Method of manufacturing natural aging-retardated aluminum alloy sheet
    1.
    发明授权
    Method of manufacturing natural aging-retardated aluminum alloy sheet 失效
    自然老化延迟铝合金板的制造方法

    公开(公告)号:US5460666A

    公开(公告)日:1995-10-24

    申请号:US205623

    申请日:1994-03-02

    IPC分类号: C22C21/06 C22C21/08 C22F1/047

    CPC分类号: C22C21/08 C22F1/047

    摘要: A method manufacturing an aluminum alloy sheet comprising preparing an aluminum alloy ingot essentially consisting of 1.5 to 3.5% by weight of Mg, 0.3 to 1.0% by weight of Cu, 0.05 to 0.6% by weight of Si, and a balance of Al, in which the ratio of Mg/Cu is in the range of 2 to 7, homogenizing the ingot in one step or in multiple steps, performed at a temperature within a range of 400 to 580.degree. C., preparing an alloy sheet having a desired sheet thickness by subjecting the ingot to a hot rolling and a cold rolling, subjecting the alloy sheet to heat treatment including heating the sheet up to a range of 500.degree. to 580.degree. C. at a heating rate of 3.degree. C./sec. or more, keeping it for 0 to 60 seconds at the temperature reached, and cooling it to 100.degree. C. or less at a looking rate of 2.degree. C./sec. or more, and keeping the alloy sheet at a temperature within a range of 180.degree. to 300.degree. C. for 3 to 60 seconds. Thus, a natural aging-retardated aluminum alloy sheet is obtained.

    摘要翻译: 一种制造铝合金板的方法,包括制备基本上由1.5至3.5重量%的Mg,0.3至1.0重量%的Cu,0.05至0.6重量%的Si和余量的Al的铝合金锭 其中Mg / Cu的比例在2〜7的范围内,在400〜580℃的温度范围内进行1步或多步均质化,制备具有所需片材的合金薄片 通过使锭进行热轧和冷轧,使该合金板进行热处理,包括将片材加热至500℃〜580℃的范围,加热速度为3℃/秒。 以上,在达到的温度下保持0〜60秒,并以2℃/秒的倍率冷却至100℃以下。 以上,将合金板保持在180〜300℃的范围内3〜60秒。 因此,获得了自然老化延迟的铝合金板。

    Aluminum alloy material having high strength and excellent formability
    2.
    发明授权
    Aluminum alloy material having high strength and excellent formability 失效
    具有高强度和优异成形性的铝合金材料

    公开(公告)号:US5417919A

    公开(公告)日:1995-05-23

    申请号:US110162

    申请日:1993-08-20

    IPC分类号: C22C21/06 C22C21/08

    CPC分类号: C22C21/06

    摘要: There is provided an aluminum alloy sheet material having high strength as well as excellent formability, which consists essentially, by weight percent, of 4.5 to 6% Mg, 0.0005 to 1% rare earth elements, 0.001 to 0.15% Ti, 0.0001 to 0.004% B, 0.05 to 0.2% Fe, 0.05 to 0.1% Si, 0.0001 to 0.03% Be, and the balance of Al and inevitable impurities. The aluminum alloy sheet material may further contain at least one element selected from the group consisting of 0.05 to 0.3% Cu, 0.1 to 1% Zn and 0.05 to 0.2% Mn, if required.

