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135 条记录 (耗时 0.037 秒)

    Copper foil with insulating adhesive
    2.
    发明授权
    Copper foil with insulating adhesive 失效
    铜箔带绝缘胶

    公开(公告)号：US06773809B1

    公开(公告)日：2004-08-10

    申请号：US09707882

    申请日：2000-11-08

    申请人： Takashi Itoh ,  Shoji Hara ,  Hirosaku Nagano

    发明人： Takashi Itoh ,  Shoji Hara ,  Hirosaku Nagano

    IPC分类号： B32B712

    CPC分类号： H05K3/4655 ,  B32B7/12 ,  C09J183/14 ,  H05K3/4652 ,  H05K2201/0162 ,  H05K2201/0358 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2883

    摘要： There is provided a copper foil with an insulating adhesive which is excellent in that an insulating adhesive layer has low dieletric constant, low dieletric loss tangent and high adhering force at a normal temperature and a high temperature, and steps for manufacturing a multilayer printed circuit board can be shortened due to the presence of a copper foil on which a circuit can be formed by etching or the like. An insulating adhesive composition containing as an essential component an organic compound having at least two alkenyl groups having the reactivity with a SiH group in one molecule, and a silicon compound containing at least two SiH groups in one molecule and a copper foil are incorporated.

    摘要翻译： 提供了一种具有绝缘粘合剂的铜箔，其绝缘粘合剂层具有低常压，高温下的低缺陷常数，低损耗切线和高粘附力，以及用于制造多层印刷电路板的步骤 可以由于存在可以通过蚀刻等形成电路的铜箔而被缩短。一种绝缘粘合剂组合物，其含有具有至少两个具有与SiH基反应性的烯基的有机化合物作为必要成分 一分子和一分子中含有至少两个SiH基团的硅化合物和铜箔。

    Polyimide film and process for producing the same
    4.
    发明授权
    Polyimide film and process for producing the same 有权
    聚酰亚胺膜及其制造方法

    公开(公告)号：US07247367B2

    公开(公告)日：2007-07-24

    申请号：US10467210

    申请日：2002-02-20

    申请人： Masaru Nishinaka ,  Takashi Itoh

    发明人： Masaru Nishinaka ,  Takashi Itoh

    IPC分类号： B32B27/32 ,  B32B27/00 ,  C08G69/26

    CPC分类号： C08G73/1007 ,  B29C41/003 ,  B29C41/12 ,  B29K2079/08 ,  B29K2105/0073 ,  C09D179/08 ,  Y10T428/31721

    摘要： The polyimide film of the present invention is produced in the following manner: polyamic acid made of a combination of a specific acid anhydride constituent and a specific diamine constituent are heated under a low-pressure circumstance for heat imidation, and the obtained imide is dissolved again in a solvent to be polyimide solution, then the polyimide solution is formed to be a film. In this manner, it is possible to provide a polyimide film essentially transparent and colorless, and has sufficient toughness to prevent occurrences of a crack or a break when the film is folded and creased by hand.

    摘要翻译： 本发明的聚酰亚胺膜以下列方式制造：在特定酸酐组分和特定二胺组分的组合下制备的聚酰胺酸在低压环境下加热以进行酰亚胺化，所得酰亚胺再次溶解 在作为聚酰亚胺溶液的溶剂中，将聚酰亚胺溶液形成为膜。 以这种方式，可以提供基本上透明和无色的聚酰亚胺膜，并且当薄膜折叠和折皱时具有足够的韧性以防止裂纹发生或断裂。

    Laminate
    6.
    发明授权
    Laminate 有权

    公开(公告)号：US07101619B2

    公开(公告)日：2006-09-05

    申请号：US11134655

    申请日：2005-05-20

    申请人： Masaru Nishinaka ,  Takashi Itoh ,  Kanji Shimo-Ohsako

    发明人： Masaru Nishinaka ,  Takashi Itoh ,  Kanji Shimo-Ohsako

    IPC分类号： B32B7/12 ,  B32B15/08

    CPC分类号： B32B15/08 ,  B32B27/34 ,  H05K1/0346 ,  H05K3/025 ,  H05K3/146 ,  H05K3/181 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10T428/24917 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/2804 ,  Y10T428/31678 ,  Y10T428/31681

    摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.

