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公开(公告)号：US20120223444A1
公开(公告)日：2012-09-06
申请号：US13449484
申请日：2012-04-18
CPC分类号： H01L24/83 , H01L21/4807 , H01L23/13 , H01L23/15 , H01L23/315 , H01L23/3677 , H01L23/4334 , H01L23/49506 , H01L23/49531 , H01L23/49822 , H01L23/50 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15192 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19015 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.
摘要翻译： 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。
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公开(公告)号：US08207607B2
公开(公告)日：2012-06-26
申请号：US12314345
申请日：2008-12-09
CPC分类号： H01L24/83 , H01L21/4807 , H01L23/13 , H01L23/15 , H01L23/315 , H01L23/3677 , H01L23/4334 , H01L23/49506 , H01L23/49531 , H01L23/49822 , H01L23/50 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15192 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19015 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.
摘要翻译： 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。
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公开(公告)号：US20090152714A1
公开(公告)日：2009-06-18
申请号：US12314345
申请日：2008-12-09
CPC分类号： H01L24/83 , H01L21/4807 , H01L23/13 , H01L23/15 , H01L23/315 , H01L23/3677 , H01L23/4334 , H01L23/49506 , H01L23/49531 , H01L23/49822 , H01L23/50 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15192 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19015 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.
摘要翻译： 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。
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公开(公告)号：US08749055B2
公开(公告)日：2014-06-10
申请号：US13449484
申请日：2012-04-18
CPC分类号： H01L24/83 , H01L21/4807 , H01L23/13 , H01L23/15 , H01L23/315 , H01L23/3677 , H01L23/4334 , H01L23/49506 , H01L23/49531 , H01L23/49822 , H01L23/50 , H01L23/562 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15192 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19015 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.
摘要翻译： 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。
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5.发明申请Semiconductor device having metallic lead and electronic device having lead frame 审中-公开具有金属引线和具有引线框的电子器件的半导体器件公开(公告)号：US20070075419A1
公开(公告)日：2007-04-05
申请号：US11515045
申请日：2006-09-05
申请人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Yukihiro Maeda , Norihisa Imaizumi , Yasutomi Asai , Yasutomi Asai
发明人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Yukihiro Maeda , Norihisa Imaizumi , Yasutomi Asai , Yasutomi Asai
IPC分类号： H01L23/34
CPC分类号： H01L23/49575 , H01L23/49531 , H01L23/49537 , H01L23/49568 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L25/162 , H01L2224/05553 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48599 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes: first to fourth vertical type semiconductor elements having first and second electrodes; a metallic lead; a resin mold; a circuit board; an electric circuit on the circuit board; and an electronic chip on the circuit board. The electronic chip drives and controls each semiconductor element through the electric circuit. The first to fourth semiconductor elements are arranged to be a stack construction in the resin mold. The first to fourth semiconductor elements provide a H-bridge circuit. Each of the first and second electrodes in each semiconductor element is directly connected to the metallic lead so that heat generated in the semiconductor element is radiated through the metallic lead.
摘要翻译： 半导体器件包括：具有第一和第二电极的第一至第四垂直型半导体元件; 金属铅; 树脂模具; 电路板; 电路板上的电路; 和电路板上的电子芯片。 电子芯片通过电路驱动和控制每个半导体元件。 第一至第四半导体元件被布置为树脂模具中的堆叠结构。 第一至第四半导体元件提供H桥电路。 每个半导体元件中的每个第一和第二电极直接连接到金属引线，使得半导体元件中产生的热量通过金属引线辐射。
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公开(公告)号：US20050231925A1
公开(公告)日：2005-10-20
申请号：US11105548
申请日：2005-04-14
申请人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
发明人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
IPC分类号： H01F7/18 , H01L21/56 , H01L23/36 , H01L23/433 , H01L23/488 , H01L23/495 , H01L25/04 , H05K1/02 , H05K1/03 , H05K1/14 , H05K3/28 , H05K7/02
CPC分类号： H05K1/142 , H01L21/565 , H01L23/4334 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/2076 , H01L2924/3011 , H01L2924/351 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K2201/10924 , H05K2203/049 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
摘要翻译： 电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器 以及设置在散热器的一侧的第一布线板和第二布线板。 第二电元件中的大电流大于第一电元件中的大电流。 第一布线板和第二布线板彼此分离。 第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。
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公开(公告)号：US20050151229A1
公开(公告)日：2005-07-14
申请号：US11034139
申请日：2005-01-13
IPC分类号： H01L25/00 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/16 , H01L29/06
CPC分类号： H01L25/0652 , H01L23/49531 , H01L23/49568 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/117 , H05K1/144 , H05K1/145 , H05K3/284 , H05K3/3405 , H05K2201/09845 , H05K2201/1034 , H05K2201/10924 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
摘要翻译： 电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一凹槽和第二凹槽。 第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。 引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。
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8.发明授权Oscillating rotary swing actuator with rotary solenoid and projecting fixed yoke 有权具有旋转电磁铁和突出固定磁轭的摆动式旋转驱动器公开(公告)号：US09473007B2
公开(公告)日：2016-10-18
申请号：US13988921
申请日：2012-02-14
摘要： A rotary solenoid includes a swing yoke to which two magnets are fixed and a fixed yoke including projection portions at opposite sides thereof. An electromagnetic coil including a major magnetic pole is arranged at a center of the fixed yoke. The rotary solenoid is arranged to define a magnetic circuit extending through one of the magnets, the major magnetic pole, the fixed yoke, the projection portion, and the other magnet at a shortest distance.
摘要翻译： 旋转螺线管包括固定有两个磁体的摆动轭和在其相对侧具有突出部的固定轭。 包括主磁极的电磁线圈布置在固定磁轭的中心。 旋转螺线管被配置成以最短的距离限定延伸穿过磁体之一，主磁极，固定磁轭，突出部分和另一个磁体的磁路。
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公开(公告)号：US07843700B2
公开(公告)日：2010-11-30
申请号：US11105548
申请日：2005-04-14
申请人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi
发明人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi
CPC分类号： H05K1/142 , H01L21/565 , H01L23/4334 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/2076 , H01L2924/3011 , H01L2924/351 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K2201/10924 , H05K2203/049 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
摘要翻译： 电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器 以及设置在散热器的一侧的第一布线板和第二布线板。 第二电元件中的大电流大于第一电元件中的大电流。 第一布线板和第二布线板彼此分离。 第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。
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公开(公告)号：US07612434B2
公开(公告)日：2009-11-03
申请号：US11976503
申请日：2007-10-25
IPC分类号： H01L23/495 , H01L23/02
CPC分类号： H01L25/0652 , H01L23/49531 , H01L23/49568 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/117 , H05K1/144 , H05K1/145 , H05K3/284 , H05K3/3405 , H05K2201/09845 , H05K2201/1034 , H05K2201/10924 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
摘要翻译： 电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一槽和第二槽。 第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。 引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。
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