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公开(公告)号：US4809058A
公开(公告)日：1989-02-28
申请号：US941812
申请日：1986-12-15
申请人： Takao Funamoto , Ryoichi Kajiwara , Mituo Katou , Takeshi Matsuzaka , Tomohiko Shida , Hiroshi Wachi , Kazuya Takahashi , Masatoshi Watanabe , Minoru Yamada , Keiichirou Nakanishi , Katuo Sugawara
发明人： Takao Funamoto , Ryoichi Kajiwara , Mituo Katou , Takeshi Matsuzaka , Tomohiko Shida , Hiroshi Wachi , Kazuya Takahashi , Masatoshi Watanabe , Minoru Yamada , Keiichirou Nakanishi , Katuo Sugawara
IPC分类号： H01L23/473 , H01L23/538 , H05K1/02 , H05K1/03 , H05K7/20 , H01L23/02 , H01L25/04 , H01L39/02
CPC分类号： H05K1/0373 , H01L23/473 , H01L23/5383 , H01L23/5385 , H05K1/0272 , H01L2924/0002 , H05K2201/0209 , H05K2201/0251 , H05K2201/064
摘要： An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.
摘要翻译： 一种集成电路装置，其特征在于，在其一面上安装有集成电路芯片的布线基板，与所述布线基板的另一面接触而形成的叠层结构的电源基板，通过交替层叠多个馈电导体层 导电金属和多个电绝缘材料的电绝缘层，并且将层叠层结合在一起;将布线基板和电源基板彼此电连接的装置，以及至少插入至少 馈电导体层或电绝缘层，并且适于将发生在电源基板中的热辐射到其外部。 该集成电路装置具有显着高的散热效率的电源基板，并且适合用作集成电路装置，其中集成电路芯片以高密度安装在其布线基板上。
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2.发明授权Sealed-type liquid cooling device with expandable bellow for semiconductor chips 失效用于半导体芯片的可膨胀波纹管的密封式液体冷却装置
公开(公告)号：US4740866A
公开(公告)日：1988-04-26
申请号：US843623
申请日：1986-03-25
申请人： Ryoichi Kajiwara , Takao Funamoto , Mitsuo Katoo , Tomohiko Shida , Takeshi Matsuzaka , Hiroshi Wachi , Kazuya Takahashi
发明人： Ryoichi Kajiwara , Takao Funamoto , Mitsuo Katoo , Tomohiko Shida , Takeshi Matsuzaka , Hiroshi Wachi , Kazuya Takahashi
IPC分类号： H01L23/473 , H01L23/433 , H05K7/20
CPC分类号： H01L23/4336 , H01L23/4332 , H01L24/32 , H01L2224/73253
摘要： A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.
摘要翻译： 半导体模块冷却结构包括具有冷却流体流过的通道的壳体; 冷却流体从所述壳体供给到所述冷却块，并且在所述底部具有电绝缘层并通过所述电绝缘层与半导体芯片组合; 以及连接在壳体和冷却块之间的波纹管。 冷却流体通过波纹管供应到冷却块。 波纹管形成为使得多个大致平面的环状金属板被层压，压制，扩散，接合，然后进行拉伸和模制。
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公开(公告)号：US4996589A
公开(公告)日：1991-02-26
申请号：US258609
申请日：1988-10-17
申请人： Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
发明人： Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
IPC分类号： H01L23/433
CPC分类号： H01L23/433 , H01L23/4332 , H01L2224/16 , H01L2224/48247 , H01L2224/73253 , H01L24/48 , H01L2924/00014 , H01L2924/01068 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181
摘要： A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.
摘要翻译： 多个LSI芯片（9）安装在布线基板（12）上。 冷却元件（68）包括壳体（1），波纹管（2）和用于引入冷却介质的冷却板（6）。 冷却元件通过低熔点焊料与LSI芯片连接，同时冷却板通过与冷却板连接的裙部（5）连接到布线基板，并且还通过一个 低熔点焊料。
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公开(公告)号：US5560764A
公开(公告)日：1996-10-01
申请号：US514763
申请日：1995-08-14
申请人： Hiroshi Wachi , Yutaka Otani
发明人： Hiroshi Wachi , Yutaka Otani
CPC分类号： C23C18/44
摘要： The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of prated areas. The electroless gold plating solution according to the invention contains 2-20 g/l of dimethylamine as amine group.
