公开(公告)号：US4406698A

公开(公告)日：1983-09-27

申请号：US256120

申请日：1981-04-21

申请人： Takashi Yebisuya ,  Masao Yamamoto ,  Mituo Kawai ,  Koichi Tajima

发明人： Takashi Yebisuya ,  Masao Yamamoto ,  Mituo Kawai ,  Koichi Tajima

IPC分类号： C22C38/58 ,  C22C38/42 ,  C22C38/48

CPC分类号： C22C38/58

摘要： Martensitic stainless cast steel suitable for use as turbine elements for water power plants having high cavitation erosion resistance and consisting essentially of carbon of 0.1 wt % or less, silicon of 1.0 wt % or less, manganese of 2.0-9.0 (exclusive of 2.0) wt %, nickel of 0.5-8.0 wt %, chromium of 11.0-14.0 wt %, and the balance of essentially iron.

摘要翻译： 马氏体不锈钢铸钢适用于具有高抗气蚀侵蚀性的水力发电厂的涡轮机元件，主要由0.1重量％以下的碳组成，1.0重量％以下的硅，2.0-9.0重量％的锰（不包括2.0重量％） ％，镍为0.5-8.0重量％，铬为11.0-14.0重量％，余量为铁。

公开(公告)号：US4493733A

公开(公告)日：1985-01-15

申请号：US536236

申请日：1983-09-28

申请人： Masao Yamamoto ,  Takashi Yebisuya ,  Mituo Kawai ,  Koichi Tajima

发明人： Masao Yamamoto ,  Takashi Yebisuya ,  Mituo Kawai ,  Koichi Tajima

IPC分类号： C22C38/38 ,  H02K3/42 ,  H02K3/51 ,  C22C38/58

CPC分类号： C22C38/38

摘要： Disclosed is a corrosion-resistant non-magnetic steel comprising, in terms of weight percentage, 0.4% or less of carbon, above 0.3% but up to 1% of nitrogen, 2% of less of silicon, 12 to 20% of chromium, 13 to 25% of manganese and the balance consisting substantially of iron, the total content of the chromium and manganese being at least 30%.

摘要翻译： 公开了一种耐腐蚀非磁性钢，其包括以重量百分比计，含有0.4％或更少的碳，高于0.3％但高达1％的氮，2％的少量硅，12至20％的铬， 13至25％的锰，余量基本上由铁组成，铬和锰的总含量至少为30％。

公开(公告)号：US4431446A

公开(公告)日：1984-02-14

申请号：US274481

申请日：1981-06-17

申请人： Masao Yamamoto ,  Takashi Yebisuya ,  Mituo Kawai ,  Kei Honma

发明人： Masao Yamamoto ,  Takashi Yebisuya ,  Mituo Kawai ,  Kei Honma

IPC分类号： B23K35/30 ,  C22C38/58

CPC分类号： C22C38/58 ,  B23K35/3086

摘要： Stainless steel suitable for use as water turbine elements for water power plants having high cavitation erosion resistance, comprised of at least one of either carbon of no more than 0.2 weight percent or nitrogen of 0.02-0.3 weight percent, together with silicon of 2.0 weight percent or less, chromium of 10.0-20.0 weight percent, nickel of 0.5-10.0 weight percent, manganese of over 2.0-20.0 weight percent, and the balance of essentially iron, and in which the ferrite phase has not been formed but where at least either the epsilon phase or the austenite phase has been essentially formed.

摘要翻译： 适用于具有高抗空蚀侵蚀性的水力发电厂的水轮机元件的不锈钢，其包含碳或不超过0.2重量％中的至少一个或0.02-0.3重量％的氮，以及2.0重量％的硅 或更少的铬，10.0-20.0重量％的铬，0.5-10.0重量％的镍，超过2.0-20.0重量％的锰，余量基本上是铁，并且其中铁素体相未形成，但是至少其中 ε相或奥氏体相已基本形成。