    摘要翻译: 提供了具有高强度和优异成形性的铝合金板材,其基本上由重量百分比组成为4.5至6%的Mg,0.0005至1%的稀土元素,0.001至0.15%的Ti,0.0001至0.004% B,0.05〜0.2%的Fe,0.05〜0.1%的Si,0.0001〜0.03%的Be,余量的Al和不可避免的杂质。 如果需要,铝合金板材还可以含有选自0.05至0.3%的Cu,0.1至1%的Zn和0.05至0.2%的Mn中的至少一种元素。

    Autorec signal multiplex apparatus, autorec signal multiplex method, program, and recording medium
    4.
    发明授权
    Autorec signal multiplex apparatus, autorec signal multiplex method, program, and recording medium 有权
    自动对准信号多路复用装置,自动对准信号复用方法,程序和记录介质

    公开(公告)号:US07639922B2

    公开(公告)日:2009-12-29

    申请号:US10511831

    申请日:2003-04-14

    IPC分类号: H04N5/93 G11B27/00 H04N5/76

    摘要: An image pick-up apparatus includes an image pick-up device of recording a video to generate a video signal, a photographer indication device of indicating a start of a recording and/or a stop of the recording, an AutoREC signal generation device of generating an AutoREC signal in conjunction with the start of the recording and/or the stop of the recording based on the indication, and an AutoREC signal multiplex device of multiplexing a generated AutoREC signal to a generated video signal.

    摘要翻译: 图像拾取装置包括:用于记录视频以生成视频信号的图像拾取装置,指示开始记录和/或停止记录的拍摄者指示装置;生成 一个AutoREC信号结合记录的开始和/或基于该指示停止记录;以及一个AutoREC信号多路复用装置,将所生成的AutoREC信号复用到所生成的视频信号。

    Lead frame and package of semiconductor device
    5.
    发明申请
    Lead frame and package of semiconductor device 审中-公开
    引线框和封装的半导体器件

    公开(公告)号:US20090243060A1

    公开(公告)日:2009-10-01

    申请号:US12383915

    申请日:2009-03-26

    申请人: Hiroshi Saitoh

    发明人: Hiroshi Saitoh

    IPC分类号: H01L23/495 H01L23/48

    摘要: A lead frame including a stage and a plurality of terminals is embedded in a mold resin including a base portion for mounting a semiconductor chip (e.g. a microphone chip), a peripheral wall disposed in the periphery of the base portion, and an extension portion extended outside of the peripheral wall, thus forming a package base. A plurality of holes is formed in the peripheral wall so as to expose the internal connection surface of the stage and the internal connection surfaces of the terminals. An extension portion of the stage is exposed on the extension portion of the mold resin in which the surfaces of the terminals are embedded. An extension portion (e.g. a brim) of a cover composed of a conductive material is attached to the extension portion of the mold resin of the package base, thus completely producing a semiconductor device.

    摘要翻译: 将包括台架和多个端子的引线框架嵌入到包括用于安装半导体芯片(例如麦克风芯片)的基座部分的设计树脂中,设置在基部周边的周壁和延伸部分延伸 在周壁外部,从而形成包装基底。 在周壁上形成多个孔,以露出台的内部连接表面和端子的内部连接表面。 台架的延伸部分露出在其中嵌入端子表面的模制树脂的延伸部分上。 由导电材料构成的盖的延伸部分(例如边缘)附接到封装基座的模制树脂的延伸部分,从而完全制造半导体器件。

    Physical quantity sensor and manufacturing method therefor
    9.
    发明申请
    Physical quantity sensor and manufacturing method therefor 失效
    物理量传感器及其制造方法

    公开(公告)号:US20070028685A1

    公开(公告)日:2007-02-08

    申请号:US11543034

    申请日:2006-10-05

    IPC分类号: G01P1/02

    摘要: A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.

    摘要翻译: 物理量传感器包括一对物理量传感器芯片,其相对于外部模具封装的底部倾斜,其侧表面各自在厚度方向上倾斜0°至5°的角度并且形成在接近 到物理量传感器芯片的外端。 可以在不使用模具的情况下实现阶段的倾斜,其中吸收装置用于吸收与围绕轴线旋转并且因此相对于规定基座倾斜的阶段相关的规定部分。 在制造中,具有多个引线框架的薄金属板放置在由夹具限定的基座上; 然后,对形成在引线框架之间的中间部分的相交点进行压制,以实现级的倾斜。