公开(公告)号：US5684677A

公开(公告)日：1997-11-04

申请号：US688677

申请日：1996-07-29

申请人： Tatsuro Uchida ,  Takashi Yebisuya ,  Miki Mori ,  Masayuki Saito ,  Takasi Togasaki ,  Yukio Kizaki

发明人： Tatsuro Uchida ,  Takashi Yebisuya ,  Miki Mori ,  Masayuki Saito ,  Takasi Togasaki ,  Yukio Kizaki

IPC分类号： H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K7/02 ,  H05K7/10 ,  H05K1/16

CPC分类号： H05K3/303 ,  H05K3/3442 ,  H01L2224/10165 ,  H01L2224/8114 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2203/0465 ,  H05K2203/0568 ,  H05K2203/167 ,  H05K2203/306 ,  H05K3/3452 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit device comprising a printed wiring board having a major surface and pads provided on the major surface of the printed wiring board, a plurality of electrodes provided partly on at least one major surface of the leadless component and partly on sides of the leadless component, a plurality of bumps provided on the pads, providing a gap between the major surface of the printed wiring board and the major surface of the leadless component, and electrically connecting those parts of the electrodes which are provided on the major surface of the leadless component to the pads, and a plurality of electrically conductive members integral with the bumps, extending from the bumps to those parts of the electrodes which are provided on the sides of the leadless component.

摘要翻译： 一种电子电路装置，包括具有主表面的印刷线路板和设置在印刷线路板的主表面上的焊盘，多个电极部分地设置在无引线元件的至少一个主表面上，部分地设置在无引线元件的侧面上 设置在所述焊盘上的多个凸块，在所述印刷电路板的所述主表面和所述无引线部件的主表面之间提供间隙，以及电连接设置在所述无引线部件的主表面上的所述电极部分 并且与凸块成一体的多个导电部件从凸块延伸到设置在无引线部件的侧面上的电极部分。

公开(公告)号：US5821627A

公开(公告)日：1998-10-13

申请号：US962882

申请日：1997-11-05

申请人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

发明人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

IPC分类号： H05K3/32 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/328 ,  H01L2224/1134 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

摘要： An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.

摘要翻译： 电子电路装置包括：基板，形成在基板的表面上的基本上由布线层形成的凸块和基本上由金，铜，锡和铝组成的组中的至少一种金属组成的布线层; 由选自金，铜和铝的至少一种金属和形成在凸块上的微电子元件组成，其中固定相扩散接合至少在布线层和凸块之间或者在 凸块和微电子元件的电极。

公开(公告)号：US5959363A

公开(公告)日：1999-09-28

申请号：US93728

申请日：1998-06-09

申请人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

发明人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/60 ,  H01L23/28

CPC分类号： H01L23/3135 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.

公开(公告)号：US5864178A

公开(公告)日：1999-01-26

申请号：US580978

申请日：1996-01-03

申请人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

发明人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/60 ,  H01L23/28

CPC分类号： H01L23/3135 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.

摘要翻译： 一种半导体器件，包括布线电路板和通过电路板上的凸块电极安装的半导体芯片，电路板和半导体芯片之间的空间以及半导体芯片的外围被包含填料的树脂封装。 该树脂由设置在位于半导体芯片的最外周上的凸起电极包围的区域中的第一树脂，以及设置在不包围位于半导体芯片的最外周边的凸块电极的区域中的第二树脂构成， 第一和第二树脂在选自填料的含量，最大粒径和平均粒径的至少一个特征中彼此不同。

公开(公告)号：US5448114A

公开(公告)日：1995-09-05

申请号：US389743

申请日：1995-02-15

申请人： You Kondoh ,  Masayuki Saito ,  Takasi Togasaki

发明人： You Kondoh ,  Masayuki Saito ,  Takasi Togasaki

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/10 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/10 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1147 ,  H01L2224/13111 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/351

摘要： A semiconductor device contains a semiconductor chip and a circuit board. The chip has a first surface at which the main region is formed. On the surface, a plurality of chip electrodes and a perimeter electrode surrounding the chip electrodes are formed. Bumps and a wall member made of solder metal are formed on the chip electrodes and frame-shaped electrode, respectively. The circuit board has a first surface facing the first surface of the chip. On the first surface of the circuit board, a plurality of board electrodes and a perimeter electrode are placed so as to correspond to the chip electrodes and the perimeter electrode. In a state where the chip and the board face each other, heat treatment is performed to connect the bumps and wall member to the board simultaneously by reflow. The wall member connects the chip to the board while surrounding the main region and the bumps continuously, to form essentially a closed space between the chip and the board.

摘要翻译： 半导体器件包含半导体芯片和电路板。 芯片具有形成主区域的第一表面。 在表面上，形成有多个芯片电极和围绕芯片电极的周边电极。 在芯片电极和框架状电极上分别形成有由焊料金属制成的凸块和壁构件。 电路板具有面向芯片的第一表面的第一表面。 在电路板的第一表面上，放置多个基板电极和周边电极以对应于芯片电极和周边电极。 在芯片和电路板彼此面对的状态下，进行热处理，以通过回流同时将凸块和壁构件连接到电路板。 壁构件将芯片连接到板上，同时围绕主区域和凸块连续地形成，以在芯片和板之间基本形成封闭空间。