公开(公告)号：US4897132A

公开(公告)日：1990-01-30

申请号：US127601

申请日：1987-11-30

申请人： Masao Yamamoto ,  Takashi Yebisuya ,  Osamu Watanabe ,  Masayuki Yamada

发明人： Masao Yamamoto ,  Takashi Yebisuya ,  Osamu Watanabe ,  Masayuki Yamada

IPC分类号： C22C38/00 ,  C22C38/44 ,  C22C38/46 ,  C22C38/54 ,  C22C38/58

CPC分类号： C22C38/44 ,  C22C38/001 ,  C22C38/46

摘要： Disclosed is a heat resistant austenitic cast steel consisting essentially of 0.03 to 0.09% by weight of carbon, 2.0% by weight or less of silicon, 3.0% by weight or less of manganese, 0.11 to 0.30% by weight of nitrogen, 6 to 15% by weight of nickel, 15 to 19.5% by weight of chromium, 0.01 to 1.0% by weight of vanadium, 1 to 5% by weight of molybdenum, and the balance of iron. The heat resistant austenitic cast steel exhibits excellent mechanical properties such as mechanical strength, elongation, reduction of area and fracture time caused by creep fracture, particularly, under high temperatures. If a turbine casing is formed of the cast steel, it is possible to increase the steam temperature and pressure.

摘要翻译： 公开了一种耐热奥氏体铸钢，其基本上由碳组成为0.03〜0.09重量％，硅2.0重量％以下，锰3.0重量％以下，氮0.11〜0.30重量％，氮浓度6〜15 镍，15〜19.5重量％的铬，0.01〜1.0重量％的钒，1〜5重量％的钼，余量的铁。 耐热奥氏体铸钢表现出机械强度，伸长率，由蠕变断裂引起的面积减少和断裂时间等机械特性，特别是在高温下。 如果涡轮机壳由铸钢形成，则可以增加蒸汽的温度和压力。

公开(公告)号：US5821627A

公开(公告)日：1998-10-13

申请号：US962882

申请日：1997-11-05

申请人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

发明人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

IPC分类号： H05K3/32 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/328 ,  H01L2224/1134 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

摘要： An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.

摘要翻译： 电子电路装置包括：基板，形成在基板的表面上的基本上由布线层形成的凸块和基本上由金，铜，锡和铝组成的组中的至少一种金属组成的布线层; 由选自金，铜和铝的至少一种金属和形成在凸块上的微电子元件组成，其中固定相扩散接合至少在布线层和凸块之间或者在 凸块和微电子元件的电极。

公开(公告)号：US5684677A

公开(公告)日：1997-11-04

申请号：US688677

申请日：1996-07-29

申请人： Tatsuro Uchida ,  Takashi Yebisuya ,  Miki Mori ,  Masayuki Saito ,  Takasi Togasaki ,  Yukio Kizaki

发明人： Tatsuro Uchida ,  Takashi Yebisuya ,  Miki Mori ,  Masayuki Saito ,  Takasi Togasaki ,  Yukio Kizaki

IPC分类号： H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K7/02 ,  H05K7/10 ,  H05K1/16

CPC分类号： H05K3/303 ,  H05K3/3442 ,  H01L2224/10165 ,  H01L2224/8114 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2203/0465 ,  H05K2203/0568 ,  H05K2203/167 ,  H05K2203/306 ,  H05K3/3452 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit device comprising a printed wiring board having a major surface and pads provided on the major surface of the printed wiring board, a plurality of electrodes provided partly on at least one major surface of the leadless component and partly on sides of the leadless component, a plurality of bumps provided on the pads, providing a gap between the major surface of the printed wiring board and the major surface of the leadless component, and electrically connecting those parts of the electrodes which are provided on the major surface of the leadless component to the pads, and a plurality of electrically conductive members integral with the bumps, extending from the bumps to those parts of the electrodes which are provided on the sides of the leadless component.

摘要翻译： 一种电子电路装置，包括具有主表面的印刷线路板和设置在印刷线路板的主表面上的焊盘，多个电极部分地设置在无引线元件的至少一个主表面上，部分地设置在无引线元件的侧面上 设置在所述焊盘上的多个凸块，在所述印刷电路板的所述主表面和所述无引线部件的主表面之间提供间隙，以及电连接设置在所述无引线部件的主表面上的所述电极部分 并且与凸块成一体的多个导电部件从凸块延伸到设置在无引线部件的侧面上的电极部分。