摘要:
A method manufacturing an aluminum alloy sheet comprising preparing an aluminum alloy ingot essentially consisting of 1.5 to 3.5% by weight of Mg, 0.3 to 1.0% by weight of Cu, 0.05 to 0.6% by weight of Si, and a balance of Al, in which the ratio of Mg/Cu is in the range of 2 to 7, homogenizing the ingot in one step or in multiple steps, performed at a temperature within a range of 400 to 580.degree. C., preparing an alloy sheet having a desired sheet thickness by subjecting the ingot to a hot rolling and a cold rolling, subjecting the alloy sheet to heat treatment including heating the sheet up to a range of 500.degree. to 580.degree. C. at a heating rate of 3.degree. C./sec. or more, keeping it for 0 to 60 seconds at the temperature reached, and cooling it to 100.degree. C. or less at a looking rate of 2.degree. C./sec. or more, and keeping the alloy sheet at a temperature within a range of 180.degree. to 300.degree. C. for 3 to 60 seconds. Thus, a natural aging-retardated aluminum alloy sheet is obtained.
摘要:
There is provided an aluminum alloy sheet material having high strength as well as excellent formability, which consists essentially, by weight percent, of 4.5 to 6% Mg, 0.0005 to 1% rare earth elements, 0.001 to 0.15% Ti, 0.0001 to 0.004% B, 0.05 to 0.2% Fe, 0.05 to 0.1% Si, 0.0001 to 0.03% Be, and the balance of Al and inevitable impurities. The aluminum alloy sheet material may further contain at least one element selected from the group consisting of 0.05 to 0.3% Cu, 0.1 to 1% Zn and 0.05 to 0.2% Mn, if required.
摘要:
A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.
摘要:
An image pick-up apparatus includes an image pick-up device of recording a video to generate a video signal, a photographer indication device of indicating a start of a recording and/or a stop of the recording, an AutoREC signal generation device of generating an AutoREC signal in conjunction with the start of the recording and/or the stop of the recording based on the indication, and an AutoREC signal multiplex device of multiplexing a generated AutoREC signal to a generated video signal.
摘要:
A lead frame including a stage and a plurality of terminals is embedded in a mold resin including a base portion for mounting a semiconductor chip (e.g. a microphone chip), a peripheral wall disposed in the periphery of the base portion, and an extension portion extended outside of the peripheral wall, thus forming a package base. A plurality of holes is formed in the peripheral wall so as to expose the internal connection surface of the stage and the internal connection surfaces of the terminals. An extension portion of the stage is exposed on the extension portion of the mold resin in which the surfaces of the terminals are embedded. An extension portion (e.g. a brim) of a cover composed of a conductive material is attached to the extension portion of the mold resin of the package base, thus completely producing a semiconductor device.
摘要:
A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.
摘要:
A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned
摘要:
A semiconductor device is produced using a lead frame whose size is smaller than a prescribed center area of a semiconductor chip surrounded by its bonding pads, which are connected with electrodes supported by electrode supports and interconnected with outer frames and an intermediate frame of the lead frame via bonding wires. A series of projections and hollows are formed on the outer frames, wherein the electrode supports are interconnected with the hollows of the outer frames respectively. The semiconductor chip combined with the lead frame, is integrally enclosed in a resin under the condition where only the electrode surfaces are exposed to the exterior, thus forming a resin package. Then, the electrode supports locating the electrodes are cut out and partially removed, so that the electrodes are made electrically independent from each other.
摘要:
A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.
摘要:
The present invention provides an EGR cooler that is easy to manufacture and can accelerate heat exchange. Round in section tubes are plastically deformed in one plane crossing centerlines thereof such that corrugated exhaust gas flow paths are formed inside the tubes.