摘要翻译： 本发明提供了一种无电镀金镀液，其将沉积层精确地提供到工件表面上的预定区域上，而不会不期望地涂覆区域。 根据本发明的无电镀金液含有2-20g / l二胺作为胺基。
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公开(公告)号：US4910260A
公开(公告)日：1990-03-20
申请号：US254729
申请日：1988-10-07
申请人： Hiroshi Wachi , Takeo Kaneko
发明人： Hiroshi Wachi , Takeo Kaneko
摘要： A vulcanizable fluororubber composition which comprises:(a) a fluorine-containing elastomeric copolymer of vinylidene fluoride with at least one other ethylenically unsaturated monomer copolymerizable therewith;(b) an organic peroxide;(c) a polyfunctional compound;(d) at least one member selected from the group consisting of bivalent metal hydroxides and bivalent metal oxides; and(e) an organic base.
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公开(公告)号：US4645799A
公开(公告)日：1987-02-24
申请号：US788579
申请日：1985-10-17
申请人： Hiroshi Wachi , Seitoku Kaya , Gen Kojima
发明人： Hiroshi Wachi , Seitoku Kaya , Gen Kojima
IPC分类号： C08K5/17 , C08F8/00 , C08K5/49 , C08L1/00 , C08L27/00 , C08L27/12 , C08L27/14 , C08L27/16 , C08F14/00
CPC分类号： C08F8/26 , C08F2800/10 , C08F2810/30
摘要： A curable composition comprising an elastomeric vinylidene fluoride copolymer, an organic peroxide and a vulcanization accelerator, characterized in that said copolymer contains unsaturated bonds introduced by reacting an untreated elastomeric vinylidene fluoride copolymer dispersed in an aqueous medium, with an aqueous alkaline solution containing an onium compound.
摘要翻译： 一种包含弹性偏氟乙烯共聚物，有机过氧化物和硫化促进剂的可固化组合物，其特征在于所述共聚物包含通过使分散在水性介质中的未处理的弹性偏氟乙烯共聚物与含有鎓化合物的碱性水溶液反应而引入的不饱和键 。
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公开(公告)号：US4280137A
公开(公告)日：1981-07-21
申请号：US005075
申请日：1979-01-22
申请人： Eiji Ashida , Masayasu Nihei , Hiroshi Wachi , Akira Sato , Satoshi Kokura
发明人： Eiji Ashida , Masayasu Nihei , Hiroshi Wachi , Akira Sato , Satoshi Kokura
CPC分类号： G06T1/0014 , B23K9/0956 , B23K9/127
摘要： Disclosed is a method and apparatus for automatically controlling arc welding, wherein pieces of optical information provided by at least two bands of different wavelengths of light radiated from a weld area being arc-welded under predetermined welding conditions are alternately picked up by an optical device to extract various weld factors representing the actual status of the weld area from these pieces of optical information, and the extracted weld factors representing the actual status of the weld area are compared with the desired values of the weld factors representing the desired status of the weld area to compute the error or errors of the welding conditions, so that the welding conditions can be corrected on the basis of the detected error or errors of the welding conditions, whereby the weld factors can be controlled to the desired values.
摘要翻译： 公开了一种用于自动控制电弧焊接的方法和装置，其中由在预定焊接条件下被焊接的焊接区域辐射的不同波长的光的至少两个带提供的光信息由光学装置交替拾取， 从这些光学信息提取表示焊接区域的实际状态的各种焊接因子，将表示焊接区域的实际状态的提取的焊接因子与表示焊接区域的期望状态的焊接因子的期望值进行比较 以计算焊接条件的误差或误差，从而可以基于检测到的焊接条件的误差或误差来校正焊接条件，从而可将焊接因子控制到期望的值。
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公开(公告)号：US20070205109A1
公开(公告)日：2007-09-06
申请号：US11711516
申请日：2007-02-27
申请人： Shingo Watanabe , Junji Ohnishi , Hiroshi Wachi , Takayuki Sone
发明人： Shingo Watanabe , Junji Ohnishi , Hiroshi Wachi , Takayuki Sone
IPC分类号： C25D3/50
摘要： The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.