    Laminate
    7.
    发明授权
    Laminate 有权
    层压板

    公开(公告)号：US06911265B2

    公开(公告)日：2005-06-28

    申请号：US10169327

    申请日：2001-10-26

    申请人： Masaru Nishinaka ,  Takashi Itoh ,  Kanji Shimo-Ohsako

    发明人： Masaru Nishinaka ,  Takashi Itoh ,  Kanji Shimo-Ohsako

    IPC分类号： B32B15/08 ,  B32B27/34 ,  H05K1/03 ,  H05K3/02 ,  H05K3/14 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46 ,  B32B7/12

    CPC分类号： B32B15/08 ,  B32B27/34 ,  H05K1/0346 ,  H05K3/025 ,  H05K3/146 ,  H05K3/181 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10T428/24917 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/2804 ,  Y10T428/31678 ,  Y10T428/31681

    摘要： The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 μm. The present invention also relates to a laminate comprising a metal layer having a thickness of at most 5 μm on one or both faces of a synthetic resin film, wherein the synthetic resin film is a polyimide film obtained by immersing a partially imidized or partially dried poly(amide acid) film in a solution of a compound containing at least one element selected from the group consisting of aluminum, silicon, titanium, manganese, iron, cobalt, copper, zinc, tin, antimony, lead, bismuth and palladium or by applying the solution to the film, and then completely drying and imidizing the poly(amide acid) film, the resulting polyimide film containing at least one of the elements.

    摘要翻译： 本发明提供了一种用于印刷布线基板和多层印刷布线板的层压板，其具有高耐热性，窄间距布线图案，具有小直径的通孔，具有均匀厚度的绝缘层和金属层与 合成树脂膜，有助于电子设备的小型化，高性能和功能改进。 本发明涉及一种金属层压体，其包括层压在合成树脂膜的一面或两面上的金属层，其中该金属层是厚度至多为5um的金属箔。 本发明还涉及一种层压体，其包括在合成树脂膜的一面或两面上具有至多5um厚度的金属层，其中所述合成树脂膜是通过将部分酰亚胺化或部分干燥的聚 （酰胺酸）膜在含有选自铝，硅，钛，锰，铁，钴，铜，锌，锡，锑，铅，铋和钯中的至少一种元素的化合物的溶液中，或通过应用 对该膜的溶液，然后完全干燥和酰亚胺化聚（酰胺酸）膜，所得聚酰亚胺膜含有至少一种元素。

    Resin composition
    10.
    发明授权
    Resin composition 失效
    树脂组成

    公开(公告)号：US07115681B2

    公开(公告)日：2006-10-03

    申请号：US10482897

    申请日：2002-07-08

    申请人： Kanji Shimo-Ohsako ,  Takashi Itoh ,  Masaru Nishinaka ,  Shigeru Tanaka ,  Mutsuaki Murakami

    发明人： Kanji Shimo-Ohsako ,  Takashi Itoh ,  Masaru Nishinaka ,  Shigeru Tanaka ,  Mutsuaki Murakami

    IPC分类号： C08L79/08

    CPC分类号： H05K1/0346 ,  C08G59/08 ,  C08G59/5033 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C08L2666/22

    摘要： The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.

    摘要翻译： 本发明提供一种包含含有特定二酐和二胺的聚酰亚胺和环氧树脂的树脂组合物。 树脂组合物可以在相对较低的温度下结合，具有优异的耐热性，粘附性，耐焊接性和PCT后剥离强度的保持率。 通过使用包含该树脂组合物的金属箔的聚酰亚胺树脂片或聚酰亚胺树脂片根据半添加方法形成具有良好布线形状，电路牢固牢固和绝缘电阻高的印刷线路板的电路 在微电路空间可以获得。