro Yamamoto ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka ,  Masahiko Hashimoto

发明人： Takahiro Yonezawa ,  Akihiro Yamamoto ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka ,  Masahiko Hashimoto

IPC分类号： B23K3102

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00015

摘要： A higher speed moving device moves a capillary at high speed. A low inertial moving and pressing device moves and presses the capillary with low inertia. The high speed motion, and the moving and pressing motion with the low inertia are carried out independently of each other. Thus, an inertia at the low inertial moving and pressing device is reduced, whereby an impact force when a melt ball is driven by the low inertial moving and pressing device into contact with an electrode of a semiconductor integrated circuit is restricted, thus enabling stable formation for minute bumps. On the other hand, operations other than pressing the melt ball to the electrode and joining the melt ball are conducted by driving the capillary by the higher speed moving device, so that productivity is improved.

摘要翻译： 高速移动装置高速移动毛细管。 低惯性移动和挤压装置以低惯性运动并按压毛细管。 高速运动以及具有低惯量的移动和按压运动彼此独立地进行。 因此，在低惯性运动和加压装置处的惯性减小，由此熔融球被低惯性运动和加压装置驱动与半导体集成电路的电极接触的冲击力受到限制，从而能够稳定地形成 微小的颠簸。 另一方面，通过用高速移动装置驱动毛细管来进行将熔融球压入电极并接合熔融球的操作，从而提高生产率。

公开(公告)号：US06680221B2

公开(公告)日：2004-01-20

申请号：US10267668

申请日：2002-10-10

申请人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka ,  Satoshi Horie

发明人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka ,  Satoshi Horie

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/75 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A bare chip mounting method includes: a dicing step for dividing a semiconductor wafer into individual IC chips while the semiconductor wafer is being attached to a carrier; a washing step for washing the diced semiconductor wafer; a bump-bonding for carrying the washed semiconductor wafer to an assembly process while the semiconductor wafer is being attached to the carrier so as to form a bump on an electrode pad of the wafer; and a mounting step for mounting each of the IC chips, on which the bump is formed, onto a circuit formation body.

摘要翻译： 裸芯片安装方法包括：切割步骤，用于在将半导体晶片附着到载体上的同时将半导体晶片分成单独的IC芯片; 用于洗涤切割的半导体晶片的洗涤步骤; 用于在将半导体晶片附着到载体上时将用于将洗涤的半导体晶片携带到组装过程的凸块接合，以在晶片的电极焊盘上形成凸块; 以及安装步骤，用于将形成有凸块的每个IC芯片安装到电路形成体上。

公开(公告)号：US06902101B2

公开(公告)日：2005-06-07

申请号：US10294614

申请日：2002-11-15

申请人： Satoshi Horie ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka

发明人： Satoshi Horie ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tetsuya Tokunaga ,  Tatsuo Sasaoka

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L21/607 ,  B23K31/00 ,  B23K31/02 ,  B23K37/00

CPC分类号： B23K20/007 ,  H01L24/11 ,  H01L24/12 ,  H01L24/45 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/20308 ,  H01L2924/20309 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752

摘要： In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.

摘要翻译： 在用于在IC上形成凸块的凸块接合技术中，包括在从毛细管突出的金线的尖端处形成球，并且通过从超声波头通过毛细管施加超声波振动来提供金属对金属接头，同时 将球压在IC上的焊盘部分上，通过以130至320kHz的范围内，更优选在170至270kHz的范围内施加超声波振动来提供金属对金属接头，并且大多数 优选在室温和大气压下以230±10kHz的频率进行。 因此，在良好的接合状态下，在具有低耐热温度的IC上形成凸块，并且在没有给周围环境造成热的影响的情况下形成具有良好位置精度的凸块。

公开(公告)号：US06712111B2

公开(公告)日：2004-03-30

申请号：US10094773

申请日：2002-03-11

申请人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka

发明人： Tetsuya Tokunaga ,  Takahiro Yonezawa ,  Hiroyuki Kiyomura ,  Tatsuo Sasaoka

IPC分类号： B23B3100

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T156/12 ,  H01L2224/48 ,  H01L2924/00

摘要： A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.