摘要翻译： 本发明提供一种能够形成钯电镀膜的电镀液，其能够进一步提高由镀镍膜，镀钯膜和镀金膜构成的组合物的表面处理中的焊料特性， 金属如铜。 在含有可溶性钯盐和含有锗的液体组合物的导电盐的本发明的钯电镀溶液中，根据钯的还原值，可溶性钯盐的量为0.1g / l至50g / l 金属，导电盐的量为10g / l至400g / l，锗的量为0.1mg / l至1000mg / l。
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公开(公告)号：US20050077826A1
公开(公告)日：2005-04-14
申请号：US10924777
申请日：2004-08-25
IPC分类号： B32B7/02 , B32B7/12 , B32B17/06 , B32B17/10 , B32B27/08 , B32B27/36 , B32B27/40 , C03C17/34 , G02B1/10 , H01J5/08 , H01J17/49
CPC分类号： B32B7/02 , B32B7/12 , B32B17/06 , B32B17/10018 , B32B27/08 , B32B27/36 , B32B27/40 , B32B2307/212 , B32B2307/412 , B32B2307/56 , B32B2369/00 , B32B2457/20 , C03C17/3405 , G02B1/105 , G02B1/11 , G02B1/14 , H01J5/08 , H01J11/34
摘要： An impact-resistance film for a flat display panel which is to prevent breakage and scattering of glass of the panel when panel receives an impact and which at the same time makes the weight reduction and thickness reduction possible, is presented. An impact-resistant film 30 for a flat display panel, which is an impact-resistant film to be bonded to a front glass 22 of a flat display panel main body 21 and which comprises a first layer 23 on the front glass side of the flat display panel, made of a transparent synthetic resin having a shear modulus of from 1×103 Pa to 1×106 Pa, a second layer 24 on the viewer's side of the first layer, made of a transparent synthetic resin having a shear modulus of at least 1×108 Pa, and a third layer 25 on the viewer's side of the second layer, made of a transparent synthetic resin having a shear modulus of at least 1×106 Pa and less than 1×108 Pa.
摘要翻译： 提出了一种用于平板显示面板的抗冲击膜，其用于当面板受到冲击时防止面板玻璃的破裂和散射，并且同时使得重量减轻和厚度降低成为可能。 作为与平板显示面板主体21的前玻璃22接合的耐冲击膜的平板显示面板用耐冲击薄膜30，其包括在平板显示面板的前玻璃一侧的第一层23 显示面板，由剪切模量为1×10 3 Pa至1×10 6 Pa的透明合成树脂制成，第一层的观察者侧的第二层24由具有剪切模量的透明合成树脂制成 至少1×10 8 Pa的第三层25和在第二层的观察者侧上的第三层25，其由剪切模量为至少1×10 6 Pa且小于1×10 8 Pa的透明合成树脂制成。
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公开(公告)号：US5614004A
公开(公告)日：1997-03-25
申请号：US514603
申请日：1995-08-14
申请人： Hiroshi Wachi , Yutaka Otani
发明人： Hiroshi Wachi , Yutaka Otani
CPC分类号： C23C18/44
摘要： The present invention provides an electroless gold plating solution which does not precipitate gold at high concentrations of thallium or lead compound, while retaining its effects such as increased deposition rate and larger crystallite sizes in the deposited layer. The electroless gold plating solution according to the invention contains 0.1-10 g/l of a chelating agent, such as diethylenetriaminetetraacetic acid (DTPA), ethylenediaminetetraacetic acid or nitrilotriacetic acid, DTPA being a preferable agent.
摘要翻译： 本发明提供了一种在高浓度的铊或铅化合物中不析出金的化学镀金溶液，同时保留其沉积速率和沉积层中较大的微晶尺寸等效果。 根据本发明的无电镀金液含有0.1-10g / l螯合剂，如二亚乙基三胺四乙酸（DTPA），乙二胺四乙酸或次氮基三乙酸，DTPA是优选的试剂。
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