摘要:
A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.
摘要:
There is provided a copper foil with an insulating adhesive which is excellent in that an insulating adhesive layer has low dieletric constant, low dieletric loss tangent and high adhering force at a normal temperature and a high temperature, and steps for manufacturing a multilayer printed circuit board can be shortened due to the presence of a copper foil on which a circuit can be formed by etching or the like. An insulating adhesive composition containing as an essential component an organic compound having at least two alkenyl groups having the reactivity with a SiH group in one molecule, and a silicon compound containing at least two SiH groups in one molecule and a copper foil are incorporated.
摘要:
Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.
摘要:
The object of the invention is to solve a problem of bending of laminate caused by hardening contraction of epoxy resin that has been a subject in laminate used conventional epoxy resinous composition in laminate of two or more than two layers used for electric and electronic parts, and to provide a novel laminate obtaining excellent adhesive property and heat resistant property, and exhibiting no bending. The inventive laminate achieving the above object comprises laminating at least the following two components (a) and (b): (a) resin composition comprising thermosetting resin composed of imide carbonate synthesized by reacting cyanate resin and compound which containing at least 1 or more than 1 phenolic hydroxyl, and epoxy resin (b) heat resistant resin obtaining glass transition temperature of 150.degree. C. or more than 150.degree. C. and thermal expansion coefficient of 0.4 to 3.8.times.10.sup.-5 cm/cm/.degree.C. at the temperature of 20.degree. (ordinary temperature) to 150.degree. C. The inventive thermosetting resin composition has been consummated by converting cyanate resin into imide carbonate under the presence of epoxy resin.
摘要:
A solid polymer electrolyte membrane and a catalytic layer are properly assembled even when the solid polymer electrolyte membrane and an ion exchange resin in the catalytic layer are formed of different materials. In a fuel cell, a solid polymer electrolyte membrane 20 is provided with a first solid polymer electrolyte membrane 200, and second solid polymer electrolyte membranes 202 and 204 provided at respective sides thereof. The second solid polymer electrolyte membranes 202 and 204 are formed of the same material as the ion exchange resin (not shown) included in a catalytic layer 26 and a catalytic layer 30.
摘要:
The present invention provides an improved grade of polyimide containing an organic phosphorus compound, a film composed thereof and a method of making the aforementioned film. According to the present invention, it is possible to obtain a polyimide film improved in mechanical strength.
摘要:
The present invention provides a copolyimide characterized in that the copolyimide contains units represented by formulas (I) and (II) ##STR1## (wherein R.sub.0 represents an aromatic tetracarboxylic residue). The polyimide has excellent thermal dimensional stability, and can be fabricated by using conventional inexpensive materials.
摘要:
A heat resistant resin composition comprising a, polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl- amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.
摘要:
The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property.A method for improving adhesive property of polyimide film according to the present invention comprises a combination of steps of;execution of a liquid applying process for treating polyimide film surface by exerting physical mechanical force on said film surface under the condition of that said film surface remains wet with water or organic solvent, or solution of organic solvent or aqueous solution; and execution of a surface treatment process for treating polyimide film surface by performing selected treatment among flame treatment, alkaline treatment, coupling agent treatment or surface treatment by way of projecting grinding material of fine grading onto film surface at high velocity, and said steps are performed in an arbitrary order. For example, using a surface treating device 10 shown in FIG. 1, consecutive execution of a surface treatment process for treating film surface, a liquid applying process and a drying process is realized by that polyimide film 22 is run from a feeding device 18 to a winding device 20.
摘要:
A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.