Ion implantation apparatus
    8.
    发明授权
    Ion implantation apparatus 失效
    离子注入装置

    公开(公告)号:US5025167A

    公开(公告)日:1991-06-18

    申请号:US533769

    申请日:1990-06-06

    摘要: An ion implantation apparatus comprises an ion beam measuring device to measure and analyze the shape of a beam projected on a substrate for ion implantation and the quantity of current obtained by the ion beam, an analyzing slit member having an opening whose width is changeable, which is located in the ion beam track to extract only implantation ions, and a shaping slit member having an opening whose width is changeable, which is located behind the analyzing slit member to determine the shape of the beam to be projected on the substrate for ion implantation, wherein the widths of the openings of the analyzing slit member and the shaping slit member are changed on the basis of the shape of the beam and the quantity of current obtained as a result of the measurement by the ion beam measuring device.

    摘要翻译: 离子注入装置包括离子束测量装置,用于测量和分析投影在用于离子注入的基板上的光束的形状和由离子束获得的电流量,分析狭缝部件,其具有宽度可变的开口, 位于离子束轨道中以仅提取注入离子;以及成形狭缝构件,其具有位于分析狭缝构件后面的宽度可变的开口,以确定要投影到用于离子注入的衬底上的光束的形状 其中分析狭缝部件和成形狭缝部件的开口的宽度基于由离子束测量装置测量的结果获得的光束形状和电流量而改变。

    Method for separating a semiconductor element in a semiconductor element pushing-up device
    9.
    发明授权
    Method for separating a semiconductor element in a semiconductor element pushing-up device 有权
    用于分离半导体元件上推装置中的半导体元件的方法

    公开(公告)号:US06555418B2

    公开(公告)日:2003-04-29

    申请号:US09735617

    申请日:2000-12-14

    IPC分类号: H01L2148

    摘要: A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.

    摘要翻译: 一种用于将由粘合剂附着的半导体元件与芯片接合装置中的半导体元件上推装置的粘合片从粘合片分离的上推销,其中该半导体元件从粘合片的后表面侧向上推 包括当施加用于从粘合片的后表面侧推上半导体元件的上推压力时,具有用于施加上推压力的形状的末端部分,其中粘合片和粘合剂的厚度保持恒定, 以及用于支撑前端部的基部。

    Push-up pin of a semiconductor element pushing-up device, and a method for separating
    10.
    发明授权
    Push-up pin of a semiconductor element pushing-up device, and a method for separating 失效
    半导体元件上推装置的上推销以及分离方法

    公开(公告)号:US06201306B1

    公开(公告)日:2001-03-13

    申请号:US08760117

    申请日:1996-12-03

    IPC分类号: H01L2348

    摘要: A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.

    摘要翻译: 一种用于将由粘合剂附着的半导体元件与芯片接合装置中的半导体元件上推装置的粘合片从粘合片分离的上推销,其中该半导体元件从粘合片的后表面侧向上推 包括当施加用于从粘合片的后表面侧推上半导体元件的上推压力时,具有用于施加上推压力的形状的末端部分,其中粘合片和粘合剂的厚度保持恒定, 以及用于支撑前端部的基部。