摘要翻译： 使用具有在环的下侧延伸的片材的保护环的载体工具，使半导体晶片粘附到片材上，被保护环包围的半导体晶片从容器装置承载到 粘结阶段。 在接合台上进行接合，并且将晶片进行到另一容器装置，从而避免了晶片的损坏。

公开(公告)号：US6129203A

公开(公告)日：2000-10-10

申请号：US29391

申请日：1998-02-27

申请人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenichi Nishino ,  Kenji Takahashi ,  Naomi Kainou

发明人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenichi Nishino ,  Kenji Takahashi ,  Naomi Kainou

IPC分类号： H01L21/60 ,  H05K13/04 ,  H05K13/08 ,  B65G23/00

CPC分类号： H05K13/0486

摘要： In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.

摘要翻译： PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102（e）1998年2月27日PCT 1997年7月2日PCT公布。 公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中，提供了一种IC去除装置，通过该IC去除装置，尽管它们的无缺陷已被识别出被错误地去除的IC（4）可以以这样的方式被去除 连续排列而不会在表面上划伤而不会导致静电破坏。 此外，该器件允许容易地目视检查IC的目的是重新使用。 该装置包括用于承载IC（4）的玻璃板（2）和用于以固定角度旋转该玻璃板（2）的机构，由此如果发生识别错误，则吸入IC（4）的接合头（1） 从而移动到玻璃板（2）上的IC去除位置，然后降低直到IC（4）接触玻璃板（2），从而去除IC（4）。 结果，IC（4）可以排成一行而不会在表面上划伤而不会引起静电破坏，从而允许容易地目视检查IC以便重新使用。

公开(公告)号：US06647616B1

公开(公告)日：2003-11-18

申请号：US09446031

申请日：1999-12-15

申请人： Nobuya Matsumura ,  Hiroyuki Kiyomura ,  Kenichi Nishino ,  Kenji Takahashi ,  Shinji Kanayama

发明人： Nobuya Matsumura ,  Hiroyuki Kiyomura ,  Kenichi Nishino ,  Kenji Takahashi ,  Shinji Kanayama

IPC分类号： B23P2100

CPC分类号： H01L21/67144 ,  H01L21/67763 ,  H01L21/67769 ,  H05K13/021 ,  Y10T29/53174 ,  Y10T29/53313 ,  Y10T29/53317

摘要： A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.

摘要翻译： 公开了一种凸块焊接单元，其包括用于分配托盘的新颖的存储，输送和馈送系统，其将IC芯片保持在凸块接合单元的各种操作。 凸块接合单元包括将托盘从空堆栈传送到全堆叠的第一和第二托盘存储和进给装置，反之亦然，以及用于拾取IC芯片而没有形成凸块的转移头，并将IC芯片移动到凸块形成 位置，并且用于拾取IC芯片，其上形成有凸块并将IC芯片移动到存储位置。 凸块接合单元还包括用于在IC芯片上形成凸块的凸块形成单元。 每个托盘存储装置包括一个托架，该托架垂直移动以定位托盘堆叠;托盘托架，其与托架配合以支撑相应堆叠的托盘中的最下托盘;以及托盘托架，用于支撑和释放由托盘支撑的托盘 接收器。

公开(公告)号：US06467158B1

公开(公告)日：2002-10-22

申请号：US09122901

申请日：1998-07-27

申请人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenji Takahashi ,  Hiroshi Nasu

发明人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenji Takahashi ,  Hiroshi Nasu

IPC分类号： H05K330

CPC分类号： H05K13/0452 ,  H05K13/0409 ,  H05K13/041 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A component feeder including a rotary mechanism 31 which is mounted on a turning mechanism 17 for turning the suction nozzle 3 and causes the suction nozzle 3 to rotate around its axis line A, a detector 7 for detecting an amount of displacement the component 2 in rotating direction around the axis line A of the suction nozzle 3, and a controller 32 which controls the suction nozzle 3 such as to rotate at a necessary angle around its axis line A before picking up the component 2 in accordance with displacement of the component 2 in rotating direction around the axis line A.

摘要翻译： 一种部件供给器，包括旋转机构31，该旋转机构31安装在转动机构17上，用于转动吸嘴3并使吸嘴3围绕其轴线A旋转;检测器7，用于检测旋转中的部件2的位移量 方向围绕吸嘴3的轴线A，以及控制器32，其控制吸嘴3，以便在根据部件2的位移拾取部件2之前围绕其轴线A旋转必要的角度 旋转方向围绕轴